Granted Patent B2

US 12,478,997 · App. 17/924,644 · Granted Nov 25, 2025

Inventors: Yuji Okita (Kyoto, JP); Hideji Naohara (Kyoto, JP); Hiroaki Kakuma (Kyoto, JP); Tatsuya Masui (Kyoto, JP); Yuichi Deba (Kyoto, JP)

Assignee: SCREEN Holdings Co., Ltd.

B05B12/084B05B13/02B08B3/02

Abstract

Claims (38)

1 . A substrate processing method, comprising:

carrying a substrate into an inside of a chamber and holding said substrate;

supplying a fluid to said substrate on the inside of said chamber;

sequentially imaging the inside of said chamber by a camera to acquire image data;

specifying a monitoring target based on a procedure of process regarding said substrate and changing an image condition of said image data based on said monitoring target that has been specified; and

performing a monitoring process on said monitoring target based on said image data having said image condition corresponding to said monitoring target, wherein

said image condition includes at least one of resolution and a frame rate of said image data and a size of a visual field range projected in said image data.

2 . The substrate processing method according to claim 1 , wherein

in changing the image condition,

said frame rate is set to a first frame rate as said image condition of said image data in a first period when at least one of a shape and a position of an object in said chamber is taken as said monitoring target, and

said frame rate is set to a second frame rate higher than said first frame rate as said image condition of said image data in a second period when a state change over time in a processing liquid ejected as said fluid from a nozzle in said chamber is taken as said monitoring target.

3 . The substrate processing method according to claim 2 , wherein

in changing the image condition, said frame rate is set to said second frame rate as said image condition of said image data in a third period when at least one of a shape and a position of an object in said chamber and a state change over time in said processing liquid are taken as said monitoring target.

4 . The substrate processing method according to claim 1 , wherein

said resolution is set to a first resolution as said image condition of said image data in a first period when at least one of a shape and a position of an object in said chamber is taken as said monitoring target, and

said resolution is set to a second resolution lower than said first resolution as said image condition of said image data in a second period when a state change over time in a processing liquid ejected as said fluid from a nozzle in said chamber is taken as said monitoring target.

5 . The substrate processing method according to claim 4 , wherein

in changing the image condition, said resolution is set to said first resolution as said image condition of said image data in a third period when at least one of a shape and a position of an object in said chamber and a state change over time in said processing liquid are taken as said monitoring target.

6 . The substrate processing method according to claim 2 , wherein

said monitoring target including at least one of the shape and the position of said object includes at least one of: at least one of a shape and a position of said substrate; at least one of a shape and a position of said nozzle; and at least one of a shape and a position of a processing cup that receives said fluid scattered from a periphery of said substrate.

7 . The substrate processing method according to claim 2 , wherein

said monitoring target including the state change over time in said processing liquid includes at least one of an ejection start timing and an ejection stop timing of said processing liquid, a liquid splash of said processing liquid on said substrate, and dripping and outflow of said processing liquid from said nozzle.

8 . The substrate processing method according to claim 1 , wherein

in changing the image condition,

said frame rate is set to a first frame rate as said image condition of said image data in a fourth period when occurrence or non-occurrence of a first abnormality occurring in a first occurrence period in said chamber is taken as said monitoring target, and

said frame rate is set to a second frame rate higher than said first frame rate as said image condition of said image data in a fifth period when occurrence or non-occurrence of a second abnormality occurring in a second occurrence period shorter than said first occurrence period in said chamber is taken as said monitoring target.

9 . The substrate processing method according to claim 1 , wherein

changing the image condition includes a step of setting said image condition as an imaging condition, and

in imaging the inside of said chamber, said camera acquires said image data using said image condition corresponding to said monitoring target as an imaging condition.

10 . The substrate processing method according to claim 1 , wherein

in imaging the inside of said chamber, said camera acquires said image data under a predetermined imaging condition, and

image processing is performed on said image data acquired by said camera to acquire said image data having said image condition corresponding to said monitoring target.

11 . A substrate processing apparatus, comprising:

a substrate holder that holds a substrate on an inside of a chamber;

a nozzle that supplies a fluid to said substrate on the inside of said chamber;

a camera that sequentially images the inside of said chamber to acquire image data; and

a controller that specifies a monitoring target based on a procedure of process regarding said substrate, changes an image condition of said image data based on said monitoring target that has been specified, and performs a monitoring process on said monitoring target based on said image data having said image condition corresponding to said monitoring target, wherein

said image condition includes at least one of resolution and a frame rate of said image data and a size of a visual field range projected in said image data.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (59)