Multilayer electronic component
A multilayer electronic component includes a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion, facing each other in the first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and external electrodes disposed on the third and fourth surfaces. The internal electrodes and the dielectric layers protrude more outwardly than the cover portion in the second direction, and a groove is disposed at an end of the dielectric layer in the second direction.
1. A multilayer electronic component comprising:
a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion facing each other in the first direction, the body having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and
external electrodes disposed on the third and fourth surfaces,
wherein on at least one of the third and fourth surfaces, the internal electrodes and the dielectric layers of the capacitance formation portion protrude more outwardly than the cover portion in the second direction, and
a groove is disposed at an end of one of the dielectric layers in the second direction.
2. The multilayer electronic component of claim 1 , wherein when a protruding size of the internal electrodes with respect to the cover portion measured in a center of the body in the first direction is L 1 , and a protruding size of the internal electrodes disposed at an outermost part of the body in the first direction with respect to the cover portion is L 2 , L 1 /L 2 is 1.2 or more.
3. The multilayer electronic component of claim 2 , wherein when a size of the internal electrodes in the second direction measured in the center of the body in the first direction is L 1 ′, 0.001≤L 1 /L 1 ′≤0.1 is satisfied.
4. The multilayer electronic component of claim 1 , wherein at least a portion of the external electrode is disposed within the groove.
5. The multilayer electronic component of claim 4 , wherein the groove has a convex curved surface toward the dielectric layer.
6. The multilayer electronic component of claim 1 , wherein the internal electrodes include first internal electrodes and second internal electrodes,
wherein one ends of the first internal electrodes are connected to the third surface, and one ends of the second internal electrodes are connected to the fourth surface, and
the external electrode includes a first external electrode disposed on the third surface and connected to the first internal electrodes and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.
7. The multilayer electronic component of claim 6 , wherein a line connecting the one ends of the first internal electrodes has a shape convex toward the first external electrode, and
a line connecting the one ends of the second internal electrodes has a shape convex toward the second external electrode.
8. The multilayer electronic component of claim 6 , wherein the groove includes first grooves disposed on the third surface and second grooves disposed on the fourth surface,
in the first and second grooves, one first groove is disposed between two adjacent ones of the first internal electrodes in the first direction, and
one second groove is disposed between two adjacent ones of the second internal electrodes in the first direction.
9. The multilayer electronic component of claim 1 , wherein when an average thickness of the dielectric layers is td and a maximum size of the groove in the second direction is L 3 , L 3 ≤td is satisfied.
10. The multilayer electronic component of claim 9 , wherein td≤1 μm is satisfied.
11. The multilayer electronic component of claim 1 , wherein when an average thickness of the internal electrodes is te, te≤0.3 μm is satisfied.
12. The multilayer electronic component of claim 1 , wherein when an average thickness of the internal electrodes is te and a standard deviation of thicknesses of the internal electrodes is σte, ote/te is 0.05 or less.
13. The multilayer electronic component of claim 1 , wherein the internal electrodes are sputtering layers.
14. A multilayer electronic component comprising:
a body including a capacitance formation portion including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and a cover portion disposed on both end surfaces of the capacitance formation portion facing each other in the first direction, the body having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and
first and second external electrodes respectively disposed on the third and fourth surfaces and respectively connected to the first and second internal electrodes,
wherein on the third surface, the first internal electrodes protrude more outwardly than the cover portion in the second direction, and on the fourth surface, the second internal electrodes protrude more outwardly than the cover portion in the second direction, and
a surface in contact with the first external electrode and the dielectric layer and a surface in contact with the second external electrode and the dielectric layer are curved surfaces.
15. The multilayer electronic component of claim 14 , wherein the surface in contact with the first external electrode and the dielectric layer is a curved surface convex toward the dielectric layer, and
the surface in contact with the second external electrode and the dielectric layer is a curved surface convex toward the dielectric layer.
16. The multilayer electronic component of claim 14 , wherein one ends of the first internal electrodes are connected to the third surface, and one ends of the second internal electrodes are connected to the fourth surface, and
a line connecting the one ends of the first internal electrodes has a convex shape toward the first external electrode, and a line connecting the one ends of the second internal electrodes has a convex shape toward the second external electrode.
17. The multilayer electronic component of claim 14 , wherein when an average thickness of the first internal electrodes or the second internal electrodes is te and a standard deviation of a thickness of the first internal electrode or the second internal electrodes is σte, σte/te is 0.05 or less.
18. The multilayer electronic component of claim 14 , wherein the first internal electrodes or the second internal electrodes are sputtering layers.
19. A multilayer electronic component comprising:
a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion facing each other in the first direction; and
external electrodes disposed on outer surfaces of the capacitance formation portion and outer surfaces of the cover portion, opposing each other in a second direction orthogonal to the first direction, and respectively connected to the internal electrodes,
wherein, in the second direction, ends of the internal electrodes of the capacitance formation portion protrude from the respective outer surfaces of the cover portion, and
the ends of the internal electrodes disposed in a center region of the capacitance formation portion in the first direction protrude more outwardly than the ends of the internal electrodes disposed in an outer region of the capacitance formation portion in the first direction.
20. The multilayer electronic component of claim 19 , wherein, in the second direction, ends of the dielectric layers of the capacitance formation portion protrude from the respective outer surfaces of the cover portion.
21. The multilayer electronic component of claim 20 , wherein the ends of the dielectric layers disposed in the center region of the capacitance formation portion protrude more outwardly than the ends of the dielectric layers disposed in the outer region of the capacitance formation portion.
22. The multilayer electronic component of claim 19 , wherein an end of one of the dielectric layers includes a recess having a curved surface.