Systems and methods for cooling system and power module for inverter for electric vehicle
A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.
1. A base for an electrical component, the base comprising:
a body, the body defining:
a rim,
pin slots, and
first engagement slots;
contact terminals; and
electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body;
wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.
2. The base of claim 1 , wherein the first engagement slots are configured to receive prongs secured to the one or more power modules and secure the one or more power modules to the substrate.
3. The base of claim 1 , wherein the body further defines first and second apertures configured to receive first and second fittings of a heatsink.
4. The base of claim 1 , further comprising:
fasteners configured to secure the base to the substrate,
wherein the body defines apertures within the rim configured to receive the fasteners.
5. The base of claim 1 ,
wherein the body further defines second engagement slots, and
wherein the first engagement slots are configured to receive first prongs and the second engagement slots are configured to receive second prongs different from the first prongs.
6. The base of claim 1 , wherein the base is configured to provide the electrical connection with one or more of the contact terminals or respective pin terminals of the electrical connectors.
7. The base of claim 6 , wherein one or more of the contact terminals is configured to be electrically connected to a terminal of the one or more power modules.
8. The base of claim 6 , wherein the pin terminals are configured to be electrically connected to signal pins of the one or more power modules.
9. The base of claim 1 , wherein each electrical connector includes a connection pin that extends from a respective pin terminal and is disposed in a pin slot corresponding to the electrical connector.
10. The base of claim 9 ,
wherein each pin slot is configured to receive a tab of a respective connection pin disposed in the pin slot, and
wherein the tab is configured to limit movement of a respective electrical connector toward the first surface.
11. The base of claim 9 , wherein connection pins of the electrical connectors extend from respective pin slots through a second surface of the base.
12. The base of claim 9 ,
wherein the body defines protrusions extending from the first surface, and
wherein the protrusions define pin grooves configured to receive respective pin terminals of the electrical connectors.
13. The base of claim 9 ,
wherein the body defines pin grooves on the first surface, and
wherein each pin groove is configured to receive a pin terminal of an electrical connector and a signal pin of the one or more power modules.
14. An electrical component comprising:
a cooling system;
a plurality of power modules integrated into the cooling system; and
a base including:
a body defining a rim and a recessed wall surrounded by the rim, contact terminals, and
electrical connectors including terminal and pin components, the electrical connectors extending through the rim;
wherein the body accommodates a portion of the cooling system within the recessed wall and is configured to extend between the cooling system and a substrate, and
wherein the base is configured to provide electrical connections between the plurality of power modules and the substrate.
15. The electrical component of claim 14 ,
wherein each electrical connector includes a pin terminal and a connection pin disposed in a pin slot,
wherein each pin terminal is positioned on a first surface of the body facing the cooling system and each connection pin extends through a second surface of the body configured to face the substrate.
16. The electrical component of claim 14 ,
wherein each electrical connector includes a pin terminal positioned on a surface of the rim,
wherein each contact terminal is positioned next to one or more electrical connectors,
wherein signal pins of the plurality power modules are electrically connected to pin terminals of the electrical connectors, and
wherein terminals of the plurality of power modules are electrically connected to the contact terminals of the base.
17. The electrical component of claim 14 ,
wherein the cooling system includes a first heatsink and a second heatsink,
wherein the plurality of power modules are positioned between the first heatsink and the second heatsink.
18. The electrical component of claim 14 , wherein the cooling system includes one or more active cooling heatsinks.
19. The electrical component of claim 18 ,
wherein the body of the base further defines first and second apertures in the recessed wall,
wherein the first aperture accommodates a first fluid connection to an inlet of the active cooling heatsink and the second aperture accommodates a second fluid connection to an outlet of the active cooling heatsink.
20. A subassembly for an electrical component comprising:
a first heatsink;
a second heatsink;
a plurality of power modules positioned between the first heatsink and the second heatsink; and
a base including:
a body, the body defining:
a rim,
a recessed wall surrounded by the rim,
pin slots, and
first engagement slots;
contact terminals; and
electrical connectors including terminal and pin components, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body;
wherein one or more of the contact terminals or the electrical connectors is configured to provide electrical connections between the plurality of power modules and a substrate, and
wherein the first heatsink is positioned within the recessed wall of the base.