Systems and methods for power module for inverter for electric vehicle
A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.
1. A power module, comprising:
a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end;
a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate;
a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate;
a first electrically conductive spacer coupled to the inner surface of the first substrate and to the inner surface of the second substrate; and
a flex circuit coupled to the power switch.
2. The power module of claim 1 , wherein the first substrate further includes a middle layer between the inner surface and the outer surface, wherein the middle layer includes a ceramic, and the outer surface and the inner surface of the first substrate include a metal.
3. The power module of claim 1 , wherein the electrically conductive spacer is coupled to a first part of the inner surface of the second substrate, and the power switch is coupled to a second part of the inner surface of the second substrate, wherein the first part and the second part are not directly coupled to one another.
4. The power module of claim 3 , further including a second electrically conductive spacer coupled to the inner surface of the second substrate and to the inner surface of the first substrate.
5. The power module of claim 1 , wherein the semiconductor die includes silicon carbide.
6. The power module of claim 1 , wherein the second substrate further includes a middle layer between the inner surface and the outer surface, wherein the middle layer includes a ceramic, and the outer surface and the inner surface of the second substrate include a metal.
7. The power module of claim 1 , wherein a source connection of the power switch is coplanar with the connection.
8. The power module of claim 1 , wherein the power switch includes a drain, wherein the drain is coupled to the inner surface of the first substrate.
9. The power module of claim 1 , wherein the power switch includes a source, wherein the source is coupled to the inner surface of the second substrate.
10. The power module of claim 1 , wherein the flex circuit includes an insulating material and an electrically-conductive material, wherein the inner surface of the second substrate is electrically insulated from the electrically conductive material of the flex circuit.
11. The power module of claim 1 , wherein the power switch includes a gate, wherein electrical connections to the gate are contained only within the flex circuit.
12. The power module of claim 1 , wherein the power switch includes a gate, wherein electrical connections to the gate, within the power module, are contained solely within the flex circuit.
13. The power module of claim 1 , wherein the power switch includes a gate, wherein electrical connections to the gate, within the power module, do not extend through any part of the second substrate.
14. The power module of claim 1 , further including:
a first connection;
a second connection, wherein the power switch includes a first gate terminal, the power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and
a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.
15. An inverter comprising the power module of claim 1 .
16. A vehicle comprising the inverter of claim 15 .
17. A power module, comprising:
a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end;
a power switch including a semiconductor die coupled to the inner surface of the first substrate, wherein the semiconductor die includes silicon carbide;
a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate;
a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate;
a flex circuit coupled to the semiconductor die;
a first connection;
a second connection, wherein the power switch includes a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and
a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.
18. An inverter, comprising the power module of claim 17 .
19. A vehicle, comprising the inverter of claim 18 .
20. A power module, comprising:
a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end;
a power switch including a semiconductor die coupled to the inner surface of the first substrate, wherein the semiconductor die includes silicon carbide;
a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate;
a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate;
a flex circuit coupled to the semiconductor die;
a first connection;
a second connection, wherein the power switch includes a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal, wherein electrical connections to the first gate terminal, within the power module, do not extend through any part of the second substrate; and
a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.