3D DRAM memory devices and structures with control circuits
A semiconductor device, the device including: a first level including a plurality of first memory arrays, where the first level includes a plurality of first transistors and a plurality of metal layers; a second level disposed on top of the first level, where the second level includes a plurality of second memory arrays, where the first level is bonded to the second level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, where the plurality of first memory arrays includes a plurality of first DRAM (Dynamic Random Access Memory) cells, and where the plurality of second memory arrays includes a plurality of second DRAM (Dynamic Random Access Memory) cells.
1. A semiconductor device, the device comprising:
a first level comprising a plurality of first memory arrays,
wherein said first level comprises a plurality of first transistors and a plurality of metal layers;
a second level disposed on top of said first level,
wherein said second level comprises a plurality of second memory arrays,
wherein said first level is bonded to said second level,
wherein said bonded comprises oxide to oxide bonding regions and a plurality of metal to metal bonding regions,
wherein said plurality of first memory arrays comprises a plurality of first DRAM (Dynamic Random Access Memory) cells, and
wherein said plurality of second memory arrays comprises a plurality of second DRAM (Dynamic Random Access Memory) cells.
2. The device according to claim 1 ,
wherein said second level comprises a single crystal silicon layer having a thickness of less than 30 microns and greater than 0.1 microns.
3. The device according to claim 1 ,
wherein said second level comprises at least one redundancy memory array.
4. The device according to claim 1 , further comprising:
a third level,
wherein said third level comprises control circuits providing control access to said plurality of first memory arrays.
5. The device according to claim 1 , further comprising:
a third level,
wherein said third level comprises control circuits providing control access to said plurality of first memory arrays, and
wherein said third level comprises control circuits providing control access to said plurality of second memory arrays.
6. The device according to claim 1 ,
wherein said plurality of first memory arrays comprise at least four sub-arrays, and
wherein each of said at least four sub-arrays comprises independent control line access.
7. The device according to claim 1 ,
wherein said plurality of first memory arrays comprises a plurality of word-lines (“WL”), and
wherein at least one of said plurality of word-lines is directly connected to at least one of said plurality metal to metal bonding regions.
8. A semiconductor device, the device comprising:
a first level comprising a plurality of first memory arrays,
wherein said first level comprises a plurality of first transistors and a plurality of metal layers;
a second level disposed on top of said first level,
wherein said second level comprises a plurality of second memory arrays,
wherein said first level is bonded to said second level,
wherein said bonded comprises oxide to oxide bonding regions and a plurality of metal to metal bonding regions,
wherein said plurality of first memory arrays comprises a plurality of first DRAM (Dynamic Random Access Memory) cells,
wherein said plurality of second memory arrays comprises a plurality of second DRAM (Dynamic Random Access Memory) cells; and
a third level,
wherein said third level comprises control circuits providing control access to said first memory arrays.
9. The device according to claim 8 ,
wherein said memory level comprises a single crystal silicon layer having a thickness of less than 30 microns and greater than 0.1 microns.
10. The device according to claim 8 ,
wherein said first level comprises at least one redundancy memory array.
11. The device according to claim 8 ,
wherein said third level comprises a plurality of differential sense amplifier circuits.
12. The device according to claim 8 ,
wherein said control circuits provide control access to said plurality of second memory arrays.
13. The device according to claim 8 ,
wherein said plurality of first memory arrays comprises at least four sub-arrays, and
wherein each of said at least four sub-arrays comprises independent control line access.
14. The device according to claim 8 ,
wherein said plurality of first memory arrays comprises a plurality of word-lines (“WL”), and
wherein at least one of said plurality of word-lines is directly connected to at least one of said plurality of metal to metal bonding regions.
15. A semiconductor device, the device comprising:
a first level comprising a plurality of first memory arrays,
wherein said first level comprises a plurality of first transistors and a plurality of metal layers;
a second level disposed on top of said first level,
wherein said second level comprises a plurality of second memory arrays,
wherein said first level is bonded to said second level,
wherein said bonded comprises oxide to oxide bonding regions and a plurality of metal to metal bonding regions,
wherein said first memory arrays comprise a plurality of first DRAM (Dynamic Random Access Memory) cells,
wherein said second memory arrays comprise a plurality of second DRAM (Dynamic Random Access Memory) cells; and
a third level,
wherein said third level comprises control circuits providing control access to said plurality of first memory arrays, and
wherein said control circuits providing control access to said plurality of second memory arrays.
16. The device according to claim 15 ,
wherein said second level comprises a single crystal silicon layer having a thickness of less than 30 microns and greater than 0.1 microns.
17. The device according to claim 15 ,
wherein said second level comprises at least one redundancy memory array.
18. The device according to claim 15 ,
wherein said third level comprises a plurality of differential sense amplifier circuits.
19. The device according to claim 15 ,
wherein said plurality of first memory arrays comprises at least four sub-arrays, and
wherein each of said at least four sub-arrays comprises independent control line access.
20. The device according to claim 15 ,
wherein said plurality of first memory arrays comprises a plurality of word-lines (“WL”), and
wherein at least one of said plurality of word-lines is directly connected to at least one of said plurality metal to metal bonding regions.