IP Library Granted Patent US 12,249,392
Granted Patent B2
US 12,249,392 · App. 18/388,680 · Granted Mar 11, 2025

Memory controller with staggered request signal output

Inventors: Ian P. Shaeffer (Los Gatos, CA); Bret Stott (Menlo Park, CA); Benedict C. Lau (San Jose, CA)
Assignee: Rambus Inc.
G11C7/1063G06F12/00G06F13/1689G11C7/1072
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,249,392
App. No.
18/388,680
Granted
Mar 11, 2025
Kind
B2
Abstract

A memory controller includes a register to store phase offset value. The phase offset value represents a phase relationship between a memory request signal component and a reference signal. The phase offset value is established through write and read back testing. Transmit circuitry applies the phase offset value in launching the memory request signal component from the IC memory controller to an IC memory device.

Claims (57)

1. An integrated circuit (IC) memory chip, comprising:

a clock receiver circuit to receive a clock signal;

a request signal interface to receive a memory access request using the clock signal, the memory access request including a chip select signal; and

circuitry to transmit, during a calibration mode, feedback to determine a phase offset between the chip select signal and the clock signal.

2. The IC memory chip according to claim 1 , wherein:

the circuitry to transmit includes a data driver to transmit the feedback along a data path from the IC memory chip to a logic IC chip during the calibration mode.

3. The IC memory chip according to claim 2 , wherein:

the request signal interface is to receive, during the calibration mode, a calibration memory access request including a calibration phase offset between calibration signals of the calibration memory access request; and

the feedback includes calibration read data associated with the calibration phase offset between the calibration signals of the calibration memory access request.

4. The IC memory chip according to claim 3 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

5. The IC memory chip according to claim 1 , wherein the request signal interface includes:

a command receiver circuit to receive a command signal component of the memory access request from a command signal path;

an address receiver circuit to receive an address signal component of the memory access request from an address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command signal path and the address signal path.

6. The IC memory chip according to claim 1 , wherein the request signal interface includes:

a command/address receiver circuit to receive command and address signal components of the memory access request from a command/address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

7. The IC memory chip according to claim 1 , wherein:

the determined phase offset is between the chip select signal and a command component signal of the memory access request as-launched from a logic IC chip.

8. An IC memory device, comprising:

receiver circuitry to receive a clock signal and a memory access request using the clock signal, the memory access request including a chip select signal; and

transmit circuitry to transmit, during a calibration mode, data used to determine a phase offset between component signals of the memory access request.

9. The IC memory device according to claim 8 , wherein:

the transmit circuitry includes a data driver to transmit the data along a data path from the IC memory device to a logic IC chip during the calibration mode.

10. The IC memory device according to claim 9 , wherein:

the receiver circuitry is to receive, during the calibration mode, a calibration memory access request including a calibration phase offset between calibration signals of the calibration memory access request; and

the data includes calibration read data associated with the calibration phase offset between the calibration signals of the calibration memory access request.

11. The IC memory device according to claim 10 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

12. The IC memory device according to claim 8 , wherein the receiver circuitry further includes:

a command receiver circuit to receive a command signal component of the memory access request from a command signal path;

an address receiver circuit to receive an address signal component of the memory access request from an address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path.

13. The IC memory device according to claim 8 , wherein the receiver circuitry further includes:

a command/address receiver circuit to receive command and address signal components of the memory access request from a command/address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

14. The IC memory device according to claim 8 , wherein:

the determined phase offset is between the chip select signal and a command component signal of the memory access request as-launched from a logic IC chip.

15. A method of operation in an integrated circuit (IC) memory device, comprising:

receiving a clock signal;

receiving a memory access request using the clock signal, the memory access request including a chip select signal; and

transmitting, during a calibration mode, data to determine a phase offset between the chip select signal and the clock signal.

16. The method according to claim 15 , wherein:

the transmitting includes transmitting the data along a data path from the IC memory device to a logic IC chip during the calibration mode.

17. The method according to claim 16 , further comprising:

receiving, during the calibration mode, a calibration memory access request including a calibration phase offset between calibration signals of the calibration memory access request; and

wherein the data includes calibration read data associated with the calibration phase offset between the calibration signals of the calibration memory access request.

18. The method according to claim 17 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

19. The method according to claim 15 , wherein the receiving of the memory access request includes:

receiving a command signal component of the memory access request from a command signal path;

receiving an address signal component of the memory access request from an address signal path; and

receiving the chip select signal as a control signal component of the memory access request from a control signal path.

20. The method according to claim 15 , wherein the receiving of the memory access request includes:

receiving command and address signal components of the memory access request from a command/address signal path; and

receiving the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2025
From: RAMBUS INC.
To: SIGNAL LLP
Reel/Frame 073085/0650 →
Continuity (13)
Continuation 17705039 · Mar 25, 2022
Continuation 16953207 · Nov 19, 2020
Continuation 16805529 · Feb 28, 2020
Continuation 16109607 · Aug 22, 2018
Continuation 15626097 · Jun 17, 2017
Continuation 14863366 · Sep 23, 2015
Continuation 14153822 · Jan 13, 2014
Continuation 13720720 · Dec 19, 2012
Continuation 13336851 · Dec 23, 2011
Continuation 12477703 · Jun 3, 2009
Continuation 11768107 · Jun 25, 2007
Division 11252957 · Oct 17, 2005
Related Publication 20240177747A1 · May 30, 2024
References Cited (51)
US 5432823A · Gasbarro et al. · 1995 [cited by applicant]
US 6016282A · Keeth · 2000 [cited by applicant]
US 6029250A · Keeth · 2000 [cited by applicant]
US 6031787A · Jeddeloh · 2000 [cited by applicant]
US 6232806B1 · Woeste et al. · 2001 [cited by applicant]
US 6424198B1 · Wolford · 2002 [cited by applicant]
US 6449727B1 · Toda · 2002 [cited by applicant]
US 6600681B1 · Korger et al. · 2003 [cited by applicant]
US 6646929B1 · Moss et al. · 2003 [cited by applicant]
US 6646953B1 · Stark · 2003 [cited by applicant]
US 6675272B2 · Ware et al. · 2004 [cited by applicant]
US 6920540B2 · Hampel et al. · 2005 [cited by applicant]
US 6950956B2 · Zerbe et al. · 2005 [cited by applicant]
US 6982922B2 · Stark · 2006 [cited by applicant]
US 6990042B2 · Stark · 2006 [cited by applicant]
US 7042914B2 · Zerbe et al. · 2006 [cited by applicant]
US 7177998B2 · Ware et al. · 2007 [cited by applicant]
US 7200055B2 · Ware et al. · 2007 [cited by applicant]
US 7210016B2 · Ware et al. · 2007 [cited by applicant]
US 7225292B2 · Ware et al. · 2007 [cited by applicant]
US 7225311B2 · Ware et al. · 2007 [cited by applicant]
US 7289383B2 · Cornelius · 2007 [cited by applicant]
US 7321524B2 · Shaeffer · 2008 [cited by examiner]
US 7441138B2 · Chu et al. · 2008 [cited by applicant]
US 7466784B2 · Sidiropoulos · 2008 [cited by applicant]
US 7548601B2 · Sidiropoulos · 2009 [cited by applicant]
US 7552267B2 · Randell et al. · 2009 [cited by applicant]
US 7558150B2 · Shaeffer · 2009 [cited by examiner]
US 7734866B2 · Tsern · 2010 [cited by applicant]
US 7961532B2 · Ware · 2011 [cited by applicant]
US 8089824B2 · Shaeffer · 2012 [cited by examiner]
US 8222923B1 · Shimanek et al. · 2012 [cited by applicant]
US 8339878B2 · Shaeffer · 2012 [cited by examiner]
US 8411521B2 · LaBerge · 2013 [cited by applicant]
US 8638637B2 · Shaeffer · 2014 [cited by examiner]
US 8793525B2 · Zerbe et al. · 2014 [cited by applicant]
US 8824222B2 · Ware et al. · 2014 [cited by applicant]
US 8984250B2 · Kuan et al. · 2015 [cited by applicant]
US 9001598B2 · Hwang · 2015 [cited by applicant]
US 9007853B2 · Ware · 2015 [cited by applicant]
US 9165617B2 · Shaeffer · 2015 [cited by examiner]
US 9691447B2 · Shaeffer · 2017 [cited by examiner]
US 10062421B2 · Shaeffer · 2018 [cited by examiner]
US 10593379B2 · Shaeffer · 2020 [cited by examiner]
US 10902891B2 · Shaeffer · 2021 [cited by examiner]
US 11302368B2 · Shaeffer · 2022 [cited by examiner]
US 11830573B2 · Shaeffer · 2023 [cited by examiner]
US 20050057292A1 · Sidiropoulos · 2005 [cited by applicant]
US 20120290800A1 · Krishnan · 2012 [cited by examiner]
US 20130013878A1 · Frans · 2013 [cited by examiner]
Micron Technical Note, “DDR2-533 Memory Design Guide for Two-DIMM Unbuffered Systems,” TN-47-01, 2003. 19 pages. [cited by applicant]