IP Library › Granted Patent US 12,228,609
Granted Patent B2
US 12,228,609 · App. 18/488,619 · Granted Feb 18, 2025

Electronics tester

Inventors: Gaylord Lewis Erickson, II (San Jose, CA); Jovan Jovanovic (Santa Clara, CA)
Assignee: AEHR TEST SYSTEMS
G01R31/2889
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,228,609
App. No.
18/488,619
Granted
Feb 18, 2025
Kind
B2
Abstract

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus to facilitate movement of a wafer pack holding a vacuum without human oversight. These functionalities include a latch system to keep the wafer pack intact and a pressure sensing system to detect and relay a pressure in the wafer pack.

Claims (78)

1. A microelectronic circuit testing pack, comprising:

a portable supporting structure including first and second components for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit;

a plurality of contacts on the second component, the contacts matching the terminals for making contact to the terminals;

a pressure differential cavity seal between the first and second components, the pressure differential cavity seal forming an enclosed pressure differential cavity together with surfaces of the first and second components;

a pressure reduction passage formed through one of the first and second components, the pressure reduction passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity;

a pressure reduction valve connected to the pressure reduction passage, opening of the pressure reduction valve allowing air out of the pressure differential cavity to move the first and second components relatively towards one another for ensuring proper contact between the contacts and the terminals, and closing of the pressure reduction valve keeping air from entering the pressure differential cavity;

a first interface, on the portable supporting structure and connected to the contacts, for connection to a second interface on a stationary structure when the portable supporting structure is removably held by the stationary structure;

a pressure sensor positioned to detect a pressure in the pressure differential cavity; and

an electrical pressure sensor interface connected to the pressure sensor to communicate the pressure with an electric tester.

2. The microelectronic circuit testing pack of claim 1 , wherein the pressure sensor is positioned distant from the pressure differential cavity and a pressure sensing passage connects the pressure differential cavity with the pressure sensor.

3. The microelectronic circuit testing pack of claim 2 , wherein the pressure reduction passage is formed in the first component.

4. The microelectronic circuit testing pack of claim 3 , wherein the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, wherein the pressure sensing passage is formed in the backing plate.

5. The microelectronic circuit testing pack of claim 4 , wherein the pressure sensing passage is formed through the signal distribution board.

6. The microelectronic circuit testing pack of claim 1 , wherein the pressure sensor is secured to the portable supporting structure.

7. The microelectronic circuit testing pack of claim 1 , wherein the pressure differential cavity seal is secured to the first component when the first and second components are apart.

8. The microelectronic circuit testing pack of claim 1 , wherein the pressure differential cavity seal is a lip seal.

9. The microelectronic circuit testing pack of claim 1 , wherein the pressure reduction valve is a pressure reduction check valve, a vacuum release passage being formed through a component having the pressure reduction check valve, the vacuum release passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, further comprising:

a second valve, being a vacuum release valve connected to the vacuum release passage, opening of the vacuum release valve allowing air into the pressure differential cavity and closing of the vacuum release valve keeping air from escaping out of the pressure differential cavity.

10. The microelectronic circuit testing pack of claim 1 , wherein the substrate is a wafer with a plurality of microelectronic circuits.

11. The microelectronic circuit testing pack of claim 1 , wherein the contacts are pins, each pin having a spring that is depressed against a spring force thereof when the respective contact is depressed by a respective one of the terminals.

12. A tester apparatus, comprising:

a portable supporting structure including first and second components for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit;

a plurality of contacts on the second component, the contacts matching the terminals for making contact to the terminals;

a pressure differential cavity seal between the first and second components, the pressure differential cavity seal forming an enclosed pressure differential cavity together with surfaces of the first and second components;

a pressure reduction passage formed through one of the first and second components, the pressure reduction passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity;

a pressure reduction valve connected to the pressure reduction passage, opening of the pressure reduction valve allowing air out of the pressure differential cavity to move the first and second components relatively towards one another for ensuring proper contact between the contacts and the terminals, and closing of the pressure reduction valve keeping air from entering the pressure differential cavity;

a first interface on the portable supporting structure and connected to the contacts;

a stationary structure, the portable supporting structure being receivable to be held by the stationary structure and being removable from the stationary structure;

a second interface on the stationary structure, the second interface being connected to the first interface when the portable supporting structure is held by the stationary structure, and being disconnected from the first interface when the portable supporting structure is removed from the stationary structure;

an electrical tester connected through the second interface, the first interface, and the contacts to the terminals so that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit; and

a pressure monitoring system that includes:

a pressure sensor positioned to detect a pressure in the pressure differential cavity; and

an electrical pressure sensor interface connected to the pressure sensor to communicate the pressure with an electric tester.

13. The tester apparatus of claim 12 , wherein the pressure sensor is positioned distant from the pressure differential cavity and a pressure sensing passage connects the pressure differential cavity with the pressure sensor.

14. The tester apparatus of claim 13 , wherein the pressure reduction passage is formed in the first component.

15. The tester apparatus of claim 14 , wherein the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, wherein the pressure sensing passage is formed in the backing plate.

16. The tester apparatus of claim 15 , wherein the pressure sensing passage is formed through the signal distribution board.

17. The tester apparatus of claim 12 , wherein the pressure sensor is secured to the portable supporting structure.

18. The tester apparatus of claim 12 , wherein the pressure monitoring system includes:

an electrical pressure connector interface on the stationary structure, the electrical pressure sensor interface releasably making contact with the electrical pressure connector interface to communicate the pressure with the electric tester.

19. The tester apparatus of claim 18 , wherein the electrical pressure sensor interface includes at least a first contact and the pressure monitoring system includes at least a first terminal, wherein the first contact engages with the first terminal when the portable supporting structure is received by the stationary structure and the first contact disengages from the first terminal when the portable supporting structure is removed from the stationary structure.

20. The tester apparatus of claim 19 , wherein the electrical pressure sensor interface is in a printed circuit board having a substrate and the first contact is formed on the substrate.

21. The tester apparatus of claim 19 , wherein the electrical pressure sensor interface includes at least a second contact and the pressure monitoring system includes at least a second terminal, wherein the second contact engages with the second terminal when the portable supporting structure is received by the stationary structure and the second contact disengages from the second terminal when the portable supporting structure is removed from the stationary structure.

22. The tester apparatus of claim 12 , wherein the pressure differential cavity seal surrounds the contacts and the terminals.

23. The tester apparatus of claim 12 , wherein the pressure differential cavity seal is secured to the first component when the first and second components are apart.

24. The tester apparatus of claim 12 , wherein the pressure differential cavity seal is a lip seal.

25. The tester apparatus of claim 12 , wherein the pressure reduction valve is a pressure reduction check valve, a vacuum release passage being formed through a component having the pressure reduction check valve, the vacuum release passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, further comprising:

a second valve, being a vacuum release valve connected to the vacuum release passage, opening of the vacuum release valve allowing air into the pressure differential cavity and closing of the vacuum release valve keeping air from escaping out of the pressure differential cavity.

26. The tester apparatus of claim 12 wherein the stationary structure includes a thermal chuck, the second component of the portable supporting structure including a thin chuck contacting the thermal chuck to allow for transfer of heat between the portable supporting structure and the thermal chuck.

27. The tester apparatus of claim 12 wherein the substrate is a wafer with a plurality of microelectronic circuits.

28. The tester apparatus of claim 12 wherein the contacts are pins, each pin having a spring that is depressed against a spring force thereof when the respective contact is depressed by a respective one of the terminals.

29. A method of testing a microelectronic circuit held by a substrate, comprising:

holding the substrate between first and second components of a portable supporting structure, the second component having contacts against terminals of the substrate connected to the microelectronic circuit, wherein a pressure reduction passage is formed through one of the first and second components, the pressure reduction passage having an inlet opening at a pressure differential cavity and an outlet opening outside the pressure differential cavity;

locating a pressure differential cavity seal between the first and second components to form an enclosed cavity by surfaces of the first and second components and the pressure differential cavity seal;

opening a pressure reduction valve to allow air out of the pressure differential cavity and reducing a pressure within the pressure differential cavity to move the first and second components relatively towards one another to ensure proper contact between the contacts and the terminals;

closing the pressure reduction valve, keeping air from entering the pressure differential cavity;

receiving the portable supporting structure by a stationary structure with a first interface on the portable supporting structure connected to a second interface on the stationary structure;

transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contacts, and first and second interfaces to test the microelectronic circuit;

detecting a pressure in the pressure differential cavity of a pressure monitoring system; and

communicating the pressure with an electric tester.

30. The method of claim 29 wherein the pressure sensor is positioned distant from the pressure differential cavity and a pressure sensing passage connects the pressure differential cavity with the pressure sensor.

31. The method of claim 30 wherein the pressure reduction passage is formed in the first component.

32. The method of claim 31 , wherein the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, wherein the pressure sensing passage is formed in the backing plate.

33. The method of claim 32 , wherein the pressure sensing passage is formed through the signal distribution board.

34. The method of claim 29 , wherein the pressure sensor is secured to the portable supporting structure.

35. The method of claim 29 , wherein the pressure monitoring system includes:

an electrical pressure connector interface on the stationary structure, the electrical pressure sensor interface releasably making contact with the electrical pressure connector interface to communicate the pressure with the electric tester.

36. The method of claim 35 , wherein the electrical pressure sensor interface includes at least a first contact and the pressure monitoring system includes at least a first terminal, wherein the first contact engages with the first terminal when the portable supporting structure is received by the stationary structure and the first contact disengages from the first terminal when the portable supporting structure is removed from the stationary structure.

37. The method of claim 36 , wherein the electrical pressure sensor interface is in a printed circuit board having a substrate and the first contact is formed on the substrate.

38. The method of claim 36 , wherein the electrical pressure sensor interface includes at least a second contact and the pressure monitoring system includes at least a second terminal, wherein the second contact engages with the second terminal when the portable supporting structure is received by the stationary structure and the second contact disengages from the second terminal when the portable supporting structure is removed from the stationary structure.

39. The method of claim 33 , wherein the pressure differential cavity seal surrounds the contacts and the terminals.

40. The method of claim 34 , wherein the pressure differential cavity seal is secured to the first component when the first and second components are apart.

41. The method of claim 29 , wherein the pressure differential cavity seal is created with a lip seal.

42. The method of claim 29 , wherein the pressure reduction valve is a pressure reduction check valve, a vacuum release passage being formed through a component having the pressure reduction check valve, the vacuum release passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, further comprising:

opening a second valve, being a vacuum release valve connected to the vacuum release passage, to allow air into the pressure differential cavity.

43. The method of claim 29 , wherein the stationary structure includes a thermal chuck, the second component of the portable supporting structure including a thin chuck.

44. The method of claim 29 , wherein the substrate is a wafer with a plurality of microelectronic circuits.

45. The method of claim 29 , wherein the contacts are pins, each pin having a spring that is depressed against a spring force thereof when the respective contact is depressed by a respective one of the terminals.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2024
From: ERICKSON, GAYLORD LEWIS, II; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 068679/0790 →
Continuity (3)
Division 17493847 · Oct 5, 2021
Provisional Application 63088635 · Oct 7, 2020
Related Publication 20240044971A1 · Feb 8, 2024
References Cited (350)
US 3149897A · Martineck · 1964 [cited by applicant]
US 3413613A · Bahrs · 1968 [cited by applicant]
US 3482201A · Schneck · 1969 [cited by applicant]
US 4240021A · Kashima et al. · 1980 [cited by applicant]
US 4298237A · Griffith et al. · 1981 [cited by applicant]
US 4400049A · Schuck · 1983 [cited by applicant]
US 4473798A · Cedrone et al. · 1984 [cited by applicant]
US 4477170A · Yamada et al. · 1984 [cited by applicant]
US 4517512A · Petrich et al. · 1985 [cited by applicant]
US 4582386A · Martens · 1986 [cited by applicant]
US 4591217A · Reimer · 1986 [cited by applicant]
US 4608679A · Rudy et al. · 1986 [cited by applicant]
US 4719411A · Buehler · 1988 [cited by applicant]
US 4814573A · Check et al. · 1989 [cited by applicant]
US 4816754A · Buechele et al. · 1989 [cited by applicant]
US 4968931A · Littlebury et al. · 1990 [cited by applicant]
US 4981449A · Buchter · 1991 [cited by applicant]
US 4995814A · Weidler · 1991 [cited by applicant]
US 5008615A · Littlebury · 1991 [cited by applicant]
US 5034688A · Moulene et al. · 1991 [cited by applicant]
US 5086269A · Nobi · 1992 [cited by applicant]
US 5108302A · Pfaff · 1992 [cited by applicant]
US 5247521A · Akao et al. · 1993 [cited by applicant]
US 5461326A · Woith et al. · 1995 [cited by applicant]
US 5467024A · Swapp · 1995 [cited by applicant]
US 5515126A · Baxter et al. · 1996 [cited by applicant]
US 5517126A · Yamaguchi · 1996 [cited by applicant]
US 5534785A · Yoshizaki et al. · 1996 [cited by applicant]
US 5550466A · Botka · 1996 [cited by applicant]
US 5559446A · Sano · 1996 [cited by applicant]
US 5666288A · Jones et al. · 1997 [cited by applicant]
US 5773986A · Thompson et al. · 1998 [cited by applicant]
US 5808896A · Weber · 1998 [cited by applicant]
US 5821440A · Khater et al. · 1998 [cited by applicant]
US 5851143A · Hamid · 1998 [cited by applicant]
US 5886535A · Budnaitis · 1999 [cited by applicant]
US 5894225A · Coffin · 1999 [cited by applicant]
US 5928036A · Thrush · 1999 [cited by applicant]
US 5945834A · Nakata et al. · 1999 [cited by applicant]
US 5973285A · Dietrich et al. · 1999 [cited by applicant]
US 5982183A · Sano · 1999 [cited by applicant]
US 6005401A · Nakata et al. · 1999 [cited by applicant]
US 6023173A · Khater et al. · 2000 [cited by applicant]
US 6040700A · Berar · 2000 [cited by applicant]
US 6057696A · Orso et al. · 2000 [cited by applicant]
US 6084215A · Furuya et al. · 2000 [cited by applicant]
US 6084419A · Sato et al. · 2000 [cited by applicant]
US 6091060A · Getchel et al. · 2000 [cited by applicant]
US 6094059A · Frankeny et al. · 2000 [cited by applicant]
US 6094060A · Frankeny et al. · 2000 [cited by applicant]
US 6124725A · Sato · 2000 [cited by applicant]
US 6135699A · Yutaka et al. · 2000 [cited by applicant]
US 6137303A · Deckert et al. · 2000 [cited by applicant]
US 6203582B1 · Berner · 2001 [cited by applicant]
US 6244874B1 · Tan · 2001 [cited by applicant]
US 6255834B1 · Smith · 2001 [cited by applicant]
US 6268740B1 · Iida · 2001 [cited by applicant]
US 6318243B1 · Jones · 2001 [cited by applicant]
US 6339321B1 · Yamashita et al. · 2002 [cited by applicant]
US 6340895B1 · Uher et al. · 2002 [cited by applicant]
US 6358061B1 · Regnier · 2002 [cited by applicant]
US 6381283B1 · Bhardwaj et al. · 2002 [cited by applicant]
US 6384613B1 · Cheng · 2002 [cited by applicant]
US 6421754B1 · Kau et al. · 2002 [cited by applicant]
US 6509751B1 · Mathieu et al. · 2003 [cited by applicant]
US 6515497B1 · Matsuzawa · 2003 [cited by applicant]
US 6535824B1 · Mansky et al. · 2003 [cited by applicant]
US 6593763B2 · Weber · 2003 [cited by applicant]
US 6625557B1 · Perkins et al. · 2003 [cited by applicant]
US 6628520B2 · Patel et al. · 2003 [cited by applicant]
US 6644982B1 · Ondricek et al. · 2003 [cited by applicant]
US 6744269B1 · Johnson et al. · 2004 [cited by applicant]
US 6853209B1 · Jovanovic · 2005 [cited by applicant]
US 6867608B2 · Richmond et al. · 2005 [cited by applicant]
US 6876321B1 · Slutzky et al. · 2005 [cited by applicant]
US 6888343B1 · Holt et al. · 2005 [cited by applicant]
US 6994563B2 · Amini et al. · 2006 [cited by applicant]
US 7053644B1 · Lindsey et al. · 2006 [cited by applicant]
US 7108517B2 · Harper · 2006 [cited by applicant]
US 7137849B2 · Nagata · 2006 [cited by applicant]
US 7260303B2 · Bench et al. · 2007 [cited by applicant]
US 7332918B2 · Sugiyama et al. · 2008 [cited by applicant]
US 7382142B2 · Chong et al. · 2008 [cited by applicant]
US 7453260B2 · Boyle et al. · 2008 [cited by applicant]
US 7480129B2 · Brown et al. · 2009 [cited by applicant]
US 7762822B2 · Richmond, II · 2010 [cited by applicant]
US 7800382B2 · Lindsey et al. · 2010 [cited by applicant]
US 7826995B2 · Maenner · 2010 [cited by applicant]
US 7969175B2 · Hendrickson et al. · 2011 [cited by applicant]
US 8030957B2 · Lindsey et al. · 2011 [cited by applicant]
US 8035406B2 · Mueller · 2011 [cited by applicant]
US 8057263B1 · Howard et al. · 2011 [cited by applicant]
US 8118618B2 · Richmond, II et al. · 2012 [cited by applicant]
US 8228085B2 · Lindsey et al. · 2012 [cited by applicant]
US 8299935B2 · Kiyokawa et al. · 2012 [cited by applicant]
US 8388357B2 · Richmond, II et al. · 2013 [cited by applicant]
US 8444107B2 · Akouka et al. · 2013 [cited by applicant]
US 8462471B2 · Huang et al. · 2013 [cited by applicant]
US 8465327B2 · Springer et al. · 2013 [cited by applicant]
US 8506335B2 · Richmond et al. · 2013 [cited by applicant]
US 8628336B2 · Richmond, II · 2014 [cited by applicant]
US 8947116B2 · Lindsey et al. · 2015 [cited by applicant]
US 8974116B2 · Okamoto et al. · 2015 [cited by applicant]
US 9250291B2 · Lindsey et al. · 2016 [cited by applicant]
US 9316683B2 · Richmond, II · 2016 [cited by applicant]
US 9625521B2 · Lindsey et al. · 2017 [cited by applicant]
US 9880197B2 · Lindsey et al. · 2018 [cited by applicant]
US 10269678B1 · Viswanathan et al. · 2019 [cited by applicant]
US 10297339B2 · Thordarson et al. · 2019 [cited by applicant]
US 10401385B2 · Lindsey et al. · 2019 [cited by applicant]
US 11112429B2 · Lindsey et al. · 2021 [cited by applicant]
US 11255903B2 · Richmond, II et al. · 2022 [cited by applicant]
US 11488695B2 · Lindsey et al. · 2022 [cited by applicant]
US 11592465B2 · Lindsey et al. · 2023 [cited by applicant]
US 11835575B2 · Erickson, II · 2023 [cited by examiner]
US 20010012726A1 · O'Neal et al. · 2001 [cited by applicant]
US 20010032663A1 · Pelrine · 2001 [cited by applicant]
US 20020003432A1 · Leas et al. · 2002 [cited by applicant]
US 20020030502A1 · Uher · 2002 [cited by examiner]
US 20020032896A1 · Fukuda et al. · 2002 [cited by applicant]
US 20020036342A1 · Koide · 2002 [cited by applicant]
US 20020048826A1 · Richmond et al. · 2002 [cited by applicant]
US 20020050402A1 · Japp et al. · 2002 [cited by applicant]
US 20020066726A1 · Cole, Sr. et al. · 2002 [cited by applicant]
US 20020067180A1 · Jaimsomporn et al. · 2002 [cited by applicant]
US 20020106927A1 · Bosy et al. · 2002 [cited by applicant]
US 20020139169A1 · Lueth, II et al. · 2002 [cited by applicant]
US 20020144213A1 · Ramaswamy et al. · 2002 [cited by applicant]
US 20030020459A1 · Lambert · 2003 [cited by applicant]
US 20030057130A1 · Fix et al. · 2003 [cited by applicant]
US 20030077932A1 · Lewinnek · 2003 [cited by applicant]
US 20030115037A1 · Sumida · 2003 [cited by applicant]
US 20030122550A1 · Kanamaru et al. · 2003 [cited by applicant]
US 20030137317A1 · Kim et al. · 2003 [cited by applicant]
US 20030237061A1 · Miller et al. · 2003 [cited by applicant]
US 20040113640A1 · Cooper et al. · 2004 [cited by applicant]
US 20040113645A1 · Richmond, II et al. · 2004 [cited by applicant]
US 20040113646A1 · Yamashita · 2004 [cited by applicant]
US 20040124829A1 · Swettlen et al. · 2004 [cited by applicant]
US 20040183561A1 · Takekoshi et al. · 2004 [cited by applicant]
US 20040212382A1 · Cram · 2004 [cited by applicant]
US 20040217772A1 · Kline · 2004 [cited by applicant]
US 20040223309A1 · Haemer · 2004 [cited by applicant]
US 20050007137A1 · Gunn et al. · 2005 [cited by applicant]
US 20050042932A1 · Mok et al. · 2005 [cited by applicant]
US 20050077281A1 · Hamilton et al. · 2005 [cited by applicant]
US 20050093561A1 · Watanabe et al. · 2005 [cited by applicant]
US 20050103034A1 · Hamilton · 2005 [cited by examiner]
US 20050111944A1 · Aho et al. · 2005 [cited by applicant]
US 20050125712A1 · Co et al. · 2005 [cited by applicant]
US 20060091212A1 · Chein et al. · 2006 [cited by applicant]
US 20060125502A1 · Lindsey et al. · 2006 [cited by applicant]
US 20060132159A1 · Tamaishi · 2006 [cited by applicant]
US 20060139042A1 · Kasukabe · 2006 [cited by applicant]
US 20060170435A1 · Granicher et al. · 2006 [cited by applicant]
US 20060186904A1 · Natsuhara et al. · 2006 [cited by applicant]
US 20060198211A1 · Frankowsky · 2006 [cited by applicant]
US 20060263925A1 · Chandler · 2006 [cited by applicant]
US 20070001790A1 · Richmond, II et al. · 2007 [cited by applicant]
US 20070018681A1 · Sartschev · 2007 [cited by applicant]
US 20070028834A1 · Awazu et al. · 2007 [cited by applicant]
US 20070029979A1 · Williams et al. · 2007 [cited by applicant]
US 20070107656A1 · Shinozaki et al. · 2007 [cited by applicant]
US 20070273216A1 · Farbarik · 2007 [cited by applicant]
US 20070296422A1 · Miller · 2007 [cited by applicant]
US 20080022695A1 · Welle · 2008 [cited by applicant]
US 20080048688A1 · Mathieu et al. · 2008 [cited by applicant]
US 20080079451A1 · Maenner · 2008 [cited by applicant]
US 20080124951A1 · Cox et al. · 2008 [cited by applicant]
US 20080150125A1 · Braunisch et al. · 2008 [cited by applicant]
US 20080186046A1 · Yun et al. · 2008 [cited by applicant]
US 20080224723A1 · Washio et al. · 2008 [cited by applicant]
US 20090015282A1 · Steps · 2009 [cited by examiner]
US 20090143923A1 · Breed · 2009 [cited by applicant]
US 20090160468A1 · Lindsey · 2009 [cited by examiner]
US 20090212803A1 · Yamamoto et al. · 2009 [cited by applicant]
US 20090237102A1 · Lou et al. · 2009 [cited by applicant]
US 20100063637A1 · Crowell et al. · 2010 [cited by applicant]
US 20100141288A1 · Di Lello · 2010 [cited by applicant]
US 20100175866A1 · Tani et al. · 2010 [cited by applicant]
US 20100213957A1 · Richmond et al. · 2010 [cited by applicant]
US 20100213960A1 · Mok et al. · 2010 [cited by applicant]
US 20100244866A1 · Lindsey et al. · 2010 [cited by applicant]
US 20110006800A1 · Lindsey et al. · 2011 [cited by applicant]
US 20110248737A1 · Takeshita et al. · 2011 [cited by applicant]
US 20110271159A1 · Ahn et al. · 2011 [cited by applicant]
US 20110273831A1 · Kyle · 2011 [cited by applicant]
US 20110298630A1 · Kiyokawa et al. · 2011 [cited by applicant]
US 20110316577A1 · Lindsey et al. · 2011 [cited by applicant]
US 20120043984A1 · Yashar et al. · 2012 [cited by applicant]
US 20120075807A1 · Refai-Ahmed et al. · 2012 [cited by applicant]
US 20120136614A1 · Liu et al. · 2012 [cited by applicant]
US 20120142210A1 · Di Stefano · 2012 [cited by applicant]
US 20120229159A1 · Kim et al. · 2012 [cited by applicant]
US 20120280704A1 · Lindsey et al. · 2012 [cited by applicant]
US 20130055184A1 · Shroff · 2013 [cited by applicant]
US 20130224891A1 · Takizawa · 2013 [cited by applicant]
US 20130304412A1 · Richmond, II et al. · 2013 [cited by applicant]
US 20130342236A1 · Song et al. · 2013 [cited by applicant]
US 20140125371A1 · Chung et al. · 2014 [cited by applicant]
US 20140232424A1 · Richmond, II et al. · 2014 [cited by applicant]
US 20150109011A1 · Lindsey et al. · 2015 [cited by applicant]
US 20150137842A1 · Murakami et al. · 2015 [cited by applicant]
US 20150204942A1 · Scocchetti · 2015 [cited by applicant]
US 20150260793A1 · Chen · 2015 [cited by applicant]
US 20150309114A1 · Barabi et al. · 2015 [cited by applicant]
US 20160103179A1 · Lindsey et al. · 2016 [cited by applicant]
US 20170134587A1 · Lawson et al. · 2017 [cited by applicant]
US 20170358515A1 · Murdock · 2017 [cited by applicant]
US 20180080981A1 · Steps et al. · 2018 [cited by applicant]
US 20180182599A1 · Stowell et al. · 2018 [cited by applicant]
US 20190019711A1 · Tamura · 2019 [cited by applicant]
US 20190339303A1 · Lindsey et al. · 2019 [cited by applicant]
US 20200033404A1 · Hyakudomi et al. · 2020 [cited by applicant]
US 20200300908A1 · Steps et al. · 2020 [cited by applicant]
US 20200411410A1 · Klein et al. · 2020 [cited by applicant]
US 20220107358A1 · Erickson, II et al. · 2022 [cited by applicant]
US 20220137121A1 · Richmond, II et al. · 2022 [cited by applicant]
CN 1482660A · 2004 [cited by applicant]
CN 100348982C · 2007 [cited by applicant]
CN 101084447A · 2007 [cited by applicant]
CN 101137947A · 2008 [cited by applicant]
CN 101675350A · 2010 [cited by applicant]
CN 101750558A · 2010 [cited by applicant]
CN 101952733A · 2011 [cited by applicant]
CN 104865414A · 2015 [cited by applicant]
CN 110383092B · 2022 [cited by applicant]
DE 3914669A1 · 1989 [cited by applicant]
DE 197818226 · 2004 [cited by applicant]
EP 0320660A2 · 1989 [cited by applicant]
EP 0639777A1 · 1994 [cited by applicant]
EP 2772768A1 · 2014 [cited by applicant]
GB 2285348A · 1995 [cited by applicant]
JP 61065319 · 1986 [cited by applicant]
JP 02071540A · 1990 [cited by applicant]
JP H06186283A · 1994 [cited by applicant]
JP H06347477A · 1994 [cited by applicant]
JP 08005666A · 1996 [cited by applicant]
JP H07169806A · 1996 [cited by applicant]
JP 08340030A · 1996 [cited by applicant]
JP 09115971 · 1997 [cited by applicant]
JP 10116867A · 1998 [cited by applicant]
JP 10256325A · 1998 [cited by applicant]
JP 1999121569A · 1999 [cited by applicant]
JP H11121550A · 1999 [cited by applicant]
JP 11145216A · 1999 [cited by applicant]
JP 11145234A · 1999 [cited by applicant]
JP H11145225A · 1999 [cited by applicant]
JP H11284037A · 1999 [cited by applicant]
JP 2001203244A · 2001 [cited by applicant]
JP 200243381A · 2002 [cited by applicant]
JP 200290426A · 2002 [cited by applicant]
JP 2002151558A · 2002 [cited by applicant]
JP 2003139816A · 2003 [cited by applicant]
JP 2004228313A · 2004 [cited by applicant]
JP 2005516226A · 2005 [cited by applicant]
JP 2005265786A · 2005 [cited by applicant]
JP 200698064A · 2006 [cited by applicant]
JP 2006184044A · 2006 [cited by applicant]
JP 2007024702A · 2007 [cited by applicant]
JP 2008166306A · 2008 [cited by applicant]
JP 2008232667A · 2008 [cited by applicant]
JP 2008541415A · 2008 [cited by applicant]
JP 2010066091A · 2010 [cited by applicant]
JP 5528617B1 · 2014 [cited by applicant]
JP 2015103552A · 2015 [cited by applicant]
JP 2016014614A · 2016 [cited by applicant]
JP 6538808A1 · 2019 [cited by applicant]
JP H11121549A · 2024 [cited by applicant]
KR 1019940032588 · 1994 [cited by applicant]
KR 1020050024395 · 2005 [cited by applicant]
KR 1020080011213 · 2008 [cited by applicant]
KR 1020120063576 · 2012 [cited by applicant]
SU 1247600A · 1986 [cited by applicant]
TW 201632888A · 2003 [cited by applicant]
TW I225156B · 2004 [cited by applicant]
TW 200521443 · 2005 [cited by applicant]
TW 200523562A · 2005 [cited by applicant]
TW 200627573A · 2006 [cited by applicant]
TW 200706888A · 2007 [cited by applicant]
TW 200710412A · 2007 [cited by applicant]
TW I276815B · 2007 [cited by applicant]
TW 200831932A · 2008 [cited by applicant]
TW 201115164A1 · 2011 [cited by applicant]
TW 201140105A1 · 2011 [cited by applicant]
WO 9502196A1 · 1995 [cited by applicant]
WO 0104641A2 · 2001 [cited by applicant]
WO 2001004641A2 · 2001 [cited by applicant]
WO 2003065064A2 · 2003 [cited by applicant]
WO 2004003581A1 · 2004 [cited by applicant]
WO 2004008163 · 2004 [cited by applicant]
WO 2004095571A1 · 2004 [cited by applicant]
WO 2006009061 · 2006 [cited by applicant]
WO 2006038257A1 · 2006 [cited by applicant]
WO 2006096361A2 · 2006 [cited by applicant]
WO 2006113708A3 · 2006 [cited by applicant]
WO 2006116767A1 · 2006 [cited by applicant]
WO 2007010610A1 · 2007 [cited by applicant]
WO 2008124068A1 · 2008 [cited by applicant]
WO 2017210108A1 · 2017 [cited by applicant]
“Extended European Search Report issued on Dec. 7, 2020”, European Patent Application No. 18761604.0, (9 pages). [cited by applicant]
“First Office Action mailed on Aug. 17, 2020 with English translation”, Japanese Patent Application No. 2019-106294, (4 pages). [cited by applicant]
“First Office Action mailed on Dec. 14, 2022”, R.O.C. Patent Application No. 111137536, (4 pages). [cited by applicant]
“First Office Action mailed on Dec. 27, 2022 with English translation”, Japanese Patent Application No. 2021-197754, (4 pages). [cited by applicant]
“First Office Action mailed on Feb. 7, 2022 with English Translation”, Japanese Patent Application No. 2019-548053, (6 pages). [cited by applicant]
“First Office Action mailed on Jul. 10, 2020 with English translation”, Chinese Patent Application No. 201780011541.6, (68 pages). [cited by applicant]
“First Office Action mailed on Jul. 21, 2021 with English translation”, Chinese Patent Application No. 201880015746.6, (20 pages). [cited by applicant]
“First Office Action mailed on Jun. 15, 2022 with English translation”, Korean Patent Application No. 10-2019-7028508, (10 pages). [cited by applicant]
“First Office Action mailed on Mar. 9, 2022 with English translation”, R.O.C. Patent Application No. 110115369, (12 pages). [cited by applicant]
“First Office Action mailed on Nov. 12, 2020 with English translation”, Japanese Patent Application No. 2018-535825, (7 pages). [cited by applicant]
“First Office Action mailed on Sep. 28, 2021 with English translation”, R.O.C Patent Application No. 107107096, (11 pages). [cited by applicant]
“International Search Report and Written Opinion”, International Patent Application No. PCT/US2021/053445 , Feb. 14, 2022 , (14 pages). [cited by applicant]
“International Search Report and Written Opinion dated Jan. 14, 2016”, International PCT Application No. PCT/US15/56429 with International Filing Date of Oct. 20, 2015, (11 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Jun. 25, 2018”, International PCT Patent Application No. PCT/US2018/019934, (15 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Mar. 30, 2017”, International PCT Application No. PCT/US2017/012597 with International Filing Date of Jan. 6, 2017, (11 pages). [cited by applicant]
“Invitation to Pay Additional Fees mailed on Apr. 12, 2018”, International PCT Patent Application No. PCT/US2018/019934, (3 pages). [cited by applicant]
“Japanese Office Action—mailed on Jul. 18, 2017 (with English translation)”, Japanese Patent Application No. 2016-184497, (9 pages). [cited by applicant]
“Non Final Office Action mailed on Apr. 9, 2021”, United States U.S. Appl. No. 16/576,555, (17 pages). [cited by applicant]
“Non Final Office Action mailed on Aug. 19, 2020”, U.S. Appl. No. 16/899,246, (13 pages). [cited by applicant]
“Non Final Office Action mailed on Dec. 11, 2019”, U.S. Appl. No. 16/172,249, (11 pages). [cited by applicant]
“Non Final Office Action mailed on Feb. 9, 2018”, U.S. Appl. No. 15/823,290, (7 pages). [cited by applicant]
“Non Final Office Action mailed on Jun. 29, 2021”, U.S. Appl. No. 16/831,485, (14 pages). [cited by applicant]
“Non Final Office Action mailed on Sep. 20, 2022”, U.S. Appl. No. 17/253,646, (8 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 18, 2023”, U.S. Appl. No. 18/176,965, (10 pages). [cited by applicant]
“Notice of Grounds for Rejection mailed on Jun. 15, 2017 (with English Translation)”, Korean Patent Application No. 10-2017-7004733, (14 pages). [cited by applicant]
“Notice of Reasons for Rejection mailed Oct. 15, 2018 with English translation”, Japanese Patent Application No. 2017-228718, (6 pages). [cited by applicant]
“Office Action mailed on Apr. 13, 2023 with English translation”, Japanese Patent Application No. 2022 045659, (3 pages). [cited by applicant]
“Office Action mailed on Feb. 27, 2020 with English Translation”, R.O.C. Patent Application No. 106100392, (3 pages). [cited by applicant]
“Official Notification mailed on Sep. 6, 2021 with English translation”, Japanese Patent Application No. 2020-197424, (6 pages). [cited by applicant]
“Search Report and Written Opinion”, Singapore Patent Application No. 10202108629Y mailed on Feb. 24, 2022, (9 pages). [cited by applicant]
“Second Office Action mailed on Aug. 23, 2021 with English Translation”, Japanese Patent Application No. 2018-535825, (5 pages). [cited by applicant]
“Second Office Action mailed on May 23, 2023”, R.O.C. Patent Application No. 111137536, (8 pages). [cited by applicant]
“Extended European Search Report issued on Jan. 31, 2024”, European Patent Application No. 23205767.9, (9 pages). [cited by applicant]
“First Office Action mailed Dec. 19, 2023 with English translation”, Japanese Patent Application No. 2022-168114, (12 pages). [cited by applicant]
“First Office Action mailed Mar. 26, 2024 with English translation”, Chinese Patent Application No. 202210265243.2, (7 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 17, 2024”, U.S. Appl. No. 18/523,604, (8 pages). [cited by applicant]
“Office Action and Search Report mailed on Mar. 12, 2024”, Singapore Patent Application No. 11202302449Y, (11 pages). [cited by applicant]
“Office Action mailed on Apr. 21, 2024 with English translation”, Korean Patent Application No. 10-2018-7022771, (24 Pages). [cited by applicant]
“Office Action mailed on Oct. 26, 2023 with English translation”, Korean Patent Application No. 10-2023-7003482, (17 pages). [cited by applicant]
“Extended European Search Report mailed on Sep. 30, 2024”, European Patent Application No. 21878311.6, (9 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Aug. 2, 2024”, International PCT Patent Application No. PCT/US2023/086080, (15 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 30, 2024”, U.S. Appl. No. 18/485,716, (10 pages). [cited by applicant]
“Office Action mailed on Aug. 6, 2024”, Japanese Patent Application No. 2023-131868, (7 pages). [cited by applicant]
“Second Office Action mailed on Aug. 29, 2024 with English translation”, Chinese Patent Application No. 202210265243.2, (22 pages). [cited by applicant]
“Non Final Office Action mailed on Nov. 22, 2024”, U.S. Appl. No. 17/813,298, (23 pages). [cited by applicant]
“Notice of Allowance mailed on Nov. 22, 2024”, U.S. Appl. No. 18/825,962, (9 pages). [cited by applicant]
“Non Final Office Action mailed on Nov. 29, 2024”, U.S. Appl. No. 18/825,970, (15 pages). [cited by applicant]
“Notification of Acceptance of Request for Invalidation with English Translation mailed on Nov. 15, 2022”, Chinese Patent Application No. 201310159573.4, (147 pages). [cited by applicant]
“Office Action mailed on Nov. 7, 2024 with English translation”, Japanese Patent Application No. 2023-521543, (9 pages). [cited by applicant]
Ivy, W.L , et al., “Sacrificial Metal Wafer Level Burn-In KGD”, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070). May 21-24, 2000, (6 pages). [cited by applicant]