IP Library Granted Patent US 12,292,484
Granted Patent B2
US 12,292,484 · App. 18/825,970 · Granted May 6, 2025

Method and system for thermal control of devices in an electronics tester

Inventors: Jovan Jovanovic (Santa Clara, CA); Kenneth W. Deboe (Santa Clara, CA); Steven C. Steps (Saratoga, CA)
Assignee: AEHR TEST SYSTEMS
G01R31/50G01R1/0491G01R31/003G01R31/2831G01R31/2875H01L21/324H01L21/67103H01L21/67109H01L21/67248H01L21/68785H01L22/26
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Quick Facts
Patent No.
US 12,292,484
App. No.
18/825,970
Granted
May 6, 2025
Kind
B2
Abstract

A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.

Claims (65)

1. A tester apparatus, comprising:

a frame;

a plurality of doors mounted to the frame, wherein each door is movable between a respective closed position that disallows movement of a respective substrate, having a microelectronic circuit and substrate terminals connected to the respective microelectronic circuit, into or out of the frame, and a respective open position that allows movement of a respective substrate into or out of the frame;

an electrical tester;

a portable cartridge that includes:

a portable cartridge body including first and second components for holding the substrate therebetween;

a plurality of portable cartridge contacts on the second component, the portable cartridge contacts matching the substrate terminals for making contact to the substrate terminals of the substrate connected to a microelectronic circuit; and

a first electrical interface on the portable cartridge body and connected to the portable cartridge contacts, wherein the portable cartridge body is receivable when a first door of the doors is in the respective open position to be held by the frame and being removable from the frame when the first door is in the respective open position; and

a second electrical interface on the frame, the second electrical interface being connected to the first electrical interface when the portable cartridge is held by the frame, and being disconnected from the first electrical interface when the portable cartridge body is removed from the frame, wherein

the electrical tester is connected through the second electrical interface, the first electrical interface, and the portable cartridge contacts to the substrate terminals so that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

2. The tester apparatus of claim 1 , further comprising:

a plurality of slot assemblies in the frame, each slot assembly including:

a slot assembly body;

a first slot assembly interface located on the slot assembly body and connected to the electrical tester; and

a hinge attached to the slot assembly body, wherein

a respective one of the doors is attached to the slot assembly body by the hinge, the respective door being movable between the respective open position wherein the respective substrate is insertable into the respective slot assembly and the respective closed position wherein the door forms part of a sealed wall.

3. The tester apparatus of claim 2 , wherein each slot assembly is separately inserted into the frame.

4. The tester apparatus of claim 3 , further comprising:

a front seal between a first of the slot assemblies and a second of the slot assemblies, the front seal forming part of the sealed wall.

5. The tester apparatus of claim 2 , wherein each slot assembly includes a respective temperature modification device, which, when operated changes temperature to cause a temperature differential between the temperature modification device and the substrate and a transfer of heat between the temperature modification device and the substrate to modify a temperature of the substrate.

6. The tester apparatus of claim 5 , wherein the temperature modification device is a resistive heating pad.

7. The tester apparatus of claim 5 , wherein the temperature modification device includes:

a thermal chuck having an oil passage through which oil is movable.

8. The tester apparatus of claim 7 , further comprising:

an oil actuator that moves the oil through the oil passage.

9. The tester apparatus of claim 7 , further comprising:

a heater that is mounted in a position to heat the oil.

10. The tester apparatus of claim 1 , wherein the portable cartridge is a first portable cartridge, further comprising:

a second portable cartridge that includes:

a portable cartridge body including first and second components for holding a respective substrate therebetween;

a plurality of portable cartridge contacts on the second component, the portable cartridge contacts matching the substrate terminals for making contact to the substrate terminals of the substrate connected to a microelectronic circuit; and

a third electrical interface on the portable cartridge body and connected to the portable cartridge contacts, wherein the portable cartridge body is receivable when a second door of the doors is in the respective open position to be held by the frame and being removable from the frame when the second door is in the respective open position; and

a fourth electrical interface on the frame, the fourth electrical interface being connected to the third electrical interface when the portable cartridge is held by the frame, and being disconnected from the third electrical interface when the portable cartridge body is removed from the frame, wherein

the electrical tester is connected through the forth electrical interface, the third electrical interface, and the portable cartridge contacts to the substrate terminals so that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

11. A method of testing a microelectronic circuit held by a substrate, comprising:

moving each one of a plurality of doors mounted to a frame between a respective closed position that disallows movement of a respective substrate, having a microelectronic circuit and substrate terminals connected to the microelectronic circuit, into or out of the frame, and a respective open position that allows movement of a respective substrate into or out of the frame;

holding a substrate between first and second components of a portable cartridge body forming part of a portable cartridge, the second component having cartridge contacts against the substrate terminals of the substrate;

inserting each respective substrate into the frame, including receiving the portable cartridge by the frame when a first door of the doors is in the respective open position with a first electrical interface on the portable cartridge body connected to a second electrical interface on the frame;

moving each door between the respective open position and the respective closed position;

connecting an electrical tester to the respective substrate terminals;

transmitting signals between the electrical tester and the microelectronic circuit through the substrate terminals, cartridge contacts, and first and second electrical interfaces to test the microelectronic circuit;

moving each door between the respective closed position and the respective open position; and

removing the respective substrate from the frame, including removing the portable cartridge from the frame when the first door is in the respective open position with the first electrical interface on the portable cartridge body disconnected from the second electrical interface on the frame.

12. The method of claim 11 , further comprising:

making an electric connection between a first slot assembly interface located on each of a plurality of slot assembly bodies and the electrical tester;

moving each one of the doors attached to the respective slot assembly body by a hinge into the respective open position wherein the respective substrate is inserted into the slot assembly; and

moving the respective door into the respective closed position wherein the door forms part of a sealed wall.

13. The method of claim 12 , further comprising:

inserting the slot assemblies into the frame.

14. The method of claim 13 , further comprising:

locating a front seal between a first of the slot assemblies and a second of the slot assemblies, the front seal forming part of the sealed wall.

15. The method of claim 12 , further comprising:

changing a temperature of a respective temperature modification device of each respective slot assembly to cause a temperature differential between the temperature modification device and the substrate and a transfer of heat between the temperature modification device and the substrate to modify a temperature of the substrate.

16. The method of claim 15 , wherein the temperature modification device is a resistive heating pad.

17. The method of claim 15 , wherein the temperature modification device is a thermal chuck, further comprising:

moving oil through an oil passage in the thermal chuck to transfer heat between the oil and the thermal chuck.

18. The method of claim 17 , further comprising:

operating an oil actuator to move the oil.

19. The method of claim 17 , further comprising:

heating the oil with a heater.

20. The method of claim 11 , wherein the portable cartridge is a first portable cartridge, further comprising:

holding a substrate between first and second components of a portable cartridge body forming part of a second portable cartridge, the second component having cartridge contacts against the substrate terminals of a respective substrate;

receiving the portable cartridge by the frame when a second door of the doors is in the respective open position with a third electrical interface on the portable cartridge body connecting to a fourth electrical interface on the frame;

transmitting signals between the electrical tester and the microelectronic circuit through the substrate terminals, cartridge contacts, and first and second electrical interfaces to test the microelectronic circuit; and

removing the second portable cartridge from the frame when the second door is in the respective open position with a third electrical interface on the portable cartridge body disconnected from the fourth electrical interface on the frame.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2024
From: JOVANOVIC, JOVAN; DEBOE, KENNETH W.; STEPS, STEVEN C.
To: AEHR TEST SYSTEMS
Reel/Frame 069011/0920 →
Continuity (6)
Continuation 18648873 · Apr 29, 2024
Continuation 17532298 · Nov 22, 2021
Division 16576555 · Sep 19, 2019
Division 15400771 · Jan 6, 2017
Provisional Application 62276746 · Jan 8, 2016
Related Publication 20240426939A1 · Dec 26, 2024
References Cited (367)
US 3149897A · Martineck · 1964 [cited by applicant]
US 3413613A · Bahrs · 1968 [cited by applicant]
US 3482201A · Schneck · 1969 [cited by applicant]
US 3757219A · Aksu · 1973 [cited by applicant]
US 3970934A · Aksu · 1976 [cited by applicant]
US 4240021A · Kashima et al. · 1980 [cited by applicant]
US 4298237A · Griffith et al. · 1981 [cited by applicant]
US 4400049A · Schuck · 1983 [cited by applicant]
US 4473798A · Cedrone et al. · 1984 [cited by applicant]
US 4477170A · Yamada et al. · 1984 [cited by applicant]
US 4517512A · Petrich et al. · 1985 [cited by applicant]
US 4582386A · Martens · 1986 [cited by applicant]
US 4591217A · Reimer · 1986 [cited by applicant]
US 4608679A · Rudy et al. · 1986 [cited by applicant]
US 4719411A · Buehler · 1988 [cited by applicant]
US 4746861A · Nesbitt · 1988 [cited by applicant]
US 4814573A · Check et al. · 1989 [cited by applicant]
US 4816754A · Buechele et al. · 1989 [cited by applicant]
US 4968931A · Littlebury et al. · 1990 [cited by applicant]
US 4981449A · Buchter · 1991 [cited by applicant]
US 4995814A · Weidler · 1991 [cited by applicant]
US 5008615A · Littlebury · 1991 [cited by applicant]
US 5034688A · Moulene et al. · 1991 [cited by applicant]
US 5086269A · Nobi · 1992 [cited by applicant]
US 5108302A · Pfaff · 1992 [cited by applicant]
US 5247521A · Akao et al. · 1993 [cited by applicant]
US 5461326A · Woith et al. · 1995 [cited by applicant]
US 5467024A · Swapp · 1995 [cited by applicant]
US 5515126A · Baxter et al. · 1996 [cited by applicant]
US 5517126A · Yamaguchi · 1996 [cited by applicant]
US 5534785A · Yoshizaki et al. · 1996 [cited by applicant]
US 5550466A · Botka · 1996 [cited by applicant]
US 5559446A · Sano · 1996 [cited by applicant]
US 5666288A · Jones et al. · 1997 [cited by applicant]
US 5773986A · Thompson et al. · 1998 [cited by applicant]
US 5808896A · Weber · 1998 [cited by applicant]
US 5821440A · Khater et al. · 1998 [cited by applicant]
US 5851143A · Hamid · 1998 [cited by applicant]
US 5886535A · Budnaitis · 1999 [cited by applicant]
US 5894225A · Coffin · 1999 [cited by applicant]
US 5928036A · Thrush · 1999 [cited by applicant]
US 5945834A · Nakata et al. · 1999 [cited by applicant]
US 5966022A · Budnaitis et al. · 1999 [cited by applicant]
US 5973285A · Dietrich et al. · 1999 [cited by applicant]
US 5982183A · Sano · 1999 [cited by applicant]
US 6005401A · Nakata et al. · 1999 [cited by applicant]
US 6023173A · Khater et al. · 2000 [cited by applicant]
US 6040700A · Berar · 2000 [cited by applicant]
US 6057696A · Orso et al. · 2000 [cited by applicant]
US 6084215A · Furuya et al. · 2000 [cited by applicant]
US 6084419A · Sato et al. · 2000 [cited by applicant]
US 6091060A · Getchel et al. · 2000 [cited by applicant]
US 6094059A · Frankeny et al. · 2000 [cited by applicant]
US 6094060A · Frankeny et al. · 2000 [cited by applicant]
US 6124725A · Sato · 2000 [cited by applicant]
US 6135699A · Yutaka et al. · 2000 [cited by applicant]
US 6137303A · Deckert et al. · 2000 [cited by applicant]
US 6203582B1 · Berner · 2001 [cited by applicant]
US 6244874B1 · Tan · 2001 [cited by applicant]
US 6255834B1 · Smith · 2001 [cited by applicant]
US 6268740B1 · Iida · 2001 [cited by applicant]
US 6318243B1 · Jones · 2001 [cited by applicant]
US 6339321B1 · Yamashita et al. · 2002 [cited by applicant]
US 6340895B1 · Uher et al. · 2002 [cited by applicant]
US 6358061B1 · Regnier · 2002 [cited by applicant]
US 6381283B1 · Bhardwaj et al. · 2002 [cited by applicant]
US 6384613B1 · Cheng · 2002 [cited by applicant]
US 6421754B1 · Kau et al. · 2002 [cited by applicant]
US 6509751B1 · Mathieu et al. · 2003 [cited by applicant]
US 6515497B1 · Matsuzawa · 2003 [cited by applicant]
US 6535824B1 · Mansky et al. · 2003 [cited by applicant]
US 6593763B2 · Weber · 2003 [cited by applicant]
US 6625557B1 · Perkins et al. · 2003 [cited by applicant]
US 6628520B2 · Patel et al. · 2003 [cited by applicant]
US 6644982B1 · Ondricek et al. · 2003 [cited by applicant]
US 6744269B1 · Johnson et al. · 2004 [cited by applicant]
US 6853209B1 · Jovanovic · 2005 [cited by applicant]
US 6867608B2 · Richmond et al. · 2005 [cited by applicant]
US 6876321B1 · Slutzky et al. · 2005 [cited by applicant]
US 6888343B1 · Holt et al. · 2005 [cited by applicant]
US 6994563B2 · Amini et al. · 2006 [cited by applicant]
US 7053644B1 · Lindsey et al. · 2006 [cited by applicant]
US 7108517B2 · Harper · 2006 [cited by applicant]
US 7137849B2 · Nagata · 2006 [cited by applicant]
US 7260303B2 · Bench et al. · 2007 [cited by applicant]
US 7332918B2 · Sugiyama et al. · 2008 [cited by applicant]
US 7382142B2 · Chong et al. · 2008 [cited by applicant]
US 7453260B2 · Boyle et al. · 2008 [cited by applicant]
US 7480129B2 · Brown et al. · 2009 [cited by applicant]
US 7762822B2 · Richmond, II · 2010 [cited by applicant]
US 7800382B2 · Lindsey et al. · 2010 [cited by applicant]
US 7826995B2 · Maenner · 2010 [cited by applicant]
US 7969175B2 · Hendrickson et al. · 2011 [cited by applicant]
US 8030957B2 · Lindsey et al. · 2011 [cited by applicant]
US 8035406B2 · Mueller · 2011 [cited by applicant]
US 8057263B1 · Howard et al. · 2011 [cited by applicant]
US 8118618B2 · Richmond, II et al. · 2012 [cited by applicant]
US 8228085B2 · Lindsey et al. · 2012 [cited by applicant]
US 8299935B2 · Kiyokawa et al. · 2012 [cited by applicant]
US 8388357B2 · Richmond, II et al. · 2013 [cited by applicant]
US 8444107B2 · Akouka et al. · 2013 [cited by applicant]
US 8462471B2 · Huang et al. · 2013 [cited by applicant]
US 8465327B2 · Springer et al. · 2013 [cited by applicant]
US 8506335B2 · Richmond et al. · 2013 [cited by applicant]
US 8628336B2 · Richmond, II et al. · 2014 [cited by applicant]
US 8947116B2 · Lindsey et al. · 2015 [cited by applicant]
US 8974116B2 · Okamoto et al. · 2015 [cited by applicant]
US 9250291B2 · Lindsey et al. · 2016 [cited by applicant]
US 9316683B2 · Richmond, II et al. · 2016 [cited by applicant]
US 9625521B2 · Lindsey et al. · 2017 [cited by applicant]
US 9880197B2 · Lindsey et al. · 2018 [cited by applicant]
US 10269678B1 · Viswanathan et al. · 2019 [cited by applicant]
US 10297339B2 · Thordarson et al. · 2019 [cited by applicant]
US 10401385B2 · Lindsey et al. · 2019 [cited by applicant]
US 11112429B2 · Lindsey et al. · 2021 [cited by applicant]
US 11255903B2 · Richmond, II et al. · 2022 [cited by applicant]
US 11488695B2 · Lindsey et al. · 2022 [cited by applicant]
US 11592465B2 · Lindsey et al. · 2023 [cited by applicant]
US 11835575B2 · Erickson, II · 2023 [cited by applicant]
US 11977089B2 · Lindsey et al. · 2024 [cited by applicant]
US 20010012726A1 · O'Neal et al. · 2001 [cited by applicant]
US 20010032663A1 · Pelrine · 2001 [cited by applicant]
US 20020003432A1 · Leas et al. · 2002 [cited by applicant]
US 20020030502A1 · Uher et al. · 2002 [cited by applicant]
US 20020032896A1 · Fukuda et al. · 2002 [cited by applicant]
US 20020036342A1 · Koide · 2002 [cited by applicant]
US 20020048826A1 · Richmond et al. · 2002 [cited by applicant]
US 20020050402A1 · Japp et al. · 2002 [cited by applicant]
US 20020066726A1 · Cole, Sr. et al. · 2002 [cited by applicant]
US 20020067180A1 · Jaimsomporn et al. · 2002 [cited by applicant]
US 20020070741A1 · Siew et al. · 2002 [cited by applicant]
US 20020106927A1 · Bosy et al. · 2002 [cited by applicant]
US 20020139169A1 · Lueth, II et al. · 2002 [cited by applicant]
US 20020144213A1 · Ramaswamy et al. · 2002 [cited by applicant]
US 20030020459A1 · Lambert · 2003 [cited by applicant]
US 20030057130A1 · Fix et al. · 2003 [cited by applicant]
US 20030077932A1 · Lewinnek · 2003 [cited by applicant]
US 20030099097A1 · Mok · 2003 [cited by applicant]
US 20030115037A1 · Sumida · 2003 [cited by applicant]
US 20030122550A1 · Kanamaru et al. · 2003 [cited by applicant]
US 20030137317A1 · Kim et al. · 2003 [cited by applicant]
US 20030237061A1 · Miller et al. · 2003 [cited by applicant]
US 20040070413A1 · Kasukabe et al. · 2004 [cited by applicant]
US 20040113640A1 · Cooper et al. · 2004 [cited by applicant]
US 20040113645A1 · Richmond, II et al. · 2004 [cited by applicant]
US 20040113646A1 · Yamashita · 2004 [cited by applicant]
US 20040124829A1 · Swettlen et al. · 2004 [cited by applicant]
US 20040183561A1 · Takekoshi et al. · 2004 [cited by applicant]
US 20040212382A1 · Cram · 2004 [cited by applicant]
US 20040217772A1 · Kline · 2004 [cited by applicant]
US 20040223309A1 · Haemer · 2004 [cited by applicant]
US 20050007137A1 · Gunn et al. · 2005 [cited by applicant]
US 20050042932A1 · Mok et al. · 2005 [cited by applicant]
US 20050077281A1 · Hamilton et al. · 2005 [cited by applicant]
US 20050093561A1 · Watanabe et al. · 2005 [cited by applicant]
US 20050103034A1 · Hamilton et al. · 2005 [cited by applicant]
US 20050111944A1 · Aho et al. · 2005 [cited by applicant]
US 20050125712A1 · Co et al. · 2005 [cited by applicant]
US 20050156611A1 · Shinde et al. · 2005 [cited by applicant]
US 20050277323A1 · Eldridge et al. · 2005 [cited by applicant]
US 20060091212A1 · Chein et al. · 2006 [cited by applicant]
US 20060125502A1 · Lindsey et al. · 2006 [cited by applicant]
US 20060132159A1 · Tamaishi · 2006 [cited by applicant]
US 20060139042A1 · Kasukabe · 2006 [cited by applicant]
US 20060170435A1 · Granicher et al. · 2006 [cited by applicant]
US 20060186904A1 · Natsuhara et al. · 2006 [cited by applicant]
US 20060198211A1 · Frankowsky · 2006 [cited by applicant]
US 20060263925A1 · Chandler · 2006 [cited by applicant]
US 20070001790A1 · Richmond, II et al. · 2007 [cited by applicant]
US 20070018681A1 · Sartschev · 2007 [cited by applicant]
US 20070028834A1 · Awazu et al. · 2007 [cited by applicant]
US 20070029979A1 · Williams et al. · 2007 [cited by applicant]
US 20070107656A1 · Shinozaki et al. · 2007 [cited by applicant]
US 20070273216A1 · Farbarik · 2007 [cited by applicant]
US 20070296422A1 · Miller · 2007 [cited by applicant]
US 20080022695A1 · Welle · 2008 [cited by applicant]
US 20080048688A1 · Mathieu et al. · 2008 [cited by applicant]
US 20080079451A1 · Maenner · 2008 [cited by applicant]
US 20080124951A1 · Cox et al. · 2008 [cited by applicant]
US 20080150125A1 · Braunisch et al. · 2008 [cited by applicant]
US 20080186046A1 · Yun et al. · 2008 [cited by applicant]
US 20080224723A1 · Washio et al. · 2008 [cited by applicant]
US 20090015282A1 · Steps · 2009 [cited by applicant]
US 20090039906A1 · Yamada et al. · 2009 [cited by applicant]
US 20090143923A1 · Breed · 2009 [cited by applicant]
US 20090160468A1 · Lindsey et al. · 2009 [cited by applicant]
US 20090212803A1 · Yamamoto et al. · 2009 [cited by applicant]
US 20090237102A1 · Lou · 2009 [cited by examiner]
US 20100063637A1 · Crowell et al. · 2010 [cited by applicant]
US 20100141288A1 · Di Lello · 2010 [cited by applicant]
US 20100175866A1 · Tani et al. · 2010 [cited by applicant]
US 20100213957A1 · Richmond et al. · 2010 [cited by applicant]
US 20100213960A1 · Mok et al. · 2010 [cited by applicant]
US 20100244866A1 · Lindsey et al. · 2010 [cited by applicant]
US 20110006800A1 · Lindsey et al. · 2011 [cited by applicant]
US 20110248737A1 · Takeshita et al. · 2011 [cited by applicant]
US 20110271159A1 · Ahn et al. · 2011 [cited by applicant]
US 20110273831A1 · Kyle · 2011 [cited by applicant]
US 20110298630A1 · Kiyokawa et al. · 2011 [cited by applicant]
US 20110316577A1 · Lindsey et al. · 2011 [cited by applicant]
US 20120043984A1 · Yashar et al. · 2012 [cited by applicant]
US 20120075807A1 · Refai-Ahmed et al. · 2012 [cited by applicant]
US 20120136614A1 · Liu et al. · 2012 [cited by applicant]
US 20120142210A1 · De Stefano · 2012 [cited by applicant]
US 20120229159A1 · Kim et al. · 2012 [cited by applicant]
US 20120280704A1 · Lindsey et al. · 2012 [cited by applicant]
US 20130055184A1 · Shroff · 2013 [cited by applicant]
US 20130224891A1 · Takizawa · 2013 [cited by applicant]
US 20130304412A1 · Richmond, II et al. · 2013 [cited by applicant]
US 20130342236A1 · Song et al. · 2013 [cited by applicant]
US 20140125371A1 · Chung et al. · 2014 [cited by applicant]
US 20140232424A1 · Richmond, II et al. · 2014 [cited by applicant]
US 20150109011A1 · Lindsey et al. · 2015 [cited by applicant]
US 20150137842A1 · Murakami et al. · 2015 [cited by applicant]
US 20150204942A1 · Scocchetti · 2015 [cited by applicant]
US 20150260793A1 · Chen · 2015 [cited by applicant]
US 20150309114A1 · Barabi et al. · 2015 [cited by applicant]
US 20160103179A1 · Lindsey et al. · 2016 [cited by applicant]
US 20170134587A1 · Lawson et al. · 2017 [cited by applicant]
US 20170358515A1 · Murdock · 2017 [cited by applicant]
US 20180080981A1 · Steps et al. · 2018 [cited by applicant]
US 20180182599A1 · Stowell et al. · 2018 [cited by applicant]
US 20190019711A1 · Tamura · 2019 [cited by applicant]
US 20190339303A1 · Lindsey et al. · 2019 [cited by applicant]
US 20200033404A1 · Hyakudomi et al. · 2020 [cited by applicant]
US 20200300908A1 · Steps et al. · 2020 [cited by applicant]
US 20200411410A1 · Klein et al. · 2020 [cited by applicant]
US 20220107358A1 · Erickson, II et al. · 2022 [cited by applicant]
US 20220137121A1 · Richmond, II et al. · 2022 [cited by applicant]
CN 1482660A · 2004 [cited by examiner]
CN 100348982C · 2007 [cited by applicant]
CN 101084447A · 2007 [cited by applicant]
CN 101137947A · 2008 [cited by applicant]
CN 101675350A · 2010 [cited by applicant]
CN 101750558A · 2010 [cited by applicant]
CN 101952733A · 2011 [cited by applicant]
CN 104865414A · 2015 [cited by applicant]
CN 110383092B · 2022 [cited by applicant]
DE 3914669A1 · 1989 [cited by applicant]
DE 197818226 · 2004 [cited by applicant]
EP 0320660A2 · 1989 [cited by applicant]
EP 0639777A1 · 1994 [cited by applicant]
EP 2772768A1 · 2014 [cited by applicant]
GB 2285348A · 1995 [cited by applicant]
IT MI2120121157A1 · 2013 [cited by applicant]
JP 61065319 · 1986 [cited by applicant]
JP 02071540A · 1990 [cited by applicant]
JP H06186283A · 1994 [cited by applicant]
JP H06347477A · 1994 [cited by applicant]
JP 08005666A · 1996 [cited by applicant]
JP H07169806A · 1996 [cited by applicant]
JP 08340030A · 1996 [cited by applicant]
JP H09503577A · 1997 [cited by applicant]
JP 09115971 · 1997 [cited by applicant]
JP 10116867A · 1998 [cited by applicant]
JP 10256325A · 1998 [cited by applicant]
JP 1999121569A · 1999 [cited by applicant]
JP H11121550A · 1999 [cited by applicant]
JP 11145216A · 1999 [cited by applicant]
JP 11145234A · 1999 [cited by applicant]
JP H11145225A · 1999 [cited by applicant]
JP H11284037A · 1999 [cited by applicant]
JP 2001203244A · 2001 [cited by applicant]
JP 200243381A · 2002 [cited by applicant]
JP 200290426A · 2002 [cited by applicant]
JP 2002151558A · 2002 [cited by applicant]
JP 2003139816A · 2003 [cited by applicant]
JP 2004228313A · 2004 [cited by applicant]
JP 2005516226A · 2005 [cited by applicant]
JP 2005265786A · 2005 [cited by applicant]
JP 200698064A · 2006 [cited by applicant]
JP 2006184044A · 2006 [cited by applicant]
JP 2007024702A · 2007 [cited by applicant]
JP 2008166306A · 2008 [cited by applicant]
JP 2008232667A · 2008 [cited by applicant]
JP 2008541415A · 2008 [cited by applicant]
JP 2010066091A · 2010 [cited by applicant]
JP 5528617B1 · 2014 [cited by applicant]
JP 2015103552A · 2015 [cited by applicant]
JP 2016014614A · 2016 [cited by applicant]
JP 6538808A1 · 2019 [cited by applicant]
JP H11121549A · 2024 [cited by applicant]
KR 1019940032588 · 1994 [cited by applicant]
KR 1020050024395 · 2005 [cited by applicant]
KR 1020080011213 · 2008 [cited by applicant]
KR 1020120063576 · 2012 [cited by applicant]
SU 1247600A · 1986 [cited by applicant]
TW 201632888A · 2003 [cited by applicant]
TW 1225156B · 2004 [cited by applicant]
TW 200521443 · 2005 [cited by applicant]
TW 200523562A · 2005 [cited by applicant]
TW 200627573A · 2006 [cited by applicant]
TW 200706888A · 2007 [cited by applicant]
TW 1276815B · 2007 [cited by applicant]
TW 200710412A · 2007 [cited by applicant]
TW 200831932A · 2008 [cited by applicant]
TW 201115164A1 · 2011 [cited by applicant]
TW 201135253A1 · 2011 [cited by applicant]
TW 201140105A1 · 2011 [cited by applicant]
WO 9502196A1 · 1995 [cited by applicant]
WO 0104641A2 · 2001 [cited by applicant]
WO 2003065064A2 · 2003 [cited by applicant]
WO 2004003581A1 · 2004 [cited by applicant]
WO 2004008163 · 2004 [cited by applicant]
WO 2004095571A1 · 2004 [cited by applicant]
WO 2006009061 · 2006 [cited by applicant]
WO 2006038257A1 · 2006 [cited by applicant]
WO 2006096361A2 · 2006 [cited by applicant]
WO 2006113708A3 · 2006 [cited by applicant]
WO 2006116767A1 · 2006 [cited by applicant]
WO 2006119405A1 · 2006 [cited by applicant]
WO 2007008790A2 · 2007 [cited by applicant]
WO 2007010610A1 · 2007 [cited by applicant]
WO 2008124068A1 · 2008 [cited by applicant]
WO 2011082183A2 · 2011 [cited by applicant]
WO 2017210108A1 · 2017 [cited by applicant]
“Extended European Search Report issued on Dec. 7, 2020”, European Patent Application No. 18761604.0, (9 pages). [cited by applicant]
“Extended European Search Report issued on Jan. 31, 2024”, European Patent Application No. 23205767.9, (9 pages). [cited by applicant]
“Extended European Search Report mailed on Sep. 30, 2024”, European Patent Application No. 21878311.6, (9 pages). [cited by applicant]
“First Office Action mailed Dec. 19, 2023 with English translation”, Japanese Patent Application No. 2022-168114, (12 pages). [cited by applicant]
“First Office Action mailed Mar. 26, 2024 with English translation”, Chinese Patent Application No. 202210265243.2, (7 pages). [cited by applicant]
“First Office Action mailed on Dec. 14, 2022”, R.O.C. Patent Application No. 111137536, (4 pages). [cited by applicant]
“First Office Action mailed on Dec. 27, 2022 with English translation”, Japanese Patent Application No. 2021-197754, (4 pages). [cited by applicant]
“First Office Action mailed on Feb. 7, 2022 with English Translation”, Japanese Patent Application No. 2019-548053, (6 pages). [cited by applicant]
“First Office Action mailed on Jul. 10, 2020 with English translation”, Chinese Patent Application No. 201780011541.6, (68 pages). [cited by applicant]
“First Office Action mailed on Jul. 21, 2021 with English translation”, Chinese Patent Application No. 201880015746.6, (20 pages). [cited by applicant]
“First Office Action mailed on Jun. 15, 2022 with English translation”, Korean Patent Application No. 10-2019-7028508, (10 pages). [cited by applicant]
“First Office Action mailed on Mar. 9, 2022 with English translation”, R.O.C. Patent Application No. 110115369, (12 pages). [cited by applicant]
“First Office Action mailed on Nov. 12, 2020 with English translation”, Japanese Patent Application No. 2018-535825, (7 pages). [cited by applicant]
“First Office Action mailed on Sep. 28, 2021 with English translation”, R.O.C Patent Application No. 107107096, (11 pages). [cited by applicant]
“International Search Report and Written Opinion”, International Patent Application No. PCT/US2021/053445, Feb. 14, 2022, (14 pages). [cited by applicant]
“International Search Report and Written Opinion dated Jan. 14, 2016”, International PCT Application No. PCT/US15/56429 with International Filing Date of Oct. 20, 2015, (11 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Aug. 2, 2024”, International PCT Patent Application No. PCT/US2023/086080, (15 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Jun. 25, 2018”, International PCT Patent Application No. PCT/US2018/019934, (15 pages). [cited by applicant]
“International Search Report and Written Opinion mailed on Mar. 30, 2017”, International PCT Application No. PCT/US2017/012597 with International Filing Date of Jan. 6, 2017, (11 pages). [cited by applicant]
“Invitation to Pay Additional Fees mailed on Apr. 12, 2018”, International PCT Patent Application No. PCT/US2018/019934, (3 pages). [cited by applicant]
“Japanese Office Action—mailed on Jul. 18, 2017 (with English translation)”, Japanese Patent Application No. 2016-184497, (9 pages). [cited by applicant]
“Non Final Office Action mailed on Apr. 9, 2021”, U.S. Appl. No. 16/576,555, (17 pages). [cited by applicant]
“Non Final Office Action mailed on Aug. 19, 2020”, U.S. Appl. No. 16/899,246, (13 pages). [cited by applicant]
“Non Final Office Action mailed on Dec. 11, 2019”, U.S. Appl. No. 16/172,249, (11 pages). [cited by applicant]
“Non Final Office Action mailed on Feb. 9, 2018”, U.S. Appl. No. 15/823,290, (7 pages). [cited by applicant]
“Non Final Office Action mailed on Jun. 29, 2021”, U.S. Appl. No. 16/831,485, (14 pages). [cited by applicant]
“Non Final Office Action mailed on Sep. 20, 2022”, U.S. Appl. No. 17/253,646, (8 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 17, 2024”, U.S. Appl. No. 18/523,604, (8 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 18, 2023”, U.S. Appl. No. 18/176,965, (10 pages). [cited by applicant]
“Notice of Allowance mailed on Jul. 30, 2024”, U.S. Appl. No. 18/485,716, (10 pages). [cited by applicant]
“Notice of Grounds for Rejection mailed on Jun. 15, 2017 (with English Translation)”, Korean Patent Application No. 10-2017-7004733, (14 pages). [cited by applicant]
“Notice of Reasons for Rejection mailed Aug. 17, 2020 with English translation”, Japanese Patent Application No. 2019-106294, (9 pages). [cited by applicant]
“Notice of Reasons for Rejection mailed Oct. 15, 2018 with English translation”, Japanese Patent Application No. 2017-228718, (6 pages). [cited by applicant]
“Office Action and Search Report mailed on Mar. 12, 2024”, Singapore Patent Application No. 11202302449Y, (11 pages). [cited by applicant]
“Office Action mailed on Apr. 13, 2023 with English translation”, Japanese Patent Application No. 2022 045659, (3 pages). [cited by applicant]
“Office Action mailed on Apr. 21, 2024 with English translation”, Korean Patent Application No. 10-2018-7022771, (24 Pages). [cited by applicant]
“Office Action mailed on Aug. 27, 2024 with English translation”, Japanese Patent Application No. 2023-172760, (12 Pages). [cited by applicant]
“Office Action mailed on Aug. 6, 2024”, Japanese Patent Application No. 2023-131868, (7 pages). [cited by applicant]
“Office Action mailed on Feb. 27, 2020 with English Translation”, R.O.C. Patent Application No. 106100392, (3 pages). [cited by applicant]
“Office Action mailed on Oct. 26, 2023 with English translation”, Korean Patent Application No. 10-2023-7003482, (17 pages). [cited by applicant]
“Official Notification mailed on Sep. 6, 2021 with English translation”, Japanese Patent Application No. 2020-197424, (6 pages). [cited by applicant]
“Search Report and Written Opinion”, Singapore Patent Application No. 10202108629Y mailed on Feb. 24, 2022, (9 pages). [cited by applicant]
“Second Office Action mailed on Aug. 23, 2021 with English Translation”, Japanese Patent Application No. 2018-535825, (5 pages). [cited by applicant]
“Second Office Action mailed on Aug. 29, 2024 with English translation”, Chinese Patent Application No. 202210265243.2, (22 pages). [cited by applicant]
“Second Office Action mailed on May 23, 2023”, R.O.C. Patent Application No. 111137536, (8 pages). [cited by applicant]
“Non Final Office Action mailed on Nov. 22, 2024”, U.S. Appl. No. 17/813,298, (23 pages). [cited by applicant]
“Notice of Allowance mailed on Nov. 22, 2024”, U.S. Appl. No. 18/825,962, (9 pages). [cited by applicant]
“Notification of Acceptance of Request for Invalidation with English Translation mailed on Nov. 15, 2024”, Chinese Patent Application No. 201310159573.4, (147 pages). [cited by applicant]
“Office Action mailed on Nov. 7, 2024 with English translation”, Japanese Patent Application No. 2023-521543, (9 pages). [cited by applicant]
Ivy, W.L , et al., “Sacrificial Metal Wafer Level Burn-In KGD”, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070). May 21-24, 2000, (6 pages). [cited by applicant]
“Office Action mailed on Feb. 6, 2025”, Singapore Application No. 10202260021Y, (12 pages). [cited by applicant]
Cited By (1)
US 12,584,958