Curing agent for epoxy resins and epoxy resin composition
A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R 1 's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8 as an average value; and p's may be the same or different from each other and each represent an integer of 0 to 3, (b) 1 to 70 parts by weight of a thiodiphenol compound represented by the following general formula (II): wherein R 1 's may be the same or different from each other and each represent an alkyl group having 1 to 12 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group, and p's may be the same or different from each other and each represent an integer of 0 to 3, and (c) 0 to 100 parts by weight of a polyhydric phenol compound having a structure other than the components (a) and (b), and epoxy resin composition comprising them, in particular to be used for semiconductor encapsulation
1. A curing agent for epoxy resins, comprising:
(a) 30 to 99 parts by weight of a modified phenol resin which is obtained by polycondensing a heavy oil or pitch, a phenol and a carbonyl compound, which is an aldehylde having 5 to 15 carbon atoms or a ketone, in the presence of an acid catalyst,
(b) 1 to 70 parts by weight of a thiodiphenol compound represented by the following general formula (II):
wherein R 1 's may be the same or different from each other and each represent an alkyl group having 1 to 12 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group, and p's may be the same or different from each other and each represent an integer of 0 to 3, and
(c) 0 to 100 parts by weight of a polyhydric phenol compound having a structure other than the components (a) and (b).
2. The curing agent for epoxy resins of claim 1 , characterized in that the modified phenol resin as the component (a) is obtained by mixing together a heavy oil or pitch, 0.3 to 10 mols of the phenol, 0.2 to 9 mols of the carbonyl compound having 5 to 15 carbon atoms and 0.01 to 3 mols of the acid catalyst based on 1 mol of the heavy oil or pitch calculated from its average molecular weight and heating to carry out a polycondensation reaction.
3. The curing agent for epoxy resins of claim 2 , characterized in that the heavy oil or pitch has an aromatic hydrocarbon fraction Fa of 0.40 to 0.95 and an aromatic ring hydrogen content Ha of 20 to 80%.
4. The curing agent for epoxy resins of claim 3 , wherein the heavy oil has a distillation start temperature of 170°C. or more.
5. The curing agent for epoxy resins of claim 1 , wherein the modified phenol resin (a) has a hydroxyl group equivalent of 130 to 200 g/eq.
6. The curing agent for epoxy resins of claim 1 , wherein at least one thiodiphenol is selected from the group consisting of bis(4-hydroxyphenyl)sulfide and, bis(4-hydroxy-3-methylphenyl)sulfide.
7. The curing agent for epoxy resins of claim 1 , wherein the thiodiphenol compound (b) is bis(4-hydroxy-3,5-dimethylphenyl)sulfide.