IP Library › Granted Patent US 7,119,567
Granted Patent B2
US 7,119,567 · App. 10/243,544 · Granted Oct 10, 2006

System and method for testing one or more dies on a semiconductor wafer

Assignee: Infineon Technologies North America Corp.
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Quick Facts
Patent No.
US 7,119,567
App. No.
10/243,544
Granted
Oct 10, 2006
Kind
B2
Abstract

A testing system or method compares read data from one or more dies in a semiconductor wafer with the original data written onto the one or more dies The testing system includes one or more write registers connected to one or more dies on the semiconductor wafer. One or more comparators are connected to the dies and the write registers. The comparator generates a result in response to the original data and the read data.

Claims (39)

1. A testing system comprising:

at least one die on a semiconductor wafer;

a selector block connected to the at least one die and at least one write register, the selector block to write original data from the at least one write register onto the at least one die in response to a select signal,

at least one comparator connected to the at least one die and to the at least one write register, the at least one comparator to receive read data from the at least one die, the at least one comparator to receive original data from the at least one write register, the at least one comparator to generate at least one result in response to the original data and the read data;

a shift register connected to the at least one comparator, the shift register to receive the at least one result from the comparator, the shift register to generate serial data in response to the at least one result; and

an error detection circuit connected to the shift register, the error detection circuit to receive the at least one result from the shift register, the error detection circuit to generate an error flag in response to the at least one result.

2. The testing system according to claim 1 , further comprising multiple dies connected to the write register, where the multiple dies comprise at least one die cluster.

3. The testing system according to claim 1 , further comprising a bus connected to the selector block and to each die in a die cluster.

4. The testing system according to claim 1 , further comprising:

at least one write tristateable buffer interconnected between the at least one write register and the at least one die;

at least one first read tristateable buffer interconnected between the at least one die and the at least one comparator; and

at least one second read tristateable buffer interconnected between the at least one write register and the at least one comparator.

5. The testing system according to claim 1 , where at least one of the selector block, at least one write register, at least one comparator, shift register, and error detection circuit is implemented in the kerf area of the semiconductor wafer.

6. The testing system according to claim 1 , where the comparator is a compressor.

7. The testing system according to claim 1 , where the error detection circuit comprises an AND gate.

8. The testing system according to claim 1 further comprising a test pin connected to the comparator for transmitting the result to a testing device external of the semiconductor wafer.

9. A testing system, comprising:

a die on a semiconductor wafer;

a write register connected to the die, the write register to write original data onto the die;

a comparator connected to the die and the write register, the comparator to receive read data from the die, the comparator to receive the original data from the write register, the comparator to generate a result in response to the original data and the read data; and

a write tristateable buffer interconnected between the write register and the die, the write tristateable buffer to connect electrically the write register to the die in response to a first control signal, the write tristateable buffer to isolate the die from the write register in response to a second control signal.

10. The testing system according to claim 9 , further comprising:

a first read tristateable buffer interconnected between the die and the comparator, the first read tristateable buffer to connect electrically the die to the comparator in response to a first control signal; and

a second read tristateable buffer interconnected between the comparator and the write register, the second read tristateable buffer to connect electrically the comparator to the write register in response to the first control signal,

where the first and second read tristateable buffers isolate the comparator from the die and the write register in response to a second control signal.

11. The testing system according to claim 9 , further comprising:

a shift register connected to the comparator; and

an error detection circuit connected to the shift register,

where the shift register and the error detection circuit receive the result from the comparator.

12. The testing system according to claim 11 , where the error detection circuit generates an error flag in response to the result.

13. The testing system according to claim 11 , where the shift register generates serial data in response to the result.

14. The testing system according to claim 11 , where the error detection circuit comprises an AND gate.

15. A testing system, comprising:

a die on a semiconductor wafer;

a write register connected to the die, the write register to write original data onto the die;

a comparator connected to the die and the write register, the comparator to receive read data from the die, the comparator to receive the original data from the write register, the comparator to generate a result in response to the original data and the read data;

a first read tristateable buffer interconnected between the die and the comparator, the first read tristateable buffer to connect electrically the die to the comparator in response to a first control signal; and

a second read tristateable buffer interconnected between the comparator and the write register, the second read tristateable buffer to connect electrically the comparator to the write register in response to the first control signal,

where the first and second read tristateable buffers isolate the comparator from the die and the write register in response to a second control signal.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036818/0583 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2004
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 014292/0914 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2002
From: MA, DAVID SUITWAI; WANG, TAO; DIETZ, JAMES J.; REN, BING
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 013517/0687 →
Continuity (1)
Related Publication 20040054951A1 · Mar 18, 2004