Apparatus for measuring feature widths on masks for the semiconductor industry
An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14 ; a scanning stage 18 , arranged on the carrier plate 16 , that carries a mask 1 to be measured, the mask 1 defining a surface 4 ; and an objective 2 arranged opposite the mask 1 . A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.
1. An apparatus for measuring feature widths on masks for the semiconductor industry, comprising a carrier plate that is retained in vibrationally decoupled fashion in a base frame; a scanning stage, arranged on the carrier plate, wherein the carrier plate carries the mask to be measured; an objective arranged opposite a surface of the mask; a liquid is provided between the objective and the surface of the mask, and wherein a precision metering nozzle, which applies the liquid exclusively onto at least one measurement point located on the surface of the mask, is associated with the objective.
2. An apparatus for measuring feature widths on masks for the semiconductor industry, comprising:
a base frame;
a carrier plate retained in a vibrationally decoupled fashion in the base frame;
a mask comprising a surface;
an objective arranged opposite the surface of the mask;
a scanning stage operatively arranged on the carrier plate to carry the mask;
a device associated with the objective, operatively arranged to apply a liquid between the objective and the surface of the mask.
3. The apparatus as recited in claim 2 wherein the mask further comprises at least one measurement point on the surface, and the device is operatively arranged to apply the liquid exclusively onto the at least one measurement point.
4. The apparatus as recited in claim 2 wherein the device comprises a precision metering nozzle.
5. The apparatus as recited in claim 2 wherein the device is integral to the objective.
6. The apparatus as recited in claim 5 wherein the device comprises a cylinder completely surrounding the objective and separated from the objective by a gap.
7. The apparatus as recited in claim 6 wherein the liquid is transportable through the gap.
8. The apparatus as recited in claim 5 wherein the objective comprises a circumference and the device comprises at least one conduit arranged coaxially with the circumference of the objective.
9. The apparatus as recited in claim 8 wherein the liquid is transportable through the at least one conduit.
10. The apparatus as recited in claim 9 wherein the device comprises three conduits.
11. The apparatus as recited in claim 2 further comprising a special frame and a special peripheral seal, wherein the mask is arranged in the special frame and on the special peripheral seal, and wherein the liquid applied to the surface is securely contained within the special frame.
12. The apparatus as recited in claim 11 wherein the special seal comprises polytetrafluoroethylene.
13. The apparatus as recited in claim 2 wherein the liquid comprises water.
14. The apparatus as recited in claim 2 wherein the liquid comprises oil.
15. The apparatus as recited in claim 2 wherein the objective is configured for wavelengths of the illuminating light smaller than 300 nm.
16. The apparatus as recited in claim 2 wherein the objective is configured for wavelengths of the illuminating light smaller than 248 nm.
17. The apparatus as recited in claim 2 wherein the objective is wetted with the liquid.
18. An apparatus for measuring feature widths on semiconductor substrates, comprising:
a base frame;
a carrier plate retained in a vibrationally decoupled fashion in the base frame;
a semiconductor substrate comprising a surface;
an objective arranged opposite the surface of the semiconductor substrate;
a scanning stage operatively arranged on the carrier plate to carry the semiconductor substrate;
a device associated with the objective, operatively arranged to apply a liquid between the objective and the surface of the semiconductor substrate.
19. The apparatus as recited in claim 18 wherein the semiconductor substrate further comprises at least one measurement point on the surface, and the device is operatively arranged to apply the liquid exclusively onto the at least one measurement point.
20. The apparatus as recited in claim 18 wherein the objective is configured for wavelengths of the illuminating light smaller than 300 nm.
21. The apparatus as recited in claim 18 wherein the objective is configured for wavelengths of the illuminating light smaller than 248 nm.
22. The apparatus as recited in claim 18 wherein the objective is wetted with the liquid.