IP Library › Granted Patent US 7,583,104
Granted Patent B2
US 7,583,104 · App. 11/609,610 · Granted Sep 1, 2009

Maintaining input and/or output configuration and data state during and when coming out of a low power mode

Assignee: Microchip Technology Incorporated
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Quick Facts
Patent No.
US 7,583,104
App. No.
11/609,610
Granted
Sep 1, 2009
Kind
B2
Abstract

A semiconductor integrated circuit device upon exiting from a low power mode, wakes up and re-initializes logic circuits so as to restore previous logic states of internal registers without disturbing input-output (I/O) configuration control and data states present at the time the low power mode was entered. Thus not distributing the operation of other devices connected to the semiconductor integrated circuit device previously in the low power mode. Once all internal logic and registers of the semiconductor integrated circuit device have been re-initialized, a “low power state wake-up and restore” signal may issue. This signal indicates that the I/O configuration control and data states stored in the I/O keeper cell at the time the integrated circuit device entered into the low power mode have been reinstated and control may be returned to the logic circuits and/or internal registers of the semiconductor integrated circuit device.

Claims (42)

1. An integrated circuit device having a low power mode with a maintained configuration of an input receiver, and a maintained configuration and output data state of an output driver, comprising:

a plurality of logic circuits having a low power mode;

an input-output (I/O) node coupled to the plurality of logic circuits, the I/O node comprises an I/O keeper cell coupled to an output driver and an input receiver, wherein the output driver and the input receiver are configurable;

wherein when the I/O keeper cell receives an enter low power mode signal the I/O keeper cell maintains the input receiver according to a receive configuration and the output driver according to an output configuration and at an output data state that were determined by the plurality of logic circuits before entering the low power mode;

wherein when the I/O keeper cell receives a wake-up and restore from low power mode signal the I/O keeper cell returns control of the receive configuration of the input receiver and the output configuration and the output data state of the output driver to the plurality of logic circuits; and

a low power mode register that stores logic levels for and controls the enter low power mode signal and the wake-up and restore from low power mode signal.

2. The integrated circuit device according to claim 1 , wherein the enter low power mode signal and the wake-up and restore from low power mode signal are one signal having a first logic level and a second logic level, respectively, whereby when the one signal is at the first logic level the enter low power mode signal is asserted and when the one signal is at the second logic level the wake-up and restore from low power mode signal is asserted.

3. The integrated circuit device according to claim 2 , wherein the first logic level is a logic “1” and the second logic level is a logic “0.”

4. The integrated circuit device according to claim 2 , wherein the first logic level is a logic “0” and the second logic level is a logic “1.”

5. The integrated circuit device according to claim 1 , wherein the driver and the receiver are coupled to an external I/O connection of an integrated circuit package.

6. The integrated circuit device according to claim 1 , wherein the integrated circuit device is selected from the group consisting of microprocessor, microcontroller, digital signal processor (DSP), programmable logic array (PLA), and application specific integrated circuit (ASIC).

7. The integrated circuit device according to claim 1 , wherein the I/O node and low power mode register are powered from the same power source.

8. The integrated circuit device according to claim 1 , wherein the I/O node and low power mode register are powered from one power source and the plurality of logic circuits are powered from another power source.

9. The integrated circuit device according to claim 8 , wherein the another power source is turned off when in the low power mode.

10. An integrated circuit device having a low power mode with a maintained configuration and output data state of an output driver, comprising:

a plurality of logic circuits having a low power mode;

an output node coupled to the plurality of logic circuits, the output node comprises an output keeper cell coupled to an output driver, wherein the output driver is configurable;

wherein when the output keeper cell receives an enter low power mode signal the output keeper cell maintains the output driver at a configuration and an output data state that were determined by the plurality of logic circuits before entering the low power mode;

wherein when the output keeper cell receives a wake-up and restore from low power mode signal the output keeper cell returns control of the configuration and the output data state of the driver to the plurality of logic circuits; and

a low power mode register that stores logic levels for and controls the enter low power mode signal and the wake-up and restore from low power mode signal.

11. The integrated circuit device according to claim 10 , wherein the enter low power mode signal and the wake-up and restore from low power mode signal are one signal having a first logic level and a second logic level, respectively, whereby when the one signal is at the first logic level the enter low power mode signal is asserted and when the one signal is at the second logic level the wake-up and restore from low power mode signal is asserted.

12. The integrated circuit device according to claim 11 , wherein the first logic level is a logic “1” and the second logic level is a logic “0.”

13. The integrated circuit device according to claim 11 , wherein the first logic level is a logic “0” and the second logic level is a logic “1.”

14. The integrated circuit device according to claim 10 , wherein the driver is coupled to an external output connection of an integrated circuit package.

15. The integrated circuit device according to claim 10 , wherein the integrated circuit device is selected from the group consisting of microprocessor, microcontroller, digital signal processor (DSP), programmable logic array (PLA), and application specific integrated circuit (ASIC).

16. The integrated circuit device according to claim 10 , wherein the output node and low power mode register are powered from the same power source.

17. The integrated circuit device according to claim 10 , wherein the output node and low power mode register are powered from one power source and the plurality of logic circuits are powered from another power source.

18. The integrated circuit device according to claim 17 , wherein the another power source is turned off when in the low power mode.

19. An integrated circuit device having a low power mode and with a maintained configuration of an input receiver, comprising:

a plurality of logic circuits having a low power mode;

an input node coupled to the plurality of logic circuits, the input node comprises an input keeper cell coupled to an input receiver, wherein the input receiver is configurable;

wherein when the input keeper cell receives an enter low power mode signal the input keeper cell maintains the input receiver at a configuration that was determined by the plurality of logic circuits before entering the low power mode;

wherein when the input keeper cell receives a wake-up and restore from low power mode signal the input keeper cell returns control of the configuration of the input receiver to the plurality of logic circuits; and

a low power mode register that stores logic levels for and controls the enter low power mode signal and the wake-up and restore from low power mode signal.

20. The integrated circuit device according to claim 19 , wherein the enter low power mode signal and the wake-up and restore from low power mode signal are one signal having a first logic level and a second logic level, respectively, whereby when the one signal is at the first logic level the enter low power mode signal is asserted and when the one signal is at the second logic level the wake-up and restore from low power mode signal is asserted.

21. The integrated circuit device according to claim 20 , wherein the first logic level is a logic “1” and the second logic level is a logic “0.”

22. The integrated circuit device according to claim 20 , wherein the first logic level is a logic “0” and the second logic level is a logic “1.”

23. The integrated circuit device according to claim 19 , wherein the receiver is coupled to an external input connection of an integrated circuit package.

24. The integrated circuit device according to claim 19 , wherein the integrated circuit device is selected from the group consisting of microprocessor, microcontroller, digital signal processor (DSP), programmable logic array (PLA), and application specific integrated circuit (ASIC).

25. The integrated circuit device according to claim 19 , wherein the input node and low power mode register are powered from the same power source.

26. The integrated circuit device according to claim 19 , wherein the input node and low power mode register are powered from one power source and the plurality of logic circuits are powered from another power source.

27. The integrated circuit device according to claim 26 , wherein the another power source is turned off when in the low power mode.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2006
From: SIMMONS, MICHAEL; WOJEWODA, IGOR
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 018620/0828 →
Continuity (1)
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