IP Library › Granted Patent US 7,620,924
Granted Patent B2
US 7,620,924 · App. 11/079,439 · Granted Nov 17, 2009

Base platforms with combined ASIC and FPGA features and process of using the same

Assignee: LSI Corporation
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Quick Facts
Patent No.
US 7,620,924
App. No.
11/079,439
Granted
Nov 17, 2009
Kind
B2
Abstract

A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.

Claims (18)

1. A base platform design for a configurable integrated circuit platform, wherein the base platform design comprises:

a memory for storing data;

a pre-diffused metal-programmable transistor fabric containing a plurality of transistors configurable to different configurations of logic and memory by the addition of at least one metallization layer to the platform, which selectively connects transistors of the transistor fabric into a configuration of at least one of the logic or memory;

firmware-configurable logic blocks, the metallization layer selectively connecting at least one of the firmware-configurable logic blocks to the metal-programmable transistor fabric to receive input signals that are connected to the logic configured in the metal-programmable transistor fabric, the at least one firmware-configurable logic block being configurable by firmware to execute functions on the input signals; and

a multiplexer coupled to the logic configured in the metal-programmable transistor fabric and the at least one firmware-configurable logic block, and an enable input selectively controlling the multiplexer to output results from either the logic configured in the metal-programmable transistor fabric or the at least one firmware-configurable logic block.

2. The base platform design according to claim 1 , wherein the design further defines hardmacs, including memory, and at least one memory containing the firmware.

3. The base platform design according to claim 1 , characterized by the absence of memory for the firmware, wherein the firmware is arranged to be resident in an off-platform configuration memory.

4. A base platform design for a configurable integrated circuit platform, wherein the base platform design comprises:

a pre-diffused metal-programmable transistor fabric containing a plurality of transistors configurable to different configurations of logic and memory by the addition of at least one metallization layer to the platform, which selectively connects transistors of the transistor fabric into a configuration of at least one of the logic or memory;

first firmware-configurable logic blocks, which are configurable by firmware to execute functions on signals;

second firmware-configurable logic blocks, the metallization layer selectively connecting the second firmware-configurable logic blocks to the metal-programmable transistor fabric to receive input signals to the logic configured in the metal-programmable transistor fabric, the second firmware-configurable logic blocks being configurable by firmware to execute functions on the input signals; and

a controller, which selectively outputs results from the logic configured in the metal-programmable transistor fabric or the second firmware-configurable logic blocks.

5. An integrated circuit comprising:

a base platform for a configurable integrated circuit platform, wherein the base platform comprises:

a pre-diffused metal-programmable transistor fabric containing a plurality of transistors configurable to different configurations of logic and memory by the addition of at least one metallization layer to the platform; and

firmware-configurable logic blocks, which are configurable by firmware to execute functions on signals within the integrated circuit; and

at least one metallization layer, which selectively connects the transistors of the metal-programmable transistor fabric into a selected configuration of at least one of the logic or memory, the metallization layer selectively connecting at least one firmware-configurable logic block to the metal-programmable transistor fabric to receive input signals connected to the logic configured in the metal-programmable transistor fabric, the at least one firmware-configurable logic block being configurable by the firmware to execute functions on the input signals; and

a multiplexer on the base platform, which is coupled to the logic configured in the metal-programmable transistor fabric and the at least one firmware-configurable logic block, and an enable input selectively controlling the multiplexer to output results from either the logic formed in the metal-programmable transistor fabric or the at least one firmware-configurable logic block.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2005
From: DELP, GARY S.; NATION, GEORGE WAYNE
To: LSI LOGIC CORPORATION
Reel/Frame 016388/0328 →
Continuity (1)
Related Publication 20060236292A1 · Oct 19, 2006