Integrated circuit package system including honeycomb molding

1. A method of manufacture of an integrated circuit package system comprising:

providing a substrate with a top surface;

configuring the top surface to include electrical contacts;

attaching an integrated circuit to the top surface; and

depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits over and larger than the electrical contacts, each of the discrete hollow conduits exposing a portion of the substrate and more than one of the electrical contacts.

2. The method as claimed in claim 1 further comprising:

configuring each of the discrete hollow conduits for receiving an electrical connection.

3. The method as claimed in claim 1 further comprising:

forming traces to facilitate the flow of the material.

4. The method as claimed in claim 1 further comprising:

forming traces extending from sides of the integrated circuit.

5. The method as claimed in claim 1 further comprising:

forming an electrical connection within the discrete hollow conduits and contacting the electrical contacts.

6. A method of manufacture of an integrated circuit package system comprising:

providing a substrate with a top surface;

attaching an integrated circuit to the top surface;

configuring the top surface to include electrical contacts formed between a perimeter of the substrate and the integrated circuit; and

depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits over and larger than the electrical contacts, each of the discrete hollow conduits exposing a portion of the substrate and more than one of the electrical contacts.

7. The method as claimed in claim 6 further comprising:

configuring the discrete hollow conduits to include an L-shaped region.

8. The method as claimed in claim 6 further comprising:

configuring the discrete hollow conduits to include a rectangular shaped region.

9. The method as claimed in claim 6 further comprising:

forming traces extending from corners of the integrated circuit.

10. The method as claimed in claim 6 further comprising:

configuring the electrical contacts to include a shape different from the discrete hollow conduits.

11. An integrated circuit package system comprising:

a substrate with a top surface including electrical contacts and an integrated circuit; and

a material over the top surface of the substrate and over the integrated circuit for preventing warpage of the substrate, the material including a discrete hollow conduit over and larger than the electrical contacts with each of the discrete hollow conduit exposing a portion of the substrate and more than one of the electrical contacts.

12. The system as claimed in claim 11 further comprising:

an electrical connection within the discrete hollow conduits.

13. The system as claimed in claim 11 further comprising:

traces between the discrete hollow conduits.

14. The system as claimed in claim 11 further comprising:

traces extending from sides of the integrated circuit.

15. The system as claimed in claim 11 further comprising:

an electrical connection within the discrete hollow conduits and in contact with the electrical contacts.

16. The system as claimed in claim 11 wherein:

the electrical contacts are positioned between a perimeter of the substrate and the integrated circuit.

17. The system as claimed in claim 16 wherein:

the discrete hollow conduits include an L-shaped region.

18. The system as claimed in claim 16 wherein:

the discrete hollow conduits include a rectangular shaped region.

19. The system as claimed in claim 16 further comprising:

traces extending from corners of the integrated circuit.

20. The system as claimed in claim 16 wherein:

the electrical contacts include a shape different from the discrete hollow conduits.