IP Library Granted Patent US 8,941,456
Granted Patent B2
US 8,941,456 · App. 13/545,059 · Granted Jan 27, 2015

EMI suppression with shielded common mode choke

Inventors: Hwangsoo Choi (Fullerton, CA); Mike Lewis (Orange, CA); Shiju Wang (Irvine, CA)
Assignee: Microsemi Corporation
H01F27/362H02M1/44H01F2017/0093H02M2001/123H01F17/062
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Quick Facts
Patent No.
US 8,941,456
App. No.
13/545,059
Granted
Jan 27, 2015
Kind
B2
Abstract

A power supply arrangement constituted of: an isolated power supply having a primary side and a secondary side, the secondary side electrically isolated from the primary side; a common mode choke having a first winding and a second winding wound on a common core, the common mode choke coupled between the primary side of the isolated power supply and an AC mains; and a shielding surrounding the common mode choke, the shielding coupled to a common potential of the secondary side of the isolated power supply.

Claims (12)

1. A power supply arrangement comprising:

an isolated power supply having a primary side and a secondary side, said secondary side electrically isolated from said primary side, such that a common potential of said secondary side is electrically isolated from a common potential of said primary side;

a common mode choke having a first winding and a second winding wound on a common core, said common mode choke coupled between said primary side of said isolated power supply and an AC mains; and

a shielding surrounding said common mode choke, said shielding connected to the electrically isolated common potential of said secondary side of said isolated power supply.

2. The power supply arrangement according to claim 1 , wherein said isolated power supply is a flyback power supply.

3. The power supply arrangement according to claim 1 , wherein said shielding is electrically isolated from each of the first winding and the second winding of said common mode choke, said shielding arranged to provide a capacitive coupling between each of the first winding and the second winding and the common potential of the secondary side of said isolated power supply.

4. A method of electromagnetic interference suppression for use with an isolated power supply having a primary side and a secondary side, the method comprising:

providing a common mode choke having a first winding and a second winding;

shielding said provided common mode choke with a shield arranged to substantially surround both the first winding and the second winding; and

connecting said shield of said provided common mode choke to a common potential of the secondary side of the isolated power supply, said common potential of the secondary side of the isolated power supply electrically isolated from a common potential of the primary side of the isolated power supply.

5. The method of claim 4 , wherein said coupling of said shield provides a capacitive coupling between each of the first winding and the second winding of said provided common mode choke and the common potential of the secondary side of the isolated power supply.

6. The method of claim 4 , wherein said shield arranged to substantially surround both the first winding and the second winding is electrically isolated from each of the first winding and the second winding of said common mode choke.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
SECURITY AGREEMENT Recorded Apr 22, 2015
From: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP; MICROSEMI SEMICONDUCTOR (U.S.) INC.; MICROSEMI SOC CORP.; MICROSEMI FREQUENCY AND TIME CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035477/0057 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2012
From: CHOI, HWANGSOO; LEWIS, MICHAEL; WANG, SHIJU
To: MICROSEMI CORPORATION
Reel/Frame 028630/0277 →
Continuity (2)
Provisional Application 61535076 · Sep 15, 2011
Related Publication 20130069615A1 · Mar 21, 2013