Method of assembly semiconductor device with through-package interconnect
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material. The interconnect can include a contact surface that is substantially co-planar with the active surface of the semiconductor device for providing an electrical connection with the semiconductor device.
1. A method of manufacturing a semiconductor device package, the method comprising:
receiving a semiconductor device in a mold cavity, wherein the semiconductor device includes a conductive feature at an active surface of the semiconductor device, wherein the conductive feature has a contact surface and straight sidewalls that are transverse to the contact surface and project away from the active surface of the semiconductor device by a distance;
disposing a spacer between a molding surface in the mold cavity and the active surface of the semiconductor device;
pressing a plate of a molding apparatus towards the active surface of the semiconductor device to contact the spacer with at least a portion of the conductive feature.
2. The method of claim 1 wherein flowing the encapsulant comprises injecting the encapsulant in the mold cavity.
3. The method of claim 1 wherein disposing the spacer comprises disposing a spacer material on the molding surface in the mold cavity.
4. The method of claim 1 wherein disposing the spacer comprises laminating a spacer material on the molding surface of the mold.
5. The method of claim 1 wherein the encapsulant is between the molding surface of the mold cavity and the active surface of the semiconductor device, and wherein disposing the spacer comprises disposing a spacer material on an active surface of the encapsulant.
6. A method of manufacturing a semiconductor device package, the method comprising:
providing a semiconductor device in a mold cavity, wherein the semiconductor device includes a conductive feature extending from the semiconductor device and including an outermost surface;
flowing an encapsulant in the mold cavity; and
pressing a plate of a molding apparatus to move a spacer material on the plate of the molding apparatus towards the semiconductor device to displace at least a portion of the encapsulant, and contact at least a portion of the spacer material with the outermost surface of the conductive feature.