FinFET low resistivity contact formation method
A contact structure of a semiconductor device is provided. The contact structure for a semiconductor device comprises a substrate comprising a major surface and a trench below the major surface; a strained material filling the trench, wherein a lattice constant of the strained material is different from a lattice constant of the substrate, and wherein a surface of the strained material has received a passivation treatment; an inter-layer dielectric (ILD) layer having an opening over the strained material, wherein the opening comprises dielectric sidewalls and a strained material bottom; a dielectric layer coating the sidewalls and bottom of the opening, wherein the dielectric layer has a thickness ranging from 1 nm to 10 nm; a metal barrier coating an opening of the dielectric layer; and a metal layer filling a coated opening of the dielectric layer.
1. A device comprising:
a substrate, the substrate comprising a semiconductor material;
a dielectric layer over the substrate, the dielectric layer having an opening, the semiconductor material being exposed in the opening;
a metal oxide layer coating sidewalls and a bottom of the opening, wherein the metal oxide layer has a thickness ranging from 1 nm to 10 nm, wherein the metal oxide layer directly contacts the semiconductor material; and
a metal layer in the opening over the metal oxide layer.
2. The device of claim 1 , wherein the semiconductor material comprises an epitaxial source/drain region, and wherein the metal oxide layer is over the epitaxial source/drain region.
3. The device of claim 2 , wherein the epitaxial source/drain region have an upper surface higher than an upper surface of the substrate below a gate structure.
4. The device of claim 2 , wherein the epitaxial source/drain region have a lattice constant different than an underlying semiconductor material.
5. The device of claim 1 , wherein the metal oxide layer comprises an oxide of Ti, Al, Zr, Hf, Ta, In, Ni, Be, Mg, Ca, Y, Ba, Sr, Sc, or Ga.
6. The device of claim 1 , wherein the dielectric layer comprises silicon oxide, silicon nitride, silicon oxynitride, phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), spin-on glass (SOG), fluorinated silica glass (FSG), carbon doped silicon oxide and/or combinations thereof.
7. The device of claim 1 , wherein the metal layer comprises Ta, Ti, Hf, Zr, Ni, W, Co, Cu, or Al.
8. A device comprising:
a substrate comprising a semiconductor conductive region;
a gate stack on the substrate;
a dielectric layer having an opening over the semiconductor conductive region, wherein the opening comprises sidewalls and a bottom, the bottom of the opening comprising the semiconductor conductive region;
a metal oxide layer coating the sidewalls and bottom of the opening, the metal oxide layer directly contacting the semiconductor conductive region; and
a metal layer over the metal oxide layer, the metal layer extending into the opening in the dielectric layer.
9. The device of claim 8 , wherein the semiconductor conductive region comprises a semiconductor layer disposed in a recess of a semiconductor substrate.
10. The device of claim 9 , wherein a lattice constant of the semiconductor layer is different than a lattice constant of the semiconductor substrate.
11. The device of claim 10 , wherein the semiconductor layer extends above an uppermost surface of the semiconductor substrate.
12. The device of claim 8 , wherein a thickness of the metal oxide layer is less than 10 nm.
13. The device of claim 8 , wherein the metal oxide layer comprises an oxide of Ti, Al, Zr, Hf, Ta, In, Ni, Be, Mg, Ca, Y, Ba, Sr, Sc, or Ga.
14. The device of claim 8 , wherein the metal oxide layer comprises TiO, TiO 2 , or Ti 2 O 3 .
15. A device comprising:
a semiconductor substrate;
a gate structure over the semiconductor substrate;
a strained semiconductor material on opposing sides of the gate structure;
a dielectric layer over the semiconductor substrate and the strained semiconductor material, the dielectric layer having an opening over the strained semiconductor material;
a metal oxide layer on sidewalls and a bottom of the opening, the metal oxide layer directly contacting the strained semiconductor material; and
a metal layer in the opening, wherein the metal oxide layer is interposed between the metal layer and the strained semiconductor material.
16. The device of claim 15 , wherein the metal oxide layer has a thickness of 1 nm to 10 nm along the bottom of the opening.
17. The device of claim 15 , wherein the metal oxide layer completely separates the metal layer from the dielectric layer.
18. The device of claim 15 , wherein the strained semiconductor material is raised above an uppermost surface of the semiconductor substrate.
19. The device of claim 18 , further comprising spacers adjacent the gate structure, wherein the strained semiconductor material extends along a sidewall of the spacers.
20. The device of claim 15 , wherein the metal oxide layer comprises an oxide of Ti, Al, Zr, Hf, Ta, In, Ni, Be, Mg, Ca, Y, Ba, Sr, Sc, or Ga.