3D semiconductor device and structure
A 3D semiconductor device, the device including: a first single crystal layer; at least one first metal layer above the first single crystal layer; a second metal layer above the first metal layer; a plurality of first transistors atop the second metal layer; a plurality of second transistors atop the second transistors; a plurality of third transistors atop the second transistors; a third metal layer above the plurality of third transistors: a fourth metal layer above the third metal layer; and a second single crystal layer above the fourth metal layer; and a plurality of connecting metal paths from the fourth metal layer to the second metal layer, where at least one of the plurality of third transistors is aligned to at least one of the plurality of first transistors with less than 40 nm alignment error, where the fourth metal layer is providing global power distribution to the device.
1. A 3D semiconductor device, the device comprising:
a first single crystal layer;
at least one first metal layer above said first single crystal layer;
a second metal layer above said first metal layer;
a plurality of first transistors atop said second metal layer;
a plurality of second transistors atop said second transistors;
a plurality of third transistors atop said second transistors;
a third metal layer above said plurality of third transistors;
a fourth metal layer above said third metal layer; and
a second single crystal layer above said fourth metal layer; and
a plurality of connecting metal paths from said fourth metal layer to said second metal layer,
wherein at least one of said plurality of third transistors is aligned to at least one of said plurality of first transistors with less than 40 nm alignment error,
wherein said fourth metal layer is providing global power distribution to said device and said fourth metal layer is at least twice as thick as said third metal layer,
wherein said second metal layer provides local power distribution to said device and said second metal layer is substantially thicker than said first metal layer and said third metal layer,
wherein at least one of said connecting metal paths comprises a through layer via,
wherein said through layer via comprises a material and a majority of said material comprises tungsten,
wherein at least one of said plurality of second transistors comprises a first source, a first channel and a first drain,
wherein said first source, said first channel and said first drain have the same dopant type,
wherein said device comprises an array of memory cells, and
wherein at least one of said memory cells comprises one of said third transistors.
2. The 3D semiconductor device according to claim 1 ,
wherein at least one of said plurality of second transistors is self-aligned to at least one of said plurality of third transistors, being processed following the same lithography step.
3. The 3D semiconductor device according to claim 1 ,
wherein at least one of said plurality of second transistors comprises polysilicon.
4. The 3D semiconductor device according to claim 1 ,
wherein said second single crystal layer comprises a plurality of fourth transistors, and
wherein said device comprises memory periphery circuits comprising said fourth transistors.
5. The 3D semiconductor device according to claim 1 ,
wherein said second single crystal layer comprises a plurality of fourth transistors, and
wherein said device comprises Input/Output circuits comprising said fourth transistors.
6. The 3D semiconductor device according to claim 1 ,
wherein at least one of said plurality of second transistors comprises a gate all around structure, and
wherein formation of said gate all around structure comprises Atomic Layer Deposition (ALD).
7. The 3D semiconductor device according to claim 1 ,
wherein said second single crystal layer comprises a plurality of through layer vias.
8. A 3D semiconductor device, the device comprising:
a first single crystal layer comprising a plurality of first transistors;
at least one first metal layer interconnecting said plurality of first transistors,
wherein said interconnecting comprises forming a plurality of logic gates;
a second metal layer above said first metal layer;
a plurality of second transistors atop said second metal layer;
a third metal layer above said plurality of second transistors;
a plurality of third transistors atop said second transistors;
a fourth metal layer above said third metal layer; and
a plurality of connecting metal paths from said fourth metal layer to said second metal layer,
wherein at least one of said plurality of third transistors is aligned to at least one of said plurality of first transistors with less than 40 nm alignment error,
wherein said fourth metal layer is providing global power distribution to said device and said fourth metal layer is at least twice as thick as said third metal layer,
wherein said second metal layer provides local power distribution to said device and is substantially thicker than said first metal layer and said third metal layer,
wherein at least one of said connecting metal paths comprises a through layer via,
wherein said through layer via comprises a material and a majority of said material comprises tungsten,
wherein at least one of said second transistors comprises a first source, a first channel and a first drain,
wherein said first source, said first channel and said first drain have the same dopant type,
wherein said device comprises an array of memory cells, and
wherein at least one of said memory cells comprises one of said third transistors.
9. The 3D semiconductor device according to claim 8 ,
wherein said array of memory cells comprises NAND type memory.
10. The 3D semiconductor device according to claim 8 ,
wherein at least one of said plurality of second transistors is self-aligned to at least one of said plurality of third transistors, being processed following the same lithography step.
11. The 3D semiconductor device according to claim 8 ,
wherein at least one of said plurality of second transistors comprises polysilicon.
12. The 3D semiconductor device according to claim 8 ,
wherein fabrication processing of said device comprises first processing said first transistors followed by processing said second transistors and said third transistors above said first transistors, and
wherein said processing said first transistors accounts for the temperature associated with said processing said second transistors and said processing said third transistors by adjusting a process thermal budget of said first transistors accordingly.
13. The 3D semiconductor device according to claim 8 ,
wherein said plurality of logic gates comprise memory periphery circuits, and said memory periphery circuits comprise control of said array of memory cells.
14. The 3D semiconductor device according to claim 8 , further comprising:
a second single crystal layer above said fourth metal layer.
15. A 3D semiconductor device, the device comprising:
a first single crystal layer comprising a plurality of first transistors;
at least one first metal layer interconnecting said plurality of first transistors,
wherein said interconnecting comprises forming a plurality of logic gates;
a second metal layer above said first metal layer;
a plurality of second transistors atop said second metal layer;
a third metal layer above said plurality of second transistors;
a plurality of third transistors atop said second transistors;
a fourth metal layer above said third metal layer; and
a plurality of connecting metal paths from said fourth metal layer to said second metal layer,
wherein at least one of said plurality of third transistors is aligned to at least one of said plurality of first transistors with less than 40 nm alignment error,
wherein said fourth metal layer is providing global power distribution to said device and said fourth metal layer is at least twice as thick as said third metal layer,
wherein said second metal layer provides local power distribution to said device and is substantially thicker than said first metal layer and said third metal layer,
wherein at least one of said connecting metal paths comprises a through layer via, and
wherein said through layer via comprises a material and a majority of said material comprises tungsten.
16. The 3D semiconductor device according to claim 15
wherein at least one of said plurality of third transistors comprises polysilicon.
17. The 3D semiconductor device according to claim 15 ,
wherein at least one of said plurality of third transistors comprises a source, a channel and a drain, and
wherein said source, said channel and said drain have the same dopant type.
18. The 3D semiconductor device according to claim 15 ,
wherein said device comprises more than one NAND type memory cell, and
wherein said NAND type memory cell comprises at least one of said plurality of second transistors.
19. The 3D semiconductor device according to claim 15 ,
wherein at least one of said plurality of second transistors is self-aligned to at least one of said plurality of third transistors, being processed following the same lithography step.
20. The 3D semiconductor device according to claim 15 , further comprising:
a connecting via through said first single crystal layer.