IP Library Granted Patent US 10,980,539
Granted Patent B2
US 10,980,539 · App. 14/871,087 · Granted Apr 20, 2021

Implantable adjunct comprising bonded layers

Inventors: Jason L. Harris (Lebanon, OH); Frederick E. Shelton, IV (Hillsboro, OH); Michael J. Vendely (Lebanon, OH); Jerome R. Morgan (Cincinnati, OH); Dennis D. Jamiolkowski (Long Valley, NJ); Mark S. Zeiner (Mason, OH)
Assignee: Ethicon LLC
A61B17/105A61B17/068A61B17/0644A61B17/07207A61B17/07292A61B2017/00477A61B2017/00526A61B2017/00955A61B2017/00964A61B2017/07235A61B2017/07242A61B2017/07271A61B2017/07278
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Quick Facts
Patent No.
US 10,980,539
App. No.
14/871,087
Filed
Sep 30, 2015
Granted
Apr 20, 2021
Kind
B2
Art Unit
3731
USPC
227/176.1
Abstract

A staple cartridge assembly comprising an implantable adjunct or layer assembly is disclosed. The implantable adjunct comprises a plurality of layers, wherein at least one of the layers has been melted to bond with one or more of the other layers of the implantable adjunct.

Claims (46)

1. A staple cartridge assembly, comprising:

a cartridge body comprising a deck;

staples removably stored in said cartridge body; and

an implantable adjunct positioned over said deck, comprising:

a first outer layer comprised of interwoven fibers;

a second outer layer comprised of interwoven fibers; and

a bonding layer positioned intermediate said first outer layer and said second outer layer, wherein said bonding layer is comprised of a meltable material having a threshold melt temperature, wherein said implantable adjunct has previously been exposed to a temperature in excess of said threshold melt temperature such that said bonding layer is bonded with said first outer layer and said second outer layer, wherein said bonding layer comprises a first bonding layer, and wherein said implantable adjunct further comprises:

a spacer layer comprised of a material having a melt temperature which is greater than said threshold melt temperature; and

a second bonding layer comprised of said meltable material, wherein said first bonding layer is positioned intermediate said first outer layer and said spacer layer, and wherein said second bonding layer is positioned intermediate said second outer layer and said spacer layer.

2. The staple cartridge assembly of claim 1 , wherein said spacer layer comprises a plurality of openings defined therein which are configured to receive melted portions of said first bonding layer and said second bonding layer when said implantable adjunct is exposed to a temperature in excess of said threshold melt temperature.

3. The staple cartridge assembly of claim 2 , wherein said melted portions of said first bonding layer have penetrated said first outer layer, and wherein said melted portions of said second bonding layer have penetrated said second outer layer.

4. The staple cartridge assembly of claim 2 , wherein said plurality of openings are arranged in a first density in a first portion of said spacer layer and a second density in a second portion of said spacer layer, wherein said first density is greater than said second density, and wherein a bond between said first portion and said first and second bonding layers is stronger than a bond between said second portion and said first and second bonding layers.

5. The staple cartridge assembly of claim 1 , wherein said spacer layer comprises a lofted weave.

6. A staple cartridge assembly, comprising:

a cartridge body comprising a deck;

staples removably stored in said cartridge body; and

an implantable adjunct positioned over said deck, comprising:

a first outer layer comprised of interwoven fibers;

a second outer layer comprised of interwoven fibers; and

a bonding layer positioned intermediate said first outer layer and said second outer layer, wherein said bonding layer is comprised of a meltable material having a threshold melt temperature, wherein said implantable adjunct has previously been exposed to a temperature in excess of said threshold melt temperature such that said bonding layer is bonded with said first outer layer and said second outer layer, and wherein said bonding layer comprises a PDS film.

7. A staple cartridge assembly, comprising:

a cartridge body comprising a deck;

staples removably stored in said cartridge body; and

an implantable adjunct positioned over said deck, comprising:

a first outer layer comprised of interwoven fibers;

a second outer layer comprised of interwoven fibers; and

a bonding layer positioned intermediate said first outer layer and said second outer layer, wherein said bonding layer is comprised of a meltable material having a threshold melt temperature, wherein said implantable adjunct has previously been exposed to a temperature in excess of said threshold melt temperature such that said bonding layer is bonded with said first outer layer and said second outer layer, and wherein said bonding layer comprises apertures defined therein.

8. A staple cartridge assembly, comprising:

a cartridge body comprising a deck;

staples removably stored in said cartridge body; and

an implantable adjunct positioned over said deck, comprising:

a first outer layer comprised of interwoven fibers;

a second outer layer comprised of interwoven fibers; and

a bonding layer positioned intermediate said first outer layer and said second outer layer, wherein said bonding layer is comprised of a meltable material having a threshold melt temperature, wherein said implantable adjunct has previously been exposed to a temperature in excess of said threshold melt temperature such that said bonding layer is bonded with said first outer layer and said second outer layer, wherein said first outer layer and said second outer layer include meltable portions which are comprised of said meltable material, and wherein said meltable portions of said first outer layer and said second outer layer are merged with said bonding layer after said implantable adjunct is exposed to a temperature in excess of said threshold melt temperature.

9. A staple cartridge assembly, comprising:

a cartridge body comprising a deck;

staples removably stored in said cartridge body; and

an implantable layer assembly positioned over said deck, comprising:

a first layer;

a second layer; and

a bonding layer positioned intermediate said first layer and said second layer, wherein said bonding layer is comprised of a meltable material having a threshold melt temperature, and wherein said implantable layer assembly has been previously exposed to a temperature at least equaling said threshold melt temperature such that said bonding layer is bonded with at least one of said first layer and said second layer, wherein said bonding layer comprises a first bonding layer, and wherein said implantable layer assembly further comprises:

a spacer layer comprised of a material having a melt temperature which is greater than said threshold melt temperature; and

a second bonding layer comprised of said meltable material, wherein said first bonding layer is positioned intermediate said first layer and said spacer layer, and wherein said second bonding layer is positioned intermediate said second layer and said spacer layer.

10. The staple cartridge assembly of claim 9 , wherein said spacer layer comprises a plurality of openings defined therein which are configured to receive melted portions of said first bonding layer and said second bonding layer when said implantable layer assembly is exposed to a temperature that at least equals said threshold melt temperature.

11. The staple cartridge assembly of claim 10 , wherein said plurality of openings are arranged in a first density in a first portion of said spacer layer and a second density in a second portion of said spacer layer, wherein said first density is greater than said second density, and wherein a bond between said first portion and said first and second bonding layers is stronger than a bond between said second portion and said first and second bonding layers.

12. The staple cartridge assembly of claim 10 , wherein said melted portions of said first bonding layer have penetrated said first layer, and wherein said melted portions of said second bonding layer have penetrated said second layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2021
From: ETHICON LLC
To: CILAG GMBH INTERNATIONAL
Reel/Frame 056983/0569 →
CHANGE OF NAME Recorded Dec 14, 2017
From: ETHICON ENDO-SURGERY, LLC
To: ETHICON LLC
Reel/Frame 045644/0357 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2015
From: HARRIS, JASON L.; SHELTON, FREDERICK E., IV; VENDELY, MICHAEL J.; MORGAN, JEROME R.; JAMIOLKOWSKI, DENNIS D.; ZEINER, MARK S.
To: ETHICON ENDO-SURGERY, LLC
Reel/Frame 037324/0663 →
Continuity (1)
Related Publication 20170086838A1 · Mar 30, 2017
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