Granted Patent
S1
US 1,129,517 · App. 29/986,121 · Granted Jun 9, 2026
Physical vapor deposition sputtering target
Inventors:
Shane Lavan (Santa Clara, CA); Madan Kumar Shimoga Mylarappa (Bengaluru, IN); Sundarapandian Ramalinga Vijayalakshmi Reddy (Bangalore, IN); Avinash Nayak (Bangalore, IN); Wei Dou (Sunnyvale, CA); Yong Cao (San Jose, CA); Kirankumar Neelasandra Savandaiah (Bangalore, IN); Mingdong Li (Santa Clara, CA)
Assignee:
Applied Materials Inc.
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Claims (1)
The ornamental design for a physical vapor deposition sputtering target, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jan 31, 2025
From: LAVAN, SHANE; SHIMOGA MYLARAPPA, MADAN KUMAR; REDDY, SUNDARAPANDIAN RAMALINGA VIJAYALAKSHMI; NAYAK, AVINASH; DOU, WEI; CAO, YONG; SAVANDAIAH, KIRANKUMAR NEELASANDRA; LI, MINGDONG
To: APPLIED MATERIALS, INC.
Reel/Frame 070068/0963 →
Continuity (1)
Division
29769610
· Feb 6, 2021
References Cited (175)
US 5320728A
· Tepman
· 1994
[cited by applicant]
US D351450S
· Maryska
· 1994
[cited by applicant]
US D363464S
· Fukasawa et al.
· 1995
[cited by applicant]
US D376744S
· Eisenblatter
· 1996
[cited by applicant]
US D381030S
· Tepman
· 1997
[cited by applicant]
US D395483S
· Maryska
· 1998
[cited by applicant]
US D423026S
· Shimazu
· 2000
[cited by applicant]
US D425919S
· Burkhart et al.
· 2000
[cited by applicant]
US 6086725A
· Abburi et al.
· 2000
[cited by applicant]
US 6114216A
· Yieh et al.
· 2000
[cited by applicant]
US D446231S
· Kuraoka et al.
· 2001
[cited by applicant]
US 6390905B1
· Korovin et al.
· 2002
[cited by applicant]
US 6599399B2
· Xu
· 2003
[cited by examiner]
US 6659850B2
· Korovin et al.
· 2003
[cited by applicant]
US D487254S
· Suenaga
· 2004
[cited by applicant]
US D496951S
· Brasseur et al.
· 2004
[cited by applicant]
US 6815352B1
· Tamura et al.
· 2004
[cited by applicant]
US D503729S
· Leeuw et al.
· 2005
[cited by applicant]
US D529057S
· Willson
· 2006
[cited by examiner]
US D553104S
· Oohashi et al.
· 2007
[cited by applicant]
US D557226S
· Uchino
· 2007
[cited by applicant]
US D559066S
· Tano et al.
· 2008
[cited by applicant]
US D559993S
· Nagakubo et al.
· 2008
[cited by applicant]
US D559994S
· Nagakubo et al.
· 2008
[cited by applicant]
US D562856S
· Hawley et al.
· 2008
[cited by applicant]
US D570310S
· Sasaki et al.
· 2008
[cited by applicant]
US D571383S
· Ota et al.
· 2008
[cited by applicant]
US D571831S
· Ota et al.
· 2008
[cited by applicant]
US D571833S
· Ota et al.
· 2008
[cited by applicant]
US D572733S
· Ota et al.
· 2008
[cited by applicant]
US 7402098B2
· Severson et al.
· 2008
[cited by applicant]
US D582949S
· Yamashita
· 2008
[cited by applicant]
US D584591S
· Tano et al.
· 2009
[cited by applicant]
US D592029S
· Tano et al.
· 2009
[cited by applicant]
US D592030S
· Tano et al.
· 2009
[cited by applicant]
US D600660S
· Sato
· 2009
[cited by applicant]
US D600989S
· Tano et al.
· 2009
[cited by applicant]
US D614593S
· Lee et al.
· 2010
[cited by applicant]
US D616389S
· Takahashi
· 2010
[cited by applicant]
US D616390S
· Sato
· 2010
[cited by applicant]
US D633452S
· Namiki et al.
· 2011
[cited by applicant]
US D649126S
· Takahashi
· 2011
[cited by applicant]
US D669509S
· Krink et al.
· 2012
[cited by applicant]
US 8371904B2
· Jindal et al.
· 2013
[cited by applicant]
US D678745S
· Nguyen
· 2013
[cited by applicant]
US 8398833B2
· Lee et al.
· 2013
[cited by applicant]
US D683806S
· Dueck
· 2013
[cited by applicant]
US D687790S
· Krishnan et al.
· 2013
[cited by applicant]
US D687791S
· Krishnan et al.
· 2013
[cited by applicant]
US D691974S
· Osada
· 2013
[cited by applicant]
US D694790S
· Matsumoto et al.
· 2013
[cited by applicant]
US D703162S
· Tamaso
· 2014
[cited by applicant]
US D716742S
· Jang et al.
· 2014
[cited by applicant]
US D724553S
· Choi et al.
· 2015
[cited by applicant]
US D732094S
· Jussel et al.
· 2015
[cited by applicant]
US D741823S
· Tateno et al.
· 2015
[cited by applicant]
US D741921S
· Jarvius et al.
· 2015
[cited by applicant]
US D750728S
· Kremer
· 2016
[cited by applicant]
US D754468S
· Nason
· 2016
[cited by applicant]
US D767234S
· Kirkland et al.
· 2016
[cited by applicant]
US D769200S
· Fukushima et al.
· 2016
[cited by applicant]
US 9475996B2
· Mandle
· 2016
[cited by applicant]
US D770992S
· Tauchi et al.
· 2016
[cited by applicant]
US D787458S
· Kim et al.
· 2017
[cited by applicant]
US D790039S
· Hawrylchak et al.
· 2017
[cited by applicant]
US D790041S
· Jang et al.
· 2017
[cited by applicant]
US D793572S
· Kozuka et al.
· 2017
[cited by applicant]
US D794753S
· Miller
· 2017
[cited by applicant]
US D795208S
· Sasakl et al.
· 2017
[cited by applicant]
US D796458S
· Jang et al.
· 2017
[cited by applicant]
US D797067S
· Zhang et al.
· 2017
[cited by applicant]
US D797691S
· Joubert et al.
· 2017
[cited by applicant]
US D798248S
· Hanson et al.
· 2017
[cited by applicant]
US D801942S
· Riker et al.
· 2017
[cited by applicant]
US D804230S
· Allan et al.
· 2017
[cited by applicant]
US D808349S
· Fukushima et al.
· 2018
[cited by applicant]
US D810705S
· Krishnan et al.
· 2018
[cited by applicant]
US D813181S
· Okajima et al.
· 2018
[cited by applicant]
US D819580S
· Krishnan et al.
· 2018
[cited by applicant]
US D825504S
· Zhang et al.
· 2018
[cited by applicant]
US D825505S
· Hanson et al.
· 2018
[cited by applicant]
US D830435S
· Wakisaka et al.
· 2018
[cited by applicant]
US D830981S
· Jeong et al.
· 2018
[cited by applicant]
US D836572S
· Riker et al.
· 2018
[cited by applicant]
US D837755S
· Riker et al.
· 2019
[cited by applicant]
US D839224S
· Yamaki et al.
· 2019
[cited by applicant]
US D846514S
· Yoshida et al.
· 2019
[cited by applicant]
US D851613S
· Johanson et al.
· 2019
[cited by applicant]
US D868124S
· Riker et al.
· 2019
[cited by applicant]
US D869409S
· Riker et al.
· 2019
[cited by applicant]
US D877101S
· Johanson et al.
· 2020
[cited by applicant]
US D880437S
· Lee et al.
· 2020
[cited by applicant]
US D888903S
· Gunther et al.
· 2020
[cited by applicant]
US D890572S
· Saiki
· 2020
[cited by examiner]
US D891382S
· Koppa et al.
· 2020
[cited by applicant]
US D893441S
· Rao et al.
· 2020
[cited by applicant]
US D894137S
· Johanson et al.
· 2020
[cited by applicant]
US D902165S
· Johanson et al.
· 2020
[cited by applicant]
US D908645S
· Savandaiah et al.
· 2021
[cited by applicant]
US D913979S
· Babu et al.
· 2021
[cited by applicant]
US D913980S
· Lee et al.
· 2021
[cited by applicant]
US D922229S
· Jun et al.
· 2021
[cited by applicant]
US D933725S
· Koppa et al.
· 2021
[cited by applicant]
US D940765S
· Gunther et al.
· 2022
[cited by applicant]
US D946638S
· Riker et al.
· 2022
[cited by applicant]
US D966357S
· Gunther et al.
· 2022
[cited by applicant]
US D970566S
· Riker et al.
· 2022
[cited by applicant]
US D971149S
· Smith
· 2022
[cited by examiner]
US D980813S
· Shin
· 2023
[cited by examiner]
US D980814S
· Shin
· 2023
[cited by examiner]
US D981970S
· Inada
· 2023
[cited by examiner]
US D984972S
· Shi
· 2023
[cited by applicant]
US 20070076345A1
· Bang
· 2007
[cited by applicant]
US 20080173541A1
· Lee et al.
· 2008
[cited by applicant]
US 20090260982A1
· Riker et al.
· 2009
[cited by applicant]
US 20100170786A1
· Wang et al.
· 2010
[cited by applicant]
US 20120263569A1
· Priddy et al.
· 2012
[cited by applicant]
US 20130316628A1
· Jang et al.
· 2013
[cited by applicant]
US 20150357169A1
· Yuan et al.
· 2015
[cited by applicant]
US 20160002776A1
· Nal et al.
· 2016
[cited by applicant]
US 20240133023A1
· Marro
· 2024
[cited by examiner]
US 20240271271A1
· Wang
· 2024
[cited by examiner]
US 20250163566A1
· Song
· 2025
[cited by examiner]
CN 206573738U
· 2017
[cited by applicant]
CN 306731322S
· 2021
[cited by applicant]
JP D1420846
· 2011
[cited by applicant]
JP D1421157
· 2011
[cited by applicant]
JP D1422692
· 2014
[cited by applicant]
JP D1640252
· 2019
[cited by applicant]
TW 223429
· 1994
[cited by applicant]
TW 223430
· 1994
[cited by applicant]
TW D146490
· 2012
[cited by applicant]
TW 1888980001
· 2016
[cited by applicant]
TW D197321
· 2019
[cited by applicant]
TW D197827
· 2019
[cited by applicant]
TW D202101
· 2020
[cited by applicant]
Applied Materials, (date retrieved Jan. 7, 2026), Endura ALPS PVD, Appliedmaterials.com, URL: (https://www.appliedmaterials.com/us/en/product-library/endura-alps-pvd-alps-co-ni.html), (Year: 2026).
[cited by examiner]
Gasworld, (date posted Nov. 13, 2023), Semiconductor supply chain problems: Running rampant?, Gasworld.com, URL: (https://www.gasworld.com/feature/semiconductor-supply-chain-problems-running-rampant/2130290.article/), (…
[cited by examiner]
Ulvac, (date retrieved Jan. 7, 2026), Sputtering Targets for Semiconductor Applications, Ulvac.co.jp, URL: (https://www.ulvac.co.jp/en/products/materials/for_semiconductor/), (Year: 2026).
[cited by examiner]
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
[cited by applicant]
Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.
[cited by applicant]
Search Report for Taiwan Design Application No. 1077303086 dated Jul. 6, 2018.
[cited by applicant]
Sputtering Targets, posted at Angstrom Sciences, posting date May 5, 2016. Site visited Apr. 1, 2019. URL: <https://web.archive.org/web/20160505015447/https://www.angstromsciences.com/sputtering-targets> (Year: 2016).
[cited by applicant]
Sputtering Targets for LSis, posted at JX Nippon Mining & Metals, posting date Mar. 22, 2016. Site visited Apr. 1, 2019. URL: <https://web .archive .org/web/20160322055046/http :1/www.nmm.jx-group.co.jp/english/products…
[cited by applicant]
Search Report for Taiwan Design Application No. 110302622 dated May 21, 2021.
[cited by applicant]
Search Report for Taiwan Design Application No. 113300257 dated May 4, 2023.
[cited by applicant]
The basics of Physical Vapour Deposition _ Double Stone Steel, No Announcement Date [online], retrieved on May 31, 2024, retrieved from internet, https://web.archive.org/web/20170605050031/https://www.doublestonesteel.c…
[cited by applicant]