IP Library › Granted Patent US 1,071,886
Granted Patent S1
US 1,071,886 · App. 29/823,917 · Granted Apr 22, 2025

Substrate support for a substrate processing chamber

Inventors: Zhixiu Liang (Fremont, CA); Michael Sterling Jackson (Sunnyvale, CA); Jiang Lu (Milpitas, CA); Cheng-Hsiung Matthew Tsai (Cupertino, CA); Tomoharu Matsushita (Chiba, JP); Zubin Huang (Santa Clara, CA)
Assignee: APPLIED MATERIALS, INC.
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Quick Facts
Patent No.
US 1,071,886
App. No.
29/823,917
Granted
Apr 22, 2025
Kind
S1
Claims (1)

The ornamental design for a substrate support for a substrate processing chamber, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2022
From: LIANG, ZHIXIU; JACKSON, MICHAEL STERLING; LU, JIANG; TSAI, CHENG-HSIUNG MATTHEW; MATSUSHITA, TOMOHARU; HUANG, ZUBIN
To: APPLIED MATERIALS, INC.
Reel/Frame 058998/0340 →
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