Through-stack contact via structures for a three-dimensional memory device and methods of forming the same
A first-tier structure includes a first vertically alternating sequence of first continuous insulating layers and first continuous sacrificial material layers and a first-tier retro-stepped dielectric material portion overlying first stepped surfaces of the first vertically alternating sequence. A second vertically alternating sequence of second continuous insulating layers and second continuous sacrificial material layers is formed over the first-tier structure. A vertically alternating stack of insulating plates and dielectric material is formed over the first-tier retro-stepped dielectric material portion. Alternatively, dielectric pillar structures may be formed in lieu of the vertically alternating stack. After formation of memory stack structures, electrically conductive layers replace portions of the first and second continuous sacrificial material layers. Contact via structures are formed through the vertically alternating stack or the dielectric pillar structures, through the first retro-stepped dielectric material portion, and directly on a first subset of the electrically conductive layers.
1. A three-dimensional memory device comprising:
a first-tier alternating stack of first insulating layers and first electrically conductive layers located over a substrate;
a first-tier retro-stepped dielectric material portion overlying first stepped surfaces of the first-tier alternating stack;
a second-tier alternating stack of second insulating layers and second electrically conductive layers;
first memory stack structures located in a first memory region in which each layer of the first-tier alternating stack and each layer of the second-tier alternating stack are present, wherein each of the first memory stack structures comprises a respective memory film and a respective vertical semiconductor channel;
a combination of a vertically alternating stack of insulating plates and dielectric material plates and a dielectric wall structure that at least partially laterally surrounds the vertically alternating stack, wherein the combination is located within a contact via region which overlies the first-tier retro-stepped dielectric material portion and which is laterally surrounded by the second-tier alternating stack; and
first contact via structures vertically extending through the vertically alternating stack and through the first-tier retro-stepped dielectric material portion, wherein each of the first contact via structures contacts a corresponding one of the first electrically conductive layers.
2. The three-dimensional memory device of claim 1 , wherein each of the first contact via structures contacts sidewalls of the insulating plates and sidewalls of the dielectric material plates.
3. The three-dimensional memory device of claim 1 , wherein each of the first contact via structures contacts a respective sidewall of the first retro-stepped dielectric material portion.
4. The three-dimensional memory device of claim 1 , wherein a bottommost surface of the vertically alternating stack of the insulating plates and the dielectric material plates contacts a top surface of the first-tier retro-stepped dielectric material portion.
5. The three-dimensional memory device of claim 1 , wherein a bottom surface of the dielectric wall structure contacts a top surface of the first-tier retro-stepped dielectric material portion.
6. The three-dimensional memory device of claim 1 , wherein:
an entirety of each inner sidewall of the dielectric wall structure is in contact with the vertically alternating stack of the insulating plates and the dielectric material plates; and
an entirety of each outer sidewall of the dielectric wall structure is in contact with the second-tier alternating stack.
7. The three-dimensional memory device of claim 1 , further comprising:
a second-tier retro-stepped dielectric material portion overlying second stepped surfaces of the second-tier alternating stack; and
second contact via structures vertically extending through the second-tier retro-stepped dielectric material portion, wherein each of the second contact via structures contacts a corresponding one of the second electrically conductive layers.
8. The three-dimensional memory device of claim 1 , further comprising second memory stack structures located in a second memory region in which each layer of the first-tier alternating stack and each layer of the second-tier alternating stack are present, wherein the first memory region and the second memory region are laterally spaced from each other by an inter-array region in which the first-tier retro-stepped dielectric material portion and the dielectric wall structure are located.
9. The three-dimensional memory device of claim 8 , wherein each layer within the first-tier alternating stack and the second-tier alternating stack comprises a respective strip portion located within the inter-array region and laterally extending continuously from the first memory array region to the second memory array region.
10. The three-dimensional memory device of claim 9 , further comprising:
lower-level metal interconnect structures embedded in lower-level dielectric material layers that are located between the first-tier alternating stack and the substrate; and
laterally-isolated vertical interconnection structures vertically extending through the strip portions of the first-tier alternating stack and the second-tier alternating stack and contacting a respective one of the lower-level metal interconnect structures.
11. The three-dimensional memory device of claim 1 , wherein:
the first stepped surfaces comprise vertical steps of the first-tier alternating stack that are laterally spaced apart along a first horizontal direction and vertically offset from each other; and
the three-dimensional memory device further comprises a first backside trench fill structure that laterally extends along the first horizontal direction and contacts each layer within the first-tier alternating stack and the second-tier alternating stack and contacting a sidewall of the first-tier retro-stepped dielectric material portion.
12. The three-dimensional memory device of claim 11 , further comprising a second backside trench fill structure that laterally extends along the first horizontal direction, contacting each layer within the first-tier alternating stack and the second-tier alternating stack, and laterally spaced from the first-tier retro-stepped dielectric material portion, wherein the dielectric wall structure is laterally offset from each of the first backside trench fill structure and the second backside trench fill structure.
13. The three-dimensional memory device of claim 1 , wherein:
each of the insulating plates has a horizontal surface within a same horizontal plane including a horizontal surface of a respective second insulating layer within the second-tier alternating stack; and
the insulating plates and the second insulating layers have a same material composition.