Display device including transistor and manufacturing method thereof
An object is to provide a display device which operates stably with use of a transistor having stable electric characteristics. In manufacture of a display device using transistors in which an oxide semiconductor layer is used for a channel formation region, a gate electrode is further provided over at least a transistor which is applied to a driver circuit. In manufacture of a transistor in which an oxide semiconductor layer is used for a channel formation region, the oxide semiconductor layer is subjected to heat treatment so as to be dehydrated or dehydrogenated; thus, impurities such as moisture existing in an interface between the oxide semiconductor layer and the gate insulating layer provided below and in contact with the oxide semiconductor layer and an interface between the oxide semiconductor layer and a protective insulating layer provided on and in contact with the oxide semiconductor layer can be reduced.
1. A semiconductor device comprising:
a first channel formation region of a first transistor, the first channel formation region comprising an oxide semiconductor material;
a first conductive layer over the first channel formation region, the first conductive layer comprising a region serving as a gate electrode of the first transistor;
a second channel formation region of a second transistor, the second channel formation region comprising the oxide semiconductor material;
a second conductive layer over the second channel formation region, the second conductive layer comprising a region serving as a gate electrode of the second transistor;
a third conductive layer comprising a region serving as one of a source electrode and a drain electrode of the first transistor and one of a source electrode and a drain electrode of the second transistor;
an insulating layer under the first channel formation region and the second channel formation region, the insulating layer comprising a region serving as a gate insulating layer; and
a fourth conductive layer under the insulating layer, the fourth conductive layer comprising a region in contact with the third conductive layer provided in a contact hole of the insulating layer,
wherein the first conductive layer and the second conductive layer are provided in the same layer,
wherein a channel length direction of the first transistor is parallel to a channel width direction of the second transistor in a top view of the semiconductor device,
wherein the first conductive layer comprises a first region extending in a direction parallel to the channel length direction of the first transistor and a second region extending in a direction parallel to a channel width direction of the first transistor in the top view of the semiconductor device,
wherein the second region of the first conductive layer overlaps with the first channel formation region in the top view of the semiconductor device,
wherein a width of the second region in the channel length direction of the first transistor is larger than a width of the first region in the channel width direction of the first transistor in the top view of the semiconductor device,
wherein the second conductive layer comprises a third region extending in the channel width direction of the second transistor in the top view of the semiconductor device, and
wherein the third region of the second conductive layer overlaps with the second channel formation region in the top view of the semiconductor device.
2. The semiconductor device according to claim 1 , wherein each of the first channel formation region and the second channel formation region comprises indium, gallium, and zinc.
3. The semiconductor device according to claim 1 , wherein each of the first channel formation region and the second channel formation region comprises a crystal region.
4. The semiconductor device according to claim 1 , further comprising a resin layer over the first transistor and the second transistor.
5. The semiconductor device according to claim 1 , further comprising a layer comprising silicon nitride over the first conductive layer and the second conductive layer.
6. The semiconductor device according to claim 1 , wherein the insulating layer comprises silicon oxide and silicon nitride.
7. A semiconductor device comprising:
a first channel formation region of a first transistor, the first channel formation region comprising an oxide semiconductor material;
a first conductive layer over the first channel formation region, the first conductive layer comprising a region serving as a gate electrode of the first transistor;
a second channel formation region of a second transistor, the second channel formation region comprising the oxide semiconductor material;
a second conductive layer over the second channel formation region, the second conductive layer comprising a region serving as a gate electrode of the second transistor;
a third conductive layer comprising a region serving as one of a source electrode and a drain electrode of the first transistor and one of a source electrode and a drain electrode of the second transistor;
an insulating layer under the first channel formation region and the second channel formation region, the insulating layer comprising a region serving as a gate insulating layer; and
a fourth conductive layer under the insulating layer, the fourth conductive layer comprising a region in contact with the third conductive layer provided in a contact hole of the insulating layer,
wherein the first conductive layer and the second conductive layer are provided in the same layer,
wherein a channel length direction of the first transistor is parallel to a channel width direction of the second transistor in a top view of the semiconductor device,
wherein the first conductive layer comprises a first region extending in a direction parallel to the channel length direction of the first transistor and a second region extending in a direction parallel to a channel width direction of the first transistor in the top view of the semiconductor device,
wherein the second region of the first conductive layer overlaps with the first channel formation region in the top view of the semiconductor device,
wherein a width of the second region in the channel length direction of the first transistor is larger than a width of the first region in the channel width direction of the first transistor in the top view of the semiconductor device,
wherein the second conductive layer comprises a third region extending in the channel width direction of the second transistor in the top view of the semiconductor device,
wherein the third region of the second conductive layer overlaps with the second channel formation region in the top view of the semiconductor device, and
wherein a width of the third region of the second conductive layer in the channel length direction of the second transistor is larger than the width of the first region in the channel width direction of the first transistor.
8. The semiconductor device according to claim 7 , wherein each of the first channel formation region and the second channel formation region comprises indium, gallium, and zinc.
9. The semiconductor device according to claim 7 , wherein each of the first channel formation region and the second channel formation region comprises a crystal region.
10. The semiconductor device according to claim 7 , further comprising a resin layer over the first transistor and the second transistor.
11. The semiconductor device according to claim 7 , further comprising a layer comprising silicon nitride over the first conductive layer and the second conductive layer.
12. The semiconductor device according to claim 7 , wherein the insulating layer comprises silicon oxide and silicon nitride.