Fluidic assembly MicroLED mass transfer method
A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.
1. A micro light emitting diode (microLED) mass transfer method, the method comprising:
fabricating microLEDs on a wafer;
forming a keel extending from an exposed bottom surface of each microLED;
releasing the microLEDs from the wafer into a suspension;
fluidically depositing the microLEDs onto a carrier substrate having a planar top surface and an array of wells formed in the carrier substrate top surface;
transferring the microLEDs on the carrier substrate to a mass transfer stamp by pressing a top surface of the mass transfer stamp substrate against the carrier substrate top surface, with an array of mass transfer stamp capture sites formed in the mass transfer stamp top surface interfacing with corresponding microLEDs in carrier substrate wells; and,
transferring the microLEDs from the mass transfer stamp to a display substrate.
2. The method of claim 1 wherein the carrier substrate wells have a first perimeter shape and a planar well bottom surface; and,
wherein fluidically depositing the microLEDs onto the carrier wafer includes filling the wells with microLEDs having the first perimeter shape.
3. The method of claim 1 wherein the carrier substrate array of wells has a pitch separating adjacent wells; and,
wherein the mass transfer stamp array of capture sites has a pitch that is greater than or equal to the array of carrier substrate wells.
4. The method of claim 1 wherein transferring the microLEDs from the carrier substrate to the mass transfer stamp includes configuring the mass transfer stamp capture sites to accept the microLED keels.
5. The method of claim 4 wherein configuring the mass transfer stamp capture sites to accept the microLED keels includes configuring the transfer stamp capture sites to comprise capture site columnar-shaped recesses accepting the microLED keels.
6. The method of claim 1 further comprising:
prior to the fluidic deposition of the microLEDs onto the carrier substrate, coating carrier substrate well bottom surfaces with a first component of a conjugated bio molecule pair; and,
while in the suspension, coating the microLEDs with a second component of the conjugated bio molecule pair.
7. The method of claim 1 further comprising:
prior to transferring the microLEDs from the carrier substrate to the mass transfer stamp, using a force generator underlying the carrier substrate, selected from the group consisting of a magnetic force generator and an electrostatic force generator, to temporarily secure the microLEDs in the carrier substrate wells.
8. A micro light emitting diode (microLED) mass transfer method, the method comprising:
fabricating microLEDs on a wafer;
releasing the microLEDs from the wafer into a suspension;
coating carrier substrate well bottom surfaces with a first component of a conjugated bio molecule pair;
while in the suspension, coating the microLEDs with a second component of the conjugated bio molecule pair;
fluidically depositing the microLEDs onto the carrier substrate having a planar top surface and an array of wells formed in the carrier substrate top surface;
transferring the microLEDs on the carrier substrate to a mass transfer stamp by pressing a top surface of the mass transfer stamp substrate against the carrier substrate top surface, with an array of mass transfer stamp capture sites formed in the mass transfer stamp top surface interfacing with corresponding microLEDs in carrier substrate wells; and,
transferring the microLEDs from the mass transfer stamp to a display substrate.