Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.
1. An apparatus comprising:
an upper cold plate and a lower cold plate, each of the upper cold plate and the lower cold plate comprising at least one of an electrical path or an optical path extending therethrough and each of the upper cold plate and the lower cold plate including at least two cooling tubes or reservoirs; and
a substrate and die package interposed between the upper cold plate and the lower cold plate,
wherein the optical path extending through one of the upper cold plate and the lower cold plate is configured to deliver an optical signal to or from the substrate and die package, and the electrical path extending through another of the upper cold plate and the lower cold plate is configured to deliver power to the substrate and die package.
2. The apparatus of claim 1 , wherein at least one of the upper cold plate or the lower cold plate include at least one opening for insertion of one or more power blocks.
3. The apparatus of claim 2 , wherein the at least two cooling tubes or reservoirs are positioned around the at least one opening.
4. The apparatus of claim 1 , wherein at least one of the upper cold plate or the lower cold plate includes a plurality of internal temperature zones.
5. The apparatus of claim 1 , wherein at least one of the upper cold plate or the lower cold plate is a multi-phase cold plate.
6. The apparatus of claim 1 , further comprising:
a power block that is configured to be inserted into at least one of the upper cold plate or the lower cold plate, wherein the electrical path includes a power via formed in the power block.
7. The apparatus of claim 1 , wherein the substrate and die package includes an optical engine, and the optical path includes a waveguide configured to transmit light to or from the optical engine.
8. The apparatus of claim 1 , wherein each of the upper cold plate and the lower cold plate includes the optical path and the electrical path.
9. The apparatus of claim 1 , wherein at least one of the electrical path or the optical path includes at least one first path extending through the upper cold plate and at least one second path extending through the lower cold plate.
10. The apparatus of claim 1 , wherein the substrate and die package comprises at least one electronic integrated circuit and at least one photonic integrated circuit.
11. The apparatus of claim 1 , further comprising:
a multi-zone point-of-load configured to provide power to the substrate and die package via one of the upper cold plate or the lower cold plate.
12. The apparatus of claim 11 , further comprising:
at least one additional point-of-load connected to the multi-zone point-of-load and attached to one of the upper cold plate or the lower cold plate.
13. The apparatus of claim 1 , wherein at least one of the upper cold plate or the lower cold plate is configured to provide liquid based cooling.
14. An apparatus comprising:
a first cold plate comprising an optical path extending therethrough;
a second cold plate comprising an electrical path extending therethrough; and
a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit, the substrate and die package interposed between the first cold plate and the second cold plate,
wherein the optical path extending through the first cold plate is configured to deliver an optical signal to or from the substrate and die package, and the electrical path extending through the second cold plate is configured to deliver power to the substrate and die package, and
wherein each of the first cold plate and the second cold plate includes at least two cooling tubes or reservoirs.
15. The apparatus of claim 14 , wherein at least one of the first cold plate or the second cold plate includes at least one opening for insertion of one or more power blocks.
16. The apparatus of claim 15 , wherein the at least two cooling tubes or reservoirs are positioned around the at least one opening.
17. The apparatus of claim 14 , further comprising:
a power block configured to be inserted into the first cold plate or the second cold plate, wherein the electrical path includes a power via formed in the power block.
18. A method comprising:
creating an electrical path or an optical path through at least one of a first cold plate or a second cold plate;
positioning the first cold plate and the second cold plate on opposite sides of a substrate and die package;
transmitting at least one of power through the electrical path to the substrate and die package or an optical signal through the optical path to and from the substrate and die package; and
positioning at least two cooling tubes or reservoirs in at least one of the first cold plate or the second cold plate for cooling the electrical path or the optical path.
19. The method of claim 18 , wherein creating the electrical path or the optical path includes inserting one or more power blocks into an opening in one of the first cold plate and the second cold plate, and wherein the at least two cooling tubes or reservoirs are positioned around the opening.
20. The method of claim 18 , further comprising:
forming a plurality of internal temperature zones in at least one of the first cold plate or the second cold plate.