Method of forming a metal liner for interconnect structures
Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. A self-assembled monolayer (SAM) is formed on the bottom of the gap, and a barrier layer is formed on the SAM before selectively depositing a metal liner on the barrier layer. The SAM is removed after selectively depositing the metal liner on the barrier layer.
1. A method of forming a microelectronic device, the method comprising:
forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom;
selectively depositing a self-assembled monolayer (SAM) on the bottom of the gap by exposing the bottom of the gap to a hydrocarbon carried in a carrier gas;
forming a barrier layer on the bottom of the gap and on the sidewalls;
selectively depositing a first metal liner on the barrier layer on the sidewalls and on the bottom of the gap, the first metal liner being deposited at a thickness on the sidewalls that is greater than a thickness of the first metal liner deposited on the bottom;
selectively depositing a second metal liner on the first metal liner to form a two-metal liner, the second metal liner comprising a metal that different than the first metal liner, wherein the two-metal liner has a thickness in a range of from 10 Angstroms to 20 Angstroms on the sidewalls and a thickness in a range of from 5 Angstroms to 20 Angstroms on the bottom;
removing the SAM after selectively depositing the second metal liner on the first metal liner; and
performing a gap fill process on the second metal liner.
2. The method of claim 1 , wherein the hydrocarbon is selected from the group consisting of a linear unsaturated hydrocarbon and branched unsaturated hydrocarbon, the hydrocarbon having a general formula selected from the group consisting of R′═R″ or R′≡R″ and R′ and R″ comprise carbon and hydrocarbon atoms.
3. The method of claim 1 , wherein the SAM comprises a first SAM deposited on the dielectric layer.
4. The method of claim 1 , wherein the first metal liner is selectively deposited on a sidewall of the microelectronic device.
5. The method of claim 4 , wherein the first metal liner comprises one or more of ruthenium (Ru), cobalt (Co), molybdenum (Mo), and tantalum (Ta).
6. The method of claim 5 , wherein when the first metal liner comprises a single layer of ruthenium (Ru) selectively deposited on the sidewall, there is a ratio of the thickness of the first metal liner on the sidewalls to the thickness of the first metal liner thickness on the bottom, the ratio being greater than 3.
7. The method of claim 6 , wherein the selective ruthenium (Ru) deposition on the sidewall comprises a cyclic deposition process using a ruthenium (Ru) precursor carried by a carrier gas to form a deposited ruthenium layer.
8. The method of claim 7 , wherein the cyclic deposition process further comprises annealing the deposited ruthenium layer while flowing hydrogen (H 2 ) and annealing the deposited ruthenium layer.
9. The method of claim 8 , wherein the cyclic deposition process is performed in a substrate processing chamber at a first pressure to form the deposited ruthenium layer, and annealing the deposited ruthenium layer is performed while the substrate processing chamber is at a second pressure that is greater than the first pressure.
10. The method of claim 5 , wherein the first metal liner comprises a first metal M1 and the second metal liner comprises a second metal M2.
11. The method of claim 10 , wherein the first metal M1 comprises ruthenium (Ru) and the second metal M2 comprises cobalt (Co).
12. The method of claim 11 , wherein when the first metal M1 comprises ruthenium (Ru) selectively deposited on the sidewall, there is a ratio of the thickness of the metal liner thickness on the sidewalls to the thickness of the metal liner thickness on the bottom, the ratio being greater than 3.
13. The method of claim 1 , wherein removing the SAM comprises a plasma treatment process comprising flowing one or more of hydrogen (H 2 ) or argon (Ar).
14. The method of claim 13 , wherein the plasma treatment process comprises increasing a density of the barrier layer.
15. The method of claim 1 , wherein the gap fill process comprises filling the gap with one or more of copper (Cu) or cobalt (Co).
16. The method of claim 2 , wherein the hydrocarbon comprises 5-decyne.
17. The method of claim 2 , wherein the hydrocarbon comprises 3-hexyne.