Integration of p-channel and n-channel E-FET III-V devices with optimization of device performance
Various embodiments of the present disclosure are directed towards an integrated chip including a first semiconductor layer overlying a substrate. A first barrier layer is disposed on the first semiconductor layer. A second semiconductor layer overlies and directly contacts the first barrier layer. A second barrier layer directly contacts the first barrier layer. A third semiconductor layer overlies the second barrier layer. A fourth semiconductor layer overlies the third semiconductor layer. Outer sidewalls of the third semiconductor layer, outer sidewalls of the fourth semiconductor layer, and outer sidewalls of the second barrier layer are respectively aligned.
1. An integrated chip, comprising:
a first semiconductor layer overlying a substrate;
a first barrier layer disposed on the first semiconductor layer;
a second semiconductor layer overlying and directly contacting the first barrier layer;
a gate electrode directly overlying the second semiconductor layer;
a pair of source/drain structures disposed on the first barrier layer and arranged on opposing sides of the second semiconductor layer;
a second barrier layer directly contacting the first barrier layer;
a third semiconductor layer overlying the second barrier layer; and
a fourth semiconductor layer overlying the third semiconductor layer, wherein outer sidewalls of the third semiconductor layer, outer sidewalls of the fourth semiconductor layer, and outer sidewalls of the second barrier layer are respectively aligned.
2. The integrated chip of claim 1 , wherein a height of the second barrier layer is different from a height of the first barrier layer.
3. The integrated chip of claim 1 , wherein a width of the second barrier layer is greater than a width of the second semiconductor layer.
4. The integrated chip of claim 1 , wherein a sheet resistivity of the second barrier layer is less than a sheet resistivity of the first barrier layer.
5. The integrated chip of claim 1 , wherein a first heterojunction between the first barrier layer and the first semiconductor layer is spaced from a second heterojunction at an interface between the second barrier layer and the third semiconductor layer by a first vertical distance greater than a thickness of the second barrier layer.
6. The integrated chip of claim 1 , wherein the first semiconductor layer and the third semiconductor layer are undoped.
7. The integrated chip of claim 1 , wherein the second semiconductor layer and the fourth semiconductor layer are doped, wherein a thickness of the second semiconductor layer is greater than a thickness of the fourth semiconductor layer.
8. The integrated chip of claim 7 , wherein a thickness of the second barrier layer is less than the thickness of the second semiconductor layer and greater than the thickness of the fourth semiconductor layer.
9. An integrated chip, comprising:
a first semiconductor layer overlying a substrate;
a first semiconductor device comprising a first barrier layer on the first semiconductor layer and a second semiconductor layer on the first barrier layer;
a second semiconductor device over the substrate and laterally offset from the first semiconductor device, wherein the second semiconductor device comprises a second barrier layer physically contacting the first barrier layer, and a third semiconductor layer on the second barrier layer; and
wherein the first barrier layer and the second barrier layer respectively comprise a III-V semiconductor material, wherein a concentration of elements in the second barrier layer is different from that of the first barrier layer, wherein at least a portion of the concentration of elements of the second barrier layer is spaced above a bottom surface of the first barrier layer by a first distance greater than a second distance between the bottom surface of the first barrier layer and a bottom surface of the second semiconductor layer.
10. The integrated chip of claim 9 , wherein opposing sidewalls of the second barrier layer are aligned with opposing sidewalls of the third semiconductor layer.
11. The integrated chip of claim 9 , wherein the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer comprise a binary III-V material.
12. The integrated chip of claim 11 , wherein the III-V semiconductor material is a ternary III-V material.
13. The integrated chip of claim 9 , wherein a bottom surface of the third semiconductor layer is below a top surface of the second semiconductor layer.
14. The integrated chip of claim 9 , wherein the first semiconductor device comprises a pair of contacts disposed on the first barrier layer on opposing sides of the second semiconductor layer, wherein a bottom surface of the pair of contacts is aligned with a bottom surface of the second barrier layer.
15. The integrated chip of claim 9 , further comprising:
a buffer layer disposed between the first semiconductor layer and the substrate.
16. The integrated chip of claim 9 , wherein the second semiconductor device comprises a fourth semiconductor layer on the third semiconductor layer, wherein the second semiconductor layer and the fourth semiconductor layer are doped, and wherein a distance between the second semiconductor layer and the first barrier layer is less than a distance between the fourth semiconductor layer and the second barrier layer.
17. An integrated chip, comprising:
a first semiconductor layer over a substrate;
a first barrier layer over and contacting the first semiconductor layer;
a second semiconductor layer having a bottom surface over and contacting an upper surface of the first barrier layer;
a second barrier layer over and contacting the first barrier layer in a region laterally offset from the second semiconductor layer, wherein a height of the second barrier layer is different from a height of the first barrier layer; and
a third semiconductor layer and a fourth semiconductor layer on the second barrier layer.
18. The integrated chip of claim 17 , wherein a height of the second semiconductor layer is greater than the height of the first barrier layer and the height of the second barrier layer.
19. The integrated chip of claim 17 , wherein a width of the second semiconductor layer is less than a width of the second barrier layer and a width of the third semiconductor layer.
20. The integrated chip of claim 17 , wherein a top surface of the second semiconductor layer is vertically between a top surface of the second barrier layer and a bottom surface of the fourth semiconductor layer.