Method of fabricating semiconductor device
A method of fabricating a semiconductor device includes forming a cut-off region in at least one mandrel line among a plurality of mandrel lines, conformally forming a spacer material layer in the plurality of mandrel lines and a non-mandrel area and forming a cut spacer in the cut-off region and depositing a gap-fill material such that a cut block is formed on a portion of the non-mandrel area and a concave portion of the cut spacer is filled.
1. A method of fabricating a semiconductor device, comprising:
forming a hard mask layer on a target layer;
forming, on the hard mask layer, a plurality of mandrel lines each having sidewalls extending in a first direction and arranged in a second direction intersecting the first direction such that the plurality of mandrel lines define a non-mandrel area;
forming a cut-off region in at least one of the plurality of mandrel lines;
forming a spacer material layer such that the spacer material layer is conformally formed on the plurality of mandrel lines and the non-mandrel area and the spacer material layer includes a cut spacer in the cut-off region;
depositing a gap-fill material such that the gap-fill material is formed on the cut spacer and the gap-fill material includes a cut block on a portion of the non-mandrel area;
etching back the spacer material layer such that sidewall spacers are formed on the sidewalls of the plurality of mandrel lines and a region, except for the cut block, of upper surfaces of the plurality of mandrel lines and the non-mandrel area is exposed;
selectively removing the plurality of mandrel lines from the sidewall spacers;
using the cut spacer, the cut block, and the sidewall spacers to form a mask pattern by etching the hard mask layer; and
etching the target layer using the mask pattern.
2. The method of claim 1 , wherein
the target layer includes a dielectric layer, and
the etching of the target layer includes forming a plurality of trenches in the dielectric layer using the mask pattern.
3. The method of claim 2 , further comprising:
filling the plurality of trenches with a conductive material such that a plurality of wiring lines is formed in the plurality of trenches.
4. The method of claim 1 , wherein a thickness of the spacer material layer is less than 50% of a width of the cut-off region in the first direction.
5. The method of claim 1 , wherein a thickness of the spacer material layer is 10 nm or less.
6. The method of claim 1 , wherein in a cross section in the first direction, the cut spacer has a concave portion.
7. The method of claim 6 , wherein the concave portion of the cut spacer extends in the second direction.
8. The method of claim 6 , wherein the depositing of the gap-fill material includes filling the concave portion of the cut spacer with the gap-fill material.
9. The method of claim 1 , wherein
the depositing of the gap-fill material includes using a mask,
the mask including a first opening exposing the cut spacer and a second opening exposing the portion of the non-mandrel area on which the cut block is to be formed.
10. The method of claim 9 , wherein the depositing of the gap-fill material includes an atomic layer deposition method.
11. The method of claim 1 , wherein the spacer material layer and the gap-fill material include different materials.
12. A method of fabricating a semiconductor device, comprising:
forming a dielectric layer on a substrate;
forming a hard mask layer on the dielectric layer;
forming a plurality of mandrel lines on the hard mask layer such that the plurality of mandrel lines define a non-mandrel area;
forming a cut-off region in at least one of the plurality of mandrel lines;
forming a spacer material layer such that the spacer material layer is conformally formed on the plurality of mandrel lines and in the non-mandrel area, and the spacer material layer includes a cut spacer having a concave portion in the cut-off region;
depositing a gap-fill material such that the gap-fill material fills the concave portion of the cut spacer and the gap-fill material includes a cut block on a portion of the non-mandrel area;
etching back the spacer material layer such that sidewall spacers are formed on sidewalls of the plurality of mandrel lines, and a region, except for the cut block, of upper surfaces of the plurality of mandrel lines and the non-mandrel area is exposed;
selectively removing the plurality of mandrel lines from the sidewall spacers;
using the cut spacer, the cut block, and the sidewall spacers to form a mask pattern by etching the hard mask layer;
forming a plurality of trenches in the dielectric layer using the mask pattern; and
filling the plurality of trenches with a conductive material such that a plurality of wiring lines is formed in the plurality of trenches.
13. The method of claim 12 , wherein
the sidewall spacers have a first interval defined by a width of the one of the plurality of mandrel lines and a second interval defined by a width of an exposed region of the non-mandrel area, and
the first interval and the second interval are equal to each other.
14. The method of claim 12 , wherein the cut block is adjacent to the cut spacer in a direction in which the plurality of mandrel lines are arranged.
15. The method of claim 12 , wherein
the spacer material layer includes titanium oxide, and
the gap-fill material includes silicon oxide.
16. The method of claim 12 , wherein the hard mask layer includes a first hard mask layer including a first material and a second hard mask layer including a second material different from the first material.
17. The method of claim 16 , wherein
the first material includes titanium nitride, and
the second material includes silicon oxide, silicon oxynitride, or silicon nitride.
18. The method of claim 12 , wherein the plurality of mandrel lines includes amorphous silicon.
19. A method of fabricating a semiconductor device, comprising:
forming a hard mask layer on a target layer;
forming, on the hard mask layer, a plurality of mandrel lines each having sidewalls extending in a first direction and arranged in a second direction intersecting the first direction such that the plurality of mandrel lines define a non-mandrel area;
forming a cut-off region in at least one of the plurality of mandrel lines;
forming a spacer material layer such that the spacer material layer is conformally formed on the plurality of mandrel lines and the non-mandrel area and the spacer material layer includes a cut spacer having a concave portion in the cut-off region;
depositing a gap-fill material such that the gap-fill material fills the concave portion of the cut spacer, and the gap-fill material includes a cut block on a portion of the non-mandrel area, the cut block positioned adjacent to the cut spacer in the second direction;
etching back the spacer material layer such that sidewall spacers are formed on the sidewalls of the plurality of mandrel lines, respectively;
selectively removing the plurality of mandrel lines from the sidewall spacers;
using the cut spacer, the cut block, and the sidewall spacers to form a mask pattern by etching the hard mask layer; and
etching the target layer using the mask pattern.
20. The method of claim 19 , wherein a gap-fill material portion of the cut block is connected to a gap-fill material portion of the cut spacer.