Board-level pad pattern for multi-row QFN packages
A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.
1. A board-level pad pattern, comprising:
a base substrate;
an exposed pad region disposed within a surface mount region of the base substrate;
a plurality of staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region, wherein the plurality of staggered ball pads comprises first ball pads arranged in a first row and second ball pads arranged in a second row, wherein the first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch;
a plurality of square-shaped ball pads arranged in a third row between the exposed pad region and the plurality of staggered ball pads; and
a plurality of signal vias electrically connected to the plurality of square-shaped ball pads, respectively, wherein the plurality of signal vias are arranged in a staggered manner along each side of the exposed pad region, wherein the plurality of signal vias comprise alternately arranged offset signal vias and on-pad signal vias.
2. The board-level pad pattern according to claim 1 , wherein the plurality of staggered ball pads and the plurality of square-shaped ball pads are copper pads.
3. The board-level pad pattern according to claim 1 , wherein the plurality of staggered ball pads and the plurality of square-shaped ball pads are non-solder mask defined (NSMD) pads.
4. The board-level pad pattern according to claim 1 , wherein the first ball pads in the first row are aligned to one another along a first direction.
5. The board-level pad pattern according to claim 4 , wherein the second ball pads in the second row are aligned to one another along the first direction.
6. The board-level pad pattern according to claim 4 , wherein the square-shaped ball pads in the third row are aligned to one another along the first direction.
7. The board-level pad pattern according to claim 5 , wherein the first and second ball pads are arranged in a staggered manner in a second direction that is orthogonal to the first direction.
8. The board-level pad pattern according to claim 1 , wherein the first ball pads in the first row are arranged at a pitch of 0.5 mm and a pitch of 0.7 mm.
9. The board-level pad pattern according to claim 1 , wherein the second ball pads in the second row are arranged at a pitch of 0.4 mm.
10. The board-level pad pattern according to claim 1 further comprising:
a basic pad unit consisting of five pads composed of two of the first ball pads in the first row and three of the second ball pads in the second row.
11. The board-level pad pattern according to claim 10 , wherein an array of the plurality of staggered ball pads within the surface mount region for the multi-row QFN is constructed by repeating the basic pad units.
12. The board-level pad pattern according to claim 1 , wherein the plurality of signal vias are arranged in an aligned manner along each side of the exposed pad region.
13. The board-level pad pattern according to claim 12 , wherein the plurality of signal vias are all on-pad signal vias.
14. The board-level pad pattern according to claim 1 further comprising:
a plurality of square-shaped ground pads between the plurality of square-shaped ball pads in the third row.
15. The board-level pad pattern according to claim 14 , wherein the plurality of ground pads are electrically connected to respective on-pad ground vias, which are electrically connected to a ground plane of the base substrate.
16. The board-level pad pattern according to claim 1 , wherein each of the plurality of square-shaped ball pads in the third row has a dimension of about 0.4 mm×0.4 mm.