IP Library Granted Patent US 12,366,705
Granted Patent B2
US 12,366,705 · App. 18/151,900 · Granted Jul 22, 2025

Photonics optoelectrical system

Inventors: William Charles (Albany, NY); Douglas Coolbaugh (Albany, NY); Douglas La Tulipe (Albany, NY); Gerald L. Leake, Jr. (Albany, NY)
Assignee: THE RESEARCH FOUNDATION FOR THE STATE UNIVERISTY OF NEWYORK
G02B6/12004G02B6/12G02B6/12002G02B6/13G02B6/4245G02B6/428G02B6/4283G02B6/43H01S5/026G02B2006/12061G02B2006/12085G02B6/131H01S5/0216H01S5/02345H01S5/0262H10F30/21
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Quick Facts
Patent No.
US 12,366,705
App. No.
18/151,900
Granted
Jul 22, 2025
Kind
B2
Abstract

There is set forth herein a method including building a first photonics structure using, wherein the building the first photonics structure includes fabricating one or more photonics device.

Claims (55)

1. An optoelectrical system, comprising:

a first photonics structure having a first photonics dielectric stack;

a second photonics structure having a second photonics dielectric stack;

one or more metallization layers integrally formed in the first photonics dielectric stack;

one or more first photonics devices integrally formed in the first photonics dielectric stack;

at least one metallization layer integrally formed in the second photonics dielectric stack;

at least one second photonics device integrally formed in the second photonics dielectric stack;

one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure including a buffer structure, and each laser stack structure having a bottom contact structure thereof; and

an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact.

2. The system of claim 1 , comprising:

a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack;

a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and

a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide to the monocrystalline waveguide.

3. The system of claim 1 , wherein the one or more first photonics devices includes at least one waveguide, and wherein the at least one second photonics device includes at least one waveguide.

4. The system of claim 1 , wherein the buffer structure is includes a layer of Ge.

5. The system of claim 4 , wherein the buffer structure includes a layer of GaAs.

6. The system of claim 5 , wherein the buffer structure is epitaxially grown.

7. The system of claim 1 , wherein each of the one or more laser stack structures includes plurality of buffer structures.

8. The system of claim 1 , wherein the buffer structure is comprised of one or more III-V material.

9. An optoelectrical system, comprising:

a first photonics structure having a first photonics dielectric stack;

a second photonics structure having a second photonics dielectric stack;

a bond layer that fusion bonds the first photonics structure to the second photonics structure;

one or more first metallization layers integrally formed in the first photonics dielectric stack;

at least one second metallization layer integrally formed in the second photonics dielectric stack;

one or more first photonics device integrally formed in the first photonics dielectric stack;

at least one second photonics device integrally formed in the second photonics dielectric stack;

one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure including a buffer structure, and each laser stack structure having a bottom contact structure thereof;

an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact; and

a waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge-coupled to one of the one or more laser stack structures.

10. The system of claim 9 , wherein the buffer structure is includes a layer of Ge.

11. The system of claim 9 , comprising:

a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack;

a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and

a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide, through the bond layer, to the monocrystalline waveguide.

12. An optoelectrical system, comprising:

a first photonics structure having a first photonics dielectric stack;

a second photonics structure having a second photonics dielectric stack;

one or more metallization layers integrally formed in the first photonics dielectric stack;

one or more first photonics devices integrally formed in the first photonics dielectric stack;

at least one metallization layer integrally formed in the second photonics dielectric stack;

at least one second photonics device integrally formed in the second photonics dielectric stack;

one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure having a bottom contact structure thereof; and

an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact.

13. The system of claim 12 , each laser stack structure including at least one light-confining structure.

14. The system of claim 13 , wherein the light-confining structure is epitaxially grown.

15. The system of claim 13 , wherein the one or more laser stack structures further include a buffer structure, a contact structure on the buffer structure, and wherein the light-confining structure is on the contact structure.

16. The system of claim 15 , where the one or more laser stack structures further includes an active region on a first light-confining structure, a mode selection structure on the active region, and a second light-confining on the mode selection structure.

17. The system of claim 13 , wherein the light-confining structure is at least one cladding structure.

18. The system of claim 13 , wherein the light-confining structure is n-doped and comprised of AlGaAs, GaInP or a combination thereof.

19. The system of claim 12 , comprising:

a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack;

a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and

a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide to the monocrystalline waveguide.

20. The system of claim 12 , wherein the one or more laser stack structures further include a buffer structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2025
From: CHARLES, WILLIAM; COOLBAUGH, DOUGLAS; LA TULIPE, DOUGLAS; LEAKE, GERALD L., JR
To: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
Reel/Frame 070488/0724 →
Continuity (3)
Continuation 16575938 · Sep 19, 2019
Provisional Application 62770634 · Nov 21, 2018
Related Publication 20230244029A1 · Aug 3, 2023
References Cited (214)
US 5835646A · Yoshimura et al. · 1998 [cited by applicant]
US 6048775A · Yao et al. · 2000 [cited by applicant]
US 6056630A · Nanda et al. · 2000 [cited by applicant]
US 6108464A · Foresi et al. · 2000 [cited by applicant]
US 6538299B1 · Kwark et al. · 2003 [cited by applicant]
US 6621972B2 · Kimerling et al. · 2003 [cited by applicant]
US 6631225B2 · Lee et al. · 2003 [cited by applicant]
US 6635110B1 · Luan et al. · 2003 [cited by applicant]
US 6690871B2 · Lee et al. · 2004 [cited by applicant]
US 6706576B1 · Ngo · 2004 [cited by applicant]
US 6812495B2 · Wada et al. · 2004 [cited by applicant]
US 6879014B2 · Wagner et al. · 2005 [cited by applicant]
US 6887773B2 · Gunn, III et al. · 2005 [cited by applicant]
US 6927392B2 · Liddiard · 2005 [cited by applicant]
US 7008813B1 · Lee et al. · 2006 [cited by applicant]
US 7095010B2 · Scherer et al. · 2006 [cited by applicant]
US 7103245B2 · Lee et al. · 2006 [cited by applicant]
US 7123805B2 · Sparacin et al. · 2006 [cited by applicant]
US 7190871B2 · Lock et al. · 2007 [cited by applicant]
US 7194166B1 · Gunn, III et al. · 2007 [cited by applicant]
US 7205525B2 · Yasaitis · 2007 [cited by applicant]
US 7259031B1 · Dickinson et al. · 2007 [cited by applicant]
US 7262117B1 · Gunn, III et al. · 2007 [cited by applicant]
US 7279682B2 · Ouvrier-Buffet et al. · 2007 [cited by applicant]
US 7317242B2 · Takizawa · 2008 [cited by applicant]
US 7321713B2 · Akiyama et al. · 2008 [cited by applicant]
US 7389029B2 · Rahman et al. · 2008 [cited by applicant]
US 7397101B1 · Masini et al. · 2008 [cited by applicant]
US 7424181B2 · Haus et al. · 2008 [cited by applicant]
US 7459686B2 · Syllaios et al. · 2008 [cited by applicant]
US 7480430B2 · Saini et al. · 2009 [cited by applicant]
US 7565046B2 · Feng et al. · 2009 [cited by applicant]
US 7613369B2 · Witzens et al. · 2009 [cited by applicant]
US 7651880B2 · Tweet et al. · 2010 [cited by applicant]
US 7659627B2 · Miyachi et al. · 2010 [cited by applicant]
US 7700975B2 · Rakshit et al. · 2010 [cited by applicant]
US 7723206B2 · Miyachi et al. · 2010 [cited by applicant]
US 7723754B2 · Wada et al. · 2010 [cited by applicant]
US 7737534B2 · McLaughlin et al. · 2010 [cited by applicant]
US 7801406B2 · Pan et al. · 2010 [cited by applicant]
US 7816767B2 · Pei et al. · 2010 [cited by applicant]
US 7831123B2 · Sparacin et al. · 2010 [cited by applicant]
US 7902620B2 · Assefa et al. · 2011 [cited by applicant]
US 7906825B2 · Tweet et al. · 2011 [cited by applicant]
US 7916377B2 · Witzens et al. · 2011 [cited by applicant]
US 7943471B1 · Buller et al. · 2011 [cited by applicant]
US 7994066B1 · Capellini et al. · 2011 [cited by applicant]
US 8030668B2 · Hisamoto et al. · 2011 [cited by applicant]
US 8227787B2 · Kumar et al. · 2012 [cited by applicant]
US 8354282B2 · Stern · 2013 [cited by applicant]
US 8471639B2 · Welch · 2013 [cited by applicant]
US 8592745B2 · Masini et al. · 2013 [cited by applicant]
US 8625935B2 · Mekis et al. · 2014 [cited by applicant]
US 8633067B2 · Assefa et al. · 2014 [cited by applicant]
US 8649639B2 · Mekis et al. · 2014 [cited by applicant]
US 8664739B2 · King et al. · 2014 [cited by applicant]
US 8742398B2 · Klem et al. · 2014 [cited by applicant]
US 8754711B2 · Welch · 2014 [cited by applicant]
US 8787774B2 · Guckenberger · 2014 [cited by applicant]
US 8798476B2 · Gloeckner et al. · 2014 [cited by applicant]
US 8877616B2 · Pinguet et al. · 2014 [cited by applicant]
US 8895413B2 · Pinguet et al. · 2014 [cited by applicant]
US 9046650B2 · Lin et al. · 2015 [cited by applicant]
US 9091827B2 · Verslegers et al. · 2015 [cited by applicant]
US 9110221B2 · Agarwal et al. · 2015 [cited by applicant]
US 9864138B2 · Coolbaugh · 2018 [cited by applicant]
US 10295745B2 · Coolbaugh · 2019 [cited by applicant]
US 11171075B2 · Liu · 2021 [cited by applicant]
US 11550099B2 · Charles · 2023 [cited by examiner]
US 20020052120A1 · Shintani et al. · 2002 [cited by applicant]
US 20020172487A1 · Hwang et al. · 2002 [cited by applicant]
US 20030063836A1 · Lam et al. · 2003 [cited by applicant]
US 20030137706A1 · Rmanujam et al. · 2003 [cited by applicant]
US 20030215203A1 · Lock et al. · 2003 [cited by applicant]
US 20040057684A1 · Kokubun · 2004 [cited by applicant]
US 20050012040A1 · Fiorini et al. · 2005 [cited by applicant]
US 20050051705A1 · Yasaitis · 2005 [cited by applicant]
US 20050101084A1 · Gilton · 2005 [cited by applicant]
US 20050111806A1 · Brask · 2005 [cited by applicant]
US 20050205954A1 · King et al. · 2005 [cited by applicant]
US 20050220984A1 · Sun et al. · 2005 [cited by applicant]
US 20060110844A1 · Lee et al. · 2006 [cited by applicant]
US 20060194357A1 · Hsu et al. · 2006 [cited by applicant]
US 20060243973A1 · Gilton · 2006 [cited by applicant]
US 20060249753A1 · Herner · 2006 [cited by applicant]
US 20060250836A1 · Herner et al. · 2006 [cited by applicant]
US 20060250837A1 · Herner · 2006 [cited by applicant]
US 20060289764A1 · Fiorini et al. · 2006 [cited by applicant]
US 20070034978A1 · Pralle et al. · 2007 [cited by applicant]
US 20070099329A1 · Maa et al. · 2007 [cited by applicant]
US 20070104411A1 · Ahn et al. · 2007 [cited by applicant]
US 20070141744A1 · Lee et al. · 2007 [cited by applicant]
US 20070170536A1 · Hsu et al. · 2007 [cited by applicant]
US 20070190722A1 · Herner · 2007 [cited by applicant]
US 20070228414A1 · Kumar et al. · 2007 [cited by applicant]
US 20070262296A1 · Bauer · 2007 [cited by applicant]
US 20080093622A1 · Li · 2008 [cited by examiner]
US 20080121805A1 · Tweet et al. · 2008 [cited by applicant]
US 20080157253A1 · Starikov et al. · 2008 [cited by applicant]
US 20080217651A1 · Liu et al. · 2008 [cited by applicant]
US 20080311696A1 · Chee-Wee et al. · 2008 [cited by applicant]
US 20080311718A1 · Futase · 2008 [cited by applicant]
US 20080316795A1 · Herner · 2008 [cited by applicant]
US 20080318397A1 · Herner · 2008 [cited by applicant]
US 20090032814A1 · Vashchenko et al. · 2009 [cited by applicant]
US 20090196631A1 · Daghighian et al. · 2009 [cited by applicant]
US 20100006784A1 · Mack et al. · 2010 [cited by applicant]
US 20100006961A1 · Yasaitis · 2010 [cited by applicant]
US 20100008675A1 · De Dobbelaere · 2010 [cited by applicant]
US 20100029033A1 · Carothers et al. · 2010 [cited by applicant]
US 20100046955A1 · De Dobbelaere et al. · 2010 [cited by applicant]
US 20100060972A1 · Kucharski et al. · 2010 [cited by applicant]
US 20100090110A1 · Tweet et al. · 2010 [cited by applicant]
US 20100102412A1 · Suh et al. · 2010 [cited by applicant]
US 20100133536A1 · Syllaios et al. · 2010 [cited by applicant]
US 20100133585A1 · Kim et al. · 2010 [cited by applicant]
US 20100151619A1 · Yasaitis · 2010 [cited by applicant]
US 20100213561A1 · Assefa et al. · 2010 [cited by applicant]
US 20100225791A1 · Nakayama · 2010 [cited by applicant]
US 20110008060A1 · Kucharski · 2011 [cited by applicant]
US 20110012221A1 · Fukikata et al. · 2011 [cited by applicant]
US 20110027950A1 · Jones et al. · 2011 [cited by applicant]
US 20110063024A1 · Kucharski et al. · 2011 [cited by applicant]
US 20110156183A1 · Liu · 2011 [cited by applicant]
US 20110227116A1 · Saito et al. · 2011 [cited by applicant]
US 20110236029A1 · De Dobbelaere et al. · 2011 [cited by applicant]
US 20110243569A1 · De Dobbelaere et al. · 2011 [cited by applicant]
US 20120001283A1 · Assefa et al. · 2012 [cited by applicant]
US 20120025212A1 · Kouvetakis et al. · 2012 [cited by applicant]
US 20120115310A1 · Miu · 2012 [cited by applicant]
US 20120129302A1 · Assefa et al. · 2012 [cited by applicant]
US 20120177378A1 · De Dobbelaere et al. · 2012 [cited by applicant]
US 20120187280A1 · Kerness et al. · 2012 [cited by applicant]
US 20120193636A1 · Stern · 2012 [cited by applicant]
US 20120205524A1 · Mack et al. · 2012 [cited by applicant]
US 20120252158A1 · Carothers et al. · 2012 [cited by applicant]
US 20120288971A1 · Boagaerts et al. · 2012 [cited by applicant]
US 20120288992A1 · Assefa et al. · 2012 [cited by applicant]
US 20130154042A1 · Meade · 2013 [cited by applicant]
US 20130202005A1 · Dutt · 2013 [cited by applicant]
US 20130214160A1 · Cazaux et al. · 2013 [cited by applicant]
US 20130228886A1 · JangJian et al. · 2013 [cited by applicant]
US 20130284889A1 · Giffard et al. · 2013 [cited by applicant]
US 20130313579A1 · Kouvetakis et al. · 2013 [cited by applicant]
US 20130328145A1 · Liu et al. · 2013 [cited by applicant]
US 20130336664A1 · Mack et al. · 2013 [cited by applicant]
US 20140008750A1 · Feshali et al. · 2014 [cited by applicant]
US 20140029892A1 · Pomerene et al. · 2014 [cited by applicant]
US 20140124669A1 · Zheng et al. · 2014 [cited by applicant]
US 20140131733A1 · Meade · 2014 [cited by applicant]
US 20140159129A1 · Wang et al. · 2014 [cited by applicant]
US 20140175510A1 · Suh et al. · 2014 [cited by applicant]
US 20140203325A1 · Verma et al. · 2014 [cited by applicant]
US 20140206190A1 · Li et al. · 2014 [cited by applicant]
US 20150177458A1 · Bowers et al. · 2015 [cited by applicant]
US 20160109655A1 · Vurgaftman · 2016 [cited by applicant]
US 20160197111A1 · Coolbaugh et al. · 2016 [cited by applicant]
US 20160223749A1 · Coolbaugh · 2016 [cited by applicant]
US 20160363729A1 · Baiocco et al. · 2016 [cited by applicant]
US 20170092626A1 · Yuan · 2017 [cited by applicant]
US 20170139132A1 · Patel et al. · 2017 [cited by applicant]
US 20170207600A1 · Klamkin et al. · 2017 [cited by applicant]
US 20170299809A1 · Boeuf et al. · 2017 [cited by applicant]
US 20180143374A1 · Coolbaugh et al. · 2018 [cited by applicant]
US 20180308824A1 · Hsiao et al. · 2018 [cited by applicant]
US 20180314003A1 · Coolbaugh et al. · 2018 [cited by applicant]
US 20190025513A1 · Coolbaugh et al. · 2019 [cited by applicant]
US 20190310417A1 · Coolbaugh et al. · 2019 [cited by applicant]
US 20190331941A1 · Coolbaugh et al. · 2019 [cited by applicant]
US 20200026003A1 · Coolbaugh et al. · 2020 [cited by applicant]
US 20200091124A1 · Liao · 2020 [cited by applicant]
US 20200166703A1 · Charles et al. · 2020 [cited by applicant]
US 20200166720A1 · Charles et al. · 2020 [cited by applicant]
CN 104882368 · 2015 [cited by applicant]
CN 106558577A · 2017 [cited by applicant]
CN 107408589 · 2017 [cited by applicant]
EP 2214042A1 · 2010 [cited by applicant]
EP 3002568 · 2016 [cited by applicant]
EP 3002568A1 · 2016 [cited by applicant]
EP 3336892 · 2016 [cited by applicant]
EP 3336892A1 · 2018 [cited by applicant]
GB 2552264A · 2018 [cited by applicant]
JP 2012256869A · 2012 [cited by examiner]
JP 6168598 · 2017 [cited by applicant]
TW 201448262 · 2014 [cited by applicant]
TW 201709546 · 2017 [cited by applicant]
WO WO2018098146A1 · 2018 [cited by applicant]
Bogaerts et al., Machine Translation of JP 2012-256869A. (Year: 2012). [cited by examiner]
Written Opinion, International Application No. PCT/US2019/052232, filed Sep. 20, 2019, dated May 11, 2020. [cited by applicant]
Search Report, International Application No. PCT/US2019/052232, filed Sep. 20, 2019, dated May 11, 2020. [cited by applicant]
Written Opinion, International Application No. PCT/US2019/052234, filed Sep. 20, 2019, dated Apr. 20, 2020. [cited by applicant]
Search Report, International Application No. PCT/US2019/052234, filed Sep. 20, 2019, dated Apr. 20, 2020. [cited by applicant]
International Application Status Report for Application No. PCT/US2019/052232, filed Sep. 20, 2019, dated Nov. 21, 2022. [cited by applicant]
Stintz, A. et al., “Low-Threshold Current Density 1.3-μm InAs Quantum-Dot Lasers with the Dots-in-a-Well (DWELL) Structure,” IEEE Photonics Technology Letters, vol. 12, No. 6, Jun. 2000, pp. 591-593. [cited by applicant]
Ray, S.K. et al., “Improved Temperature Performance of 1.31-μm Quantum Dot Lasers by Optimized Ridge Waveguide Design,” IEEE Photonics Technology Letters, vol. 17, No. 9, Sep. 2005, pp. 1785-1787 (+cover). [cited by applicant]
Crowley, M.T. et al., “GaAs-Based Quantum Dot Lasers,” Semiconductors and Semimetals, vol. 86, ISSN: 0080-8784, 2012, pp. 371-417. [cited by applicant]
Liu, G.T. et al., “Ultra-low threshold current density quantum dot lasers using the dots-in-a-well (DWELL) structure,” Physics and Simulation of Optoelectronic Devices VIII, vol. 3944, 2000, pp. 814-824. [cited by applicant]
Chen, S.M. et al., “1.3 μm InAs/GaAs quantum-dot laser monolithically grown on Si substrates operating over 100° C.,” Electronics Letters, vol. 50 No. 20, Sep. 25, 2014, pp. 1467-1468. [cited by applicant]
Kwoen, J. et al., “All MBE grown InAs/GaAs quantum dot lasers on on-axis Si (001),” Optics Express, vol. 26, No. 9, Apr. 30, 2018, pp. 11568-11576. [cited by applicant]
Park, C.Y. et al., “Electroluminescence at 1.3 μm from InAs/GaAs quantum dots monolithically grown on Ge/Si substrate by metal organic chemical vapor deposition,” IOPScience, The Japan Society of Applied Physics, 2016, … [cited by applicant]
Wang, J. et al., “1.3 μm InAs/GaAs quantum dot lasers on silicon with GaInP upper cladding layers,” Photonics Research, vol. 6, No. 4, Apr. 2018, pp. 321-325. [cited by applicant]
Lee A.D. et al., “InAs/GaAs Quantum-Dot Lasers Monolithically Grown on Si, Ge, and Ge-on-Si Substrates,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 19, No. 4, Jul./Aug. 2013, 7 pages. [cited by applicant]
Wan, Y. et al., “InAs/GaAs quantum dots on GaAs-on-V-grooved-Si substrate with high optical quality in the 1.3 μm band,” Applied Physics Letters, 2015, 081106-1 thru 081106-4 (+cover). [cited by applicant]
Chen, S. et al., “Electrically pumped continuous-wave III-V quantum dot lasers on silicon,” Nature Photonics, 2016, pp. 1-6. [cited by applicant]
Tang, M. et al., “Optimizations of Defect Filter Layers for 1.3-μm InAs/GaAs Quantum-Dot Lasers Monolithically Grown on Si Substrates,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 22, No. 6, Nov./Dec. 2… [cited by applicant]
Liu, G.T. ct al, “Thc Influcncc of Quantum-Wcll Composition on thc Pcrformancc of Quantum Dot Lasers Using InAs/InGaAs Dots-in-a-Well (DWELL) Structures,” IEEE Journal of Quantum Electronics, vol. 36, No. 11, Nov. 2000,… [cited by applicant]
Lu et al. “Via-First Inter-Wafer Vertical Interconnects utilizing Wafer-Bonding of Damascene-Patterned Metal/Adhesive Redistribution Layers”; Proceedings of 3D Packaging Workshop at IPAMS International Conference on Dev… [cited by applicant]
Skordas et al. “Wafer-Scale oxide Fusion Bonding and Wafer Thinning Development for 3D Systems Integration”; 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration; May 22-23, 2012; pp. 203-2… [cited by applicant]
Office Action; Intellectual Property Office of the Republic of China; Application No. 108133748; Feb. 22, 2023; 12 pages. (submitted with copy of original document and full text English translation). [cited by applicant]
Search Report; Taiwan Intellectual Property Office; Application No. 108133748; Feb. 20, 2023; 2 pages. [cited by applicant]
Office Action; Intellectual Property Office of the Republic of China; Application No. 108133748; Nov. 7, 2023. 2 pages. [cited by applicant]
Communication pursuant to Article 94(3) EPC; European Patent Office; Application No. 19863977.5-1020; Jan. 2, 2024. 7 pages. [cited by applicant]
Office Action; Korean Intellectual Property Office; Application No. 10-2021-7016814; Sep. 9, 2024; 16 pages (submitted with copy of original document and full text English translation). [cited by applicant]
European Patent Office Office Action issued in EU Application 19863977.5, dated Jan. 30, 2025. 7 pages. [cited by applicant]