Electronic component and method of manufacturing the same
One object of the present invention is to provide an electronic component less prone to migration of impurity atoms between a conductor and an external electrode. A coil component as an electronic component includes a base body, a conductor, a first external electrode electrically connected to one end portion of the conductor, a second external electrode electrically connected to the other end portion of the conductor, a first film positioned between one end portion of the conductor and the first external electrode, and a second film positioned between the other end portion of the conductor and the second external electrode. The diffusion velocity in the first film and the second film is lower than that in the first external electrode and the second external electrode.
1. An electronic component, comprising:
a base body;
a conductor provided inside or outside the base body;
a first external electrode and a second external electrode both electrically connected to the conductor; and
a first film positioned between the first external electrode and one end portion of the conductor electrically connected to the first external electrode, and
a second film positioned between the second external electrode and the other end portion of the conductor electrically connected to the second external electrode,
wherein a diffusion velocity in the first film and the second film is lower than that in the first external electrode and the second external electrode, and
wherein the first film and the second film are nitride films, carbonized films, or oxynitride films, and
wherein the nitride films include TaN, FeN, SiN or AlN, and the oxynitride films include TaON.
2. The electronic component of claim 1 , wherein a thickness of the first film and a thickness of the second film are 10 nm to 200 nm.
3. The electronic component of claim 1 , wherein the first film and the second film are amorphous.
4. The electronic component of claim 1 , wherein indentations in an interface between the first film and the first external electrode and an interface between the second film and the second external electrode are larger than indentations in surfaces of the first external electrode and the second external electrode.
5. The electronic component of claim 1 , wherein the conductor includes a portion wound around a coil axis.
6. A circuit board comprising the electronic component of claim 1 .
7. An electronic device comprising the circuit board of claim 6 .
8. A method of manufacturing an electronic component including a base body, a conductor provided inside or outside the base body, and a first external electrode and a second external electrode both electrically connected to the conductor, the method comprising:
a first step of positioning a first end portion and a second end portion of the conductor at a surface of the base body, the first end portion being configured to be electrically connected with the first external electrode, the second end portion being configured to be electrically connected with the second external electrode;
a second step of forming a first film and a second film, the first film being electrically connected with the first end portion, the second film being electrically connected with the second end portion; and
a third step of forming a first external electrode and a second external electrode, the first external electrode being electrically connected with the first film, the second external electrode being electrically connected with the second film,
wherein in the second step, the first film and the second film are formed of a material having a lower diffusion velocity than a material forming the first external electrode and the second external electrode, the first film and the second film being nitride films, carbonized films, or oxynitride films, the nitride films including TaN, FeN, SiN or AlN, the oxynitride films including TaON.