Circuit board and display device including the same
A circuit board includes a board including a first surface and a second surface opposing the first surface, where the board includes at least one conductive layer and at least insulating layer, a plurality of electronic elements disposed on the first surface of the board, and a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements. The resistive pads have a resistance of zero ohm.
1. A circuit board comprising:
a board including a first surface and a second surface opposing the first surface, wherein the board includes at least one conductive layer and at least one insulating layer;
a plurality of electronic elements disposed on the first surface of the board;
a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements; and
a conductive pattern disposed on the resistive pads,
wherein the resistive pads are disposed between the electronic elements and the conductive pattern in a thickness direction of the board such that a portion of the resistive pads in direct contact with the conductive pattern overlaps the electric component in the thickness direction,
wherein the at least one conductive layer and the at least one insulating layer extend parallel to each other along a plane perpendicular to the thickness direction of the board, and
wherein the resistive pads have a resistance of zero ohm.
2. The circuit board of claim 1 , wherein the conductive pattern electrically connects at least two resistive pads among the resistive pads to each other.
3. The circuit board of claim 2 , wherein the conductive pattern comprises a conductive tape having an adhesive property.
4. The circuit board of claim 1 , wherein
the board comprises a first insulating layer, which defines the second surface,
a plurality of opening portions is defined through the first insulating layer, and
the resistive pads are respectively disposed in the opening portions.
5. The circuit board of claim 4 , wherein the first insulating layer comprises a photo solder resist.
6. The circuit board of claim 1 , wherein
the at least one conductive layer and the at least one insulating layer of the board are each provided in plural,
a plurality of conductive layers and a plurality of insulating layers are disposed alternately with each other,
at least two conductive layers among the conductive layers are connected to each other through a hole defined in an insulating layer disposed therebetween.
7. The circuit board of claim 1 , wherein the electronic elements comprise at least one selected from a timing controller, a voltage generator, a resistor, an inductor, and a capacitor.
8. The circuit board of claim 7 , wherein the resistive pads are electrically connected to at least one selected from the voltage generator and the timing controller.
9. The circuit board of claim 1 , wherein the at least one conductive layer extends entirely between opposite ends of the board along a direction perpendicular to the thickness direction of the board.
10. The circuit board of claim 1 , wherein an entirety of one of the electronic elements overlaps the resistive pad in the thickness direction of the board.
11. The circuit board of claim 1 , wherein an entirety of one of the resistive pads overlaps the conductive pattern in the thickness direction of the board.
12. The circuit board of claim 1 , wherein an entirety of one of the electronic elements overlaps the conductive pattern in the thickness direction of the board.
13. The circuit board of claim 1 , wherein an entirety of an upper surface of the resistive pads is a flat surface.