IP Library Granted Patent US 12,414,342
Granted Patent B2
US 12,414,342 · App. 17/844,052 · Granted Sep 9, 2025

Semiconductor device

Inventors: Yasunori Agata (Matsumoto, JP); Tohru Shirakawa (Matsumoto, JP)
Assignee: FUJI ELECTRIC CO., LTD.
H10D62/137H10D12/481H10D62/112H10D62/142H10D62/393
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Quick Facts
Patent No.
US 12,414,342
App. No.
17/844,052
Granted
Sep 9, 2025
Kind
B2
Abstract

A semiconductor device, including, a drift region of a first conductivity type provided on a semiconductor substrate; a field stop region of a first conductivity type provided below the drift region and having one or more peaks; and a collector region of a second conductivity type provided below the field stop region, wherein when an integral concentration of the collector region is set to be x [cm −2 ], a depth of a first peak that is a shallowest from the back surface of the semiconductor substrate out of the one or more peaks is set to be y 1 [μm], line A 1 : y 1 =(−7.4699E−01)ln(x)+(2.7810E+01), and line B 1 : y 1 =(−4.7772E−01)ln(x)+(1.7960E+01), a depth of the first peak and the integral concentration are within a range between a line A 1 and a line B 1 , is provided.

Claims (68)

1. A semiconductor device comprising:

a drift region of a first conductivity type provided on a semiconductor substrate;

a field stop region of a first conductivity type provided below the drift region and having one or more peaks of a doping concentration in a depth direction; and

a collector region of a second conductivity type provided below the field stop region,

wherein when an integral in the depth direction of a dopant concentration of the collector region is set to be x [cm −2 ], a depth of a first peak of the one or more peaks of the doping concentration of the field stop region that is a shallowest from a back surface of the semiconductor substrate is set to be y 1 [μm],

line A 1: y 1[μm]=(−7.4699E-01)ln( x [cm −2 ])+(2.7810E+01), and

line B 1: y 1[μm]=(−4.7772E-01)ln( x [cm −2 ])+(1.7960E+01),

the depth of the first peak [μm] and the integral in the depth direction of the dopant concentration [cm −2 ] of the collector region are within a range between the line A 1 [μm/cm −2 ] and the line B 1 [μm/cm −2 ], and

the collector region includes a peak of the dopant concentration in the depth direction that is higher than a doping concentration of the first peak in the field stop region.

2. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 8.00E15 cm −2 or less.

3. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 3.00E14 cm −2 or less.

4. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 2.00E14 cm −2 or less.

5. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 1.00E14 cm −2 or less.

6. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 5.00E13 cm −2 or less.

7. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 3.00E13 cm −2 or less.

8. The semiconductor device according to claim 1 , wherein

the integral of concentration of the collector region is 1.00E13 cm −2 or less.

9. The semiconductor device according to claim 1 , wherein

a depth of the first peak is 0.5 μm or more and 7.2 μm or less.

10. The semiconductor device according to claim 1 , wherein

a depth of the first peak is 2.0 μm or more and 7.2 μm or less.

11. The semiconductor device according to claim 1 , wherein

a depth of a second peak of the one or more peaks of the doping concentration that is a second shallowest from the back surface is set to be y 2 [μm],

line A 2: y 2[μm]=(−3.1095E+00)ln( x [cm −2 ])+(1.1416E+02), and

line B 2: y 2[μm]=(−1.9239E+00)ln( x [cm −2 ])+(7.1030E+01),

a depth of the second peak and the integral of concentration are within a range between the line A 2 and the line B 2 .

12. The semiconductor device according to claim 11 , wherein

a depth of the second peak is 3.5 μm or more and 28 μm or less.

13. The semiconductor device according to claim 1 , wherein

a dopant of the one or more peaks of the doping concentration is hydrogen.

14. The semiconductor device according to claim 1 , further comprising:

an active region provided on the semiconductor substrate; and

an outer peripheral region provided in an outer periphery of the active region in a top view of the semiconductor substrate.

15. The semiconductor device according to claim 1 , further comprising:

a base region of the second conductivity type provided above the drift region;

an emitter region of the first conductivity type provided above the base region and whose doping concentration is higher than that of the drift region;

a contact region of the second conductivity type provided above the base region and whose doping concentration is higher than that of the base region; and

a plurality of gate trench portions provided on the semiconductor substrate.

16. The semiconductor device according to claim 1 , wherein

a doping concentration in a boundary between the field stop region and the collector region is 1E16 cm −3 or less.

17. The semiconductor device according to claim 1 , wherein

a doping concentration in a boundary between the field stop region and the collector region is 5E15 cm−3 or less.

18. The semiconductor device according to claim 1 , wherein

a doping concentration in a boundary between the field stop region and the collector region is 2E15 cm −3 or less.

19. The semiconductor device according to claim 1 , wherein

a hydrogen chemical concentration in a boundary between the field stop region and the collector region is 1E18 cm −3 or less.

20. The semiconductor device according to claim 1 , wherein

a hydrogen chemical concentration in a boundary between the field stop region and the collector region is 1E17 cm −3 or less.

21. The semiconductor device according to claim 1 , wherein

a hydrogen chemical concentration in a boundary between the field stop region and the collector region is 1E15 cm −3 or more.

22. The semiconductor device according to claim 1 , wherein

a hydrogen chemical concentration in a boundary between the field stop region and the collector region is 1E16 cm −3 or more.

23. The semiconductor device according to claim 1 , wherein

a dopant of the first peak is phosphorous.

24. The semiconductor device according to claim 1 , wherein

a dopant of peaks of the doping concentration other than the first peak out of the one or more peaks is hydrogen.

25. The semiconductor device according to claim 1 , wherein

a front surface side region of the semiconductor substrate does not comprise a lifetime killer region.

26. A system comprising the semiconductor device according to claim 1 , wherein the semiconductor device is coupled to a circuit having

a stray inductance Ls set to be Xc [nH], and a collector current decrease rate dice/dt set to be Yc [A/μs], and

line C 1: Yc= 10000 Xc −1 ,

the stray inductance Ls and the collector current decrease rate dice/dt are within a range that is greater than the line C 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2022
From: AGATA, YASUNORI; SHIRAKAWA, TOHRU
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 060244/0544 →
Priority Claims (1)
JP 2020-121285 · Jul 15, 2020 · national
Continuity (2)
Continuation PCTJP2021026375 · Jul 13, 2021
Related Publication 20220320288A1 · Oct 6, 2022
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