IP Library › Granted Patent US 12,457,754
Granted Patent B2
US 12,457,754 · App. 18/169,436 · Granted Oct 28, 2025

Nonvolatile memory device and operating method of the same

Inventors: Yumin Kim (Suwon-si, KR); Jooheon Kang (Suwon-si, KR); Sunho Kim (Suwon-si, KR); Seyun Kim (Suwon-si, KR); Garam Park (Suwon-si, KR); Hyunjae Song (Suwon-si, KR); Dongho Ahn (Suwon-si, KR); Seungyeul Yang (Suwon-si, KR); Myunghun Woo (Suwon-si, KR); Jinwoo Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H10B63/34G06N3/063G11C13/0007G11C13/003H10B63/845G11C2213/71G11C2213/75G11C2213/79
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Quick Facts
Patent No.
US 12,457,754
App. No.
18/169,436
Granted
Oct 28, 2025
Kind
B2
Abstract

Provided are a nonvolatile memory device and an operating method thereof. The nonvolatile memory device may include a conductive pillar, a resistance change layer surrounding a side surface of the conductive pillar, a semiconductor layer surrounding a side surface of the resistance change layer, a gate insulating layer surrounding a side surface of the semiconductor layer, and a plurality of insulating patterns and a plurality of gate electrodes alternately arranged along a surface of the gate insulating layer. The plurality of insulating patterns and the plurality of gate electrodes may surround a side surface of the gate insulating layer.

Claims (42)

1. A nonvolatile memory device comprising:

a conductive pillar;

a resistance change layer surrounding a side surface of the conductive pillar;

a semiconductor layer surrounding a side surface of the resistance change layer;

a gate insulating layer surrounding a side surface of the semiconductor layer;

a plurality of insulating patterns and a plurality of gate electrodes, the plurality of insulating patterns and the plurality of gate electrodes being alternately arranged along a surface of the gate insulating layer, and the plurality of insulating patterns and the plurality of gate electrodes surrounding a side surface of the gate insulating layer;

a second bit line electrically connected to the conductive pillar, the second bit line being configured to provide a first voltage to the conductive pillar; and

a first bit line electrically insulated from the second bit line, the first bit line being electrically connected to the semiconductor layer, and the first bit line being configured to provide a second voltage to the semiconductor layer.

2. The nonvolatile memory device of claim 1 , wherein the first voltage and the second voltage are different from each other.

3. The nonvolatile memory device of claim 1 , wherein the first voltage is greater than the second voltage.

4. The nonvolatile memory device of claim 1 , wherein a difference between the first voltage and the second voltage is less than an absolute value of the second voltage.

5. The nonvolatile memory device of claim 1 , wherein an absolute value of the second voltage is about 5 V or less.

6. The nonvolatile memory device of claim 1 , further comprising:

a controller, wherein

the controller is configured to apply a turn-off voltage to a gate electrode corresponding to a selection memory cell in the plurality of gate electrodes, and

the controller is configured to apply a turn-on voltage to a gate electrode corresponding to a non-selection memory cell in the plurality of gate electrodes.

7. The nonvolatile memory device of claim 6 , wherein the turn-off voltage is less than at least one of the first voltage and the second voltage.

8. The nonvolatile memory device of claim 6 , wherein the turn-on voltage is greater than at least one of the first voltage and the second voltage.

9. The nonvolatile memory device of claim 6 , wherein a difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage.

10. The nonvolatile memory device of claim 1 , wherein all regions of the conductive pillar are spatially spaced apart from all regions of the semiconductor layer.

11. The nonvolatile memory device of claim 1 , further comprising:

an insulating layer between the resistance change layer and the conductive pillar.

12. The nonvolatile memory device of claim 1 , further comprising:

an insulating layer in the conductive pillar.

13. The nonvolatile memory device of claim 12 , wherein

the insulating layer in the conductive pillar is in contact with the resistance change layer.

14. An operating method of a nonvolatile memory device, the nonvolatile memory device including a conductive pillar and a memory cell array along a side of the conductive pillar, the operating method comprising:

applying a turn-off voltage to a selection memory cell in the memory cell array;

applying a turn-on voltage to a non-selection memory cell in the memory cell array; and

during an operation on the selection memory cell, applying a first voltage to the conductive pillar and applying a second voltage to the memory cell array, the second voltage being different from the first voltage, wherein

a difference between the first voltage and the second voltage is less than an absolute value of the second voltage.

15. The operating method of claim 14 , wherein the first voltage is greater than the second voltage.

16. The operating method of claim 14 ,

wherein the difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage.

17. The operating method of claim 14 , wherein the absolute value of the second voltage is about 5 V or less.

18. The operating method of claim 14 , wherein the turn-off voltage is less than at least one of the first voltage and the second voltage.

19. The operating method of claim 14 , wherein the turn-on voltage is greater than at least one of the first voltage and the second voltage.

20. An operating method of a nonvolatile memory device, the nonvolatile memory device including a conductive pillar and a memory cell array along a side of the conductive pillar, the operating method comprising:

applying a turn-off voltage to a selection memory cell in the memory cell array;

applying a turn-on voltage to a non-selection memory cell in the memory cell array; and

during an operation on the selection memory cell, applying a first voltage to the conductive pillar and applying a second voltage to the memory cell array, the second voltage being different from the first voltage,

wherein a difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2023
From: KIM, YUMIN; KANG, JOOHEON; KIM, SUNHO; KIM, SEYUN; PARK, GARAM; SONG, HYUNJAE; AHN, DONGHO; YANG, SEUNGYEUL; WOO, MYUNGHUN; LEE, JINWOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062744/0731 →
Priority Claims (1)
KR 10-2022-0102228 · Aug 16, 2022 · national
Continuity (1)
Related Publication 20240065000A1 · Feb 22, 2024
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