IP Library Granted Patent US 12,646,549
Granted Patent B2
US 12,646,549 · App. 18/781,916 · Granted Jun 2, 2026

Non-linear polar material based multi-capacitor bit-cell with shared gain element with series transistor

Inventors: Rajeev Kumar Dokania (Beaverton, OR); Mustansir Yunus Mukadam (Seattle, WA); Erik Unterborn (Cary, NC); Pramod Kolar (Cary, NC); Amrita Mathuriya (Portland, OR); Debo Olaosebikan (San Francisco, CA); Tanay Gosavi (Portland, OR); Noriyuki Sato (Palo Alto, CA); Sasikanth Manipatruni (Portland, OR)
Assignee: Kepler Computing Inc.
G11C11/221G11C11/2255G11C11/2257G11C11/2259G11C11/2273
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Quick Facts
Patent No.
US 12,646,549
App. No.
18/781,916
Granted
Jun 2, 2026
Kind
B2
Abstract

Described herein is a memory bit-cell that results in lower leakage and higher sensing margin. In at least one embodiment, a memory bit-cell comprises a plurality of capacitors, wherein an individual capacitor is coupled to a node and an individual plate-line. In at least one embodiment, memory bit-cell comprises a first transistor coupled to the node. In at least one embodiment, memory bit-cell comprises a second transistor coupled in series with the first transistor, wherein the second transistor is coupled to a bit-line, wherein the first transistor or the second transistor is controllable by a word-line, and wherein the word-line is parallel to the individual plate-line.

Claims (64)

1 . An apparatus comprising:

a first plurality of capacitors, wherein a first individual capacitor of the first plurality of capacitors is coupled to a first node and a first individual plate-line;

a second plurality of capacitors, wherein a second individual capacitor of the second plurality of capacitors is coupled to a second node and a second individual plate-line;

a first transistor having a first gate terminal coupled to a first control, wherein the first transistor is coupled to the first node;

a second transistor having a second gate terminal coupled to by a second control, wherein the second transistor is coupled to the second node;

a third node, wherein the first transistor and the second transistor are coupled to the third node;

a third transistor having a third gate terminal coupled to the third node;

a fourth transistor coupled in series with the third transistor, wherein the fourth transistor is coupled to a sense-line; and

a fifth transistor coupled to the third node and a bit-line.

2 . The apparatus of claim 1 , wherein the third transistor has a third drain terminal coupled to a reference.

3 . The apparatus of claim 1 , wherein the fourth transistor is controllable to reduce leakage through the third node.

4 . The apparatus of claim 1 , wherein the fifth transistor is controllable by a word-line, and wherein the fourth transistor is smaller in size than the third transistor.

5 . The apparatus of claim 1 , wherein the fourth transistor is controllable by a word-line.

6 . The apparatus of claim 1 , wherein the fourth transistor is controllable by a read word-line.

7 . The apparatus of claim 1 , wherein the first individual capacitor comprises a non-linear polar material.

8 . The apparatus of claim 7 , wherein the non-linear polar material is directly on the first node.

9 . The apparatus of claim 7 , wherein the non-linear polar material is one of a ferroelectric material, a paraelectric material, or a non-linear dielectric material.

10 . The apparatus of claim 7 , wherein the non-linear polar material is doped with one or more elements of a 3d, 4d, 5d, 6d, 4f, and 5f series of a periodic table.

11 . The apparatus of claim 7 , wherein the non-linear polar material includes one of:

a perovskite material which includes one of: BaTiO 3 , PbTiO 3 , KNbO 3 , or NaTaO 3 ;

bismuth ferrite (BFO);

barium titanate (BTO);

BFO doped with one of: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Zn;

BTO doped with one of: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Zn;

LBFO doped with Mn;

lead zirconium titanate (PZT) or PZT with a first doping material, wherein the first doping material is one of La, Nb, Mn, or 5d series elements;

bismuth ferrite (BFO) with a second doping material, wherein the second doping material is one of lanthanum, elements from lanthanide series of a periodic table, or elements of a 3d, 4d, 5d, 6d, 4f, and 5f series of the periodic table;

a relaxor ferroelectric material which includes one of: lead magnesium niobate (PMN), lead magnesium niobate-lead titanate (PMN-PT), lead lanthanum zirconate titanate (PLZT), lead scandium niobate (PSN), barium titanium-bismuth zinc niobium tantalum (BT-BZNT), or barium titanium-barium strontium titanium (BT-BST);

a hexagonal ferroelectric which includes one of: YMnO 3 or LuFeO 3 ;

hexagonal ferroelectrics of a type h-RMnO 3 , wherein R is a rare earth element which includes one of: cerium (Ce), dysprosium (Dy), erbium (Er), europium (Eu), gadolinium (Gd), holmium (Ho), lanthanum (La), lutetium (Lu), neodymium (Nd), praseodymium (Pr), promethium (Pm), samarium (Sm), scandium (Sc), terbium (Tb), thulium (Tm), ytterbium (Yb), or yttrium (Y); hafnium (Hf), zirconium (Zr), aluminum (Al), silicon (Si), their oxides, or their alloyed oxides;

hafnium oxides as Hf (1-x) E x O y , where E includes one of Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, Zr, or Y, where x and y are first and second fractions, respectively;

Al (1-x) Sc (x) N, Ga (1-x) Sc (x) N, Al (1-x) Y (x) N or Al (1-x-y) Mg (x) Nb (y) N, where x and y are third and fourth fractions, respectively;

y doped HfO 2 , where y includes one of: Al, Ca, Ce, Dy, Er, Gd, Ge, La, Sc, Si, Sr, Sn, or Y; or

niobate type compounds LiNbO 3 , LiTaO 3 , lithium iron tantalum oxyfluoride, barium strontium niobate, sodium barium niobate, or potassium strontium niobate;

an improper ferroelectric material which includes one of: [PTO/STO]n or [LAO/STO]n, wherein ‘n’ is between 1 and 100, or a paraelectric material that comprises SrTiO 3 , Ba (x) Sr (y) TiO 3 , HfZrO 2 , Hf—Si—O, La-substituted PbTiO 3 , or a PMN-PT based relaxor ferroelectric; or

a paraelectric material that comprises SrTiO 3 , Ba (x) Sr (y) TiO 3 , HfZrO 2 , Hf—Si—O, or a PMN-PT based relaxor ferroelectric.

12 . The apparatus of claim 1 , wherein the first plurality of capacitors and the second plurality of capacitors are planar capacitors that are arranged in a stacked and/or folded configuration.

13 . The apparatus of claim 12 , wherein the first individual capacitor comprises a non-linear polar material.

14 . An apparatus comprising:

a first plurality of capacitors, wherein a first individual capacitor of the first plurality of capacitors is coupled to a first node and a first individual plate-line;

a second plurality of capacitors, wherein a second individual capacitor of the second plurality of capacitors is coupled to a second node and a second individual plate-line;

a first transistor having a first gate terminal coupled to a first control, wherein the first transistor is coupled to the first node;

a second transistor having a second gate terminal coupled to by a second control, wherein the second transistor is coupled to the second node;

a third node, wherein the first transistor and the second transistor are coupled to the third node;

a third transistor having a third gate terminal coupled to the third node and to a sense-line;

a fourth transistor coupled in series with the third transistor, wherein the fourth transistor is coupled to a reference; and

a fifth transistor coupled to the third node and a bit-line.

15 . The apparatus of claim 14 , wherein the fifth transistor is controllable by a word-line, wherein the first individual plate-line is parallel to the word-line.

16 . The apparatus of claim 15 , wherein the fourth transistor has a fourth gate terminal controllable by the word-line.

17 . The apparatus of claim 15 , wherein the fourth transistor has a fourth gate terminal controllable by a read word-line.

18 . The apparatus of claim 14 , wherein the fourth transistor is controllable to reduce leakage through the third node to the sense-line.

19 . The apparatus of claim 14 , wherein the fourth transistor is smaller in size than the third transistor.

20 . A system comprising:

a memory to store instructions;

a processor circuitry to execute the instructions; and

a communication interface to allow the processor circuitry to communicate with another device, wherein the memory includes:

a first plurality of capacitors, wherein a first individual capacitor of the first plurality of capacitors is coupled to a first node and a first individual plate-line;

a second plurality of capacitors, wherein a second individual capacitor of the second plurality of capacitors is coupled to a second node and a second individual plate-line;

a first transistor having a first gate terminal coupled to a first control, wherein the first transistor is coupled to the first node;

a second transistor having a second gate terminal coupled to by a second control, wherein the second transistor is coupled to the second node;

a third node, wherein the first transistor and the second transistor are coupled to the third node;

a third transistor having a third gate terminal coupled to the third node;

a fourth transistor coupled in series with the third transistor, wherein the fourth transistor is coupled to a sense-line; and

a fifth transistor coupled to the third node and a bit-line.

Continuity (2)
Continuation 18161808 · Jan 30, 2023
Related Publication 20240379144A1 · Nov 14, 2024
References Cited (256)
US 4809225A · Dimmler et al. · 1989 [cited by applicant]
US 4853893A · Eaton, Jr. et al. · 1989 [cited by applicant]
US 5086412A · Jaffe et al. · 1992 [cited by applicant]
US 5218566A · Papaliolios · 1993 [cited by applicant]
US 5270967A · Moazzami et al. · 1993 [cited by applicant]
US 5381364A · Chern et al. · 1995 [cited by applicant]
US 5383150A · Nakamura et al. · 1995 [cited by applicant]
US 5539279A · Takeuchi et al. · 1996 [cited by applicant]
US 5541872A · Lowrey et al. · 1996 [cited by applicant]
US 5638318A · Seyyedy · 1997 [cited by applicant]
US 5640030A · Kenney · 1997 [cited by applicant]
US 5760432A · Abe et al. · 1998 [cited by applicant]
US 5917746A · Seyyedy · 1999 [cited by applicant]
US 5926413A · Yamada et al. · 1999 [cited by applicant]
US 5969380A · Seyyedy · 1999 [cited by applicant]
US 6002608A · Tanabe · 1999 [cited by applicant]
US 6028784A · Mori et al. · 2000 [cited by applicant]
US 6031754A · Derbenwick et al. · 2000 [cited by applicant]
US 6043526A · Ochiai · 2000 [cited by applicant]
US 6147895A · Kamp · 2000 [cited by applicant]
US 6346741B1 · Buskirk et al. · 2002 [cited by applicant]
US 6358810B1 · Dornfest et al. · 2002 [cited by applicant]
US 6388281B1 · Jung et al. · 2002 [cited by applicant]
US 6483737B2 · Takeuchi et al. · 2002 [cited by applicant]
US 6500678B1 · Aggarwal et al. · 2002 [cited by applicant]
US 6515957B1 · Newns et al. · 2003 [cited by applicant]
US 6538914B1 · Chung · 2003 [cited by applicant]
US 6548343B1 · Summerfelt et al. · 2003 [cited by applicant]
US 6587367B1 · Nishimura et al. · 2003 [cited by applicant]
US 6590245B2 · Ashikaga · 2003 [cited by applicant]
US 6610549B1 · Aggarwal et al. · 2003 [cited by applicant]
US 6643163B2 · Takashima · 2003 [cited by examiner]
US 6646906B2 · Salling · 2003 [cited by applicant]
US 6656301B2 · Kirby · 2003 [cited by applicant]
US 6656748B2 · Hall et al. · 2003 [cited by applicant]
US 6713342B2 · Celii et al. · 2004 [cited by applicant]
US 6717838B2 · Hosoi · 2004 [cited by applicant]
US 6720600B2 · Okita · 2004 [cited by applicant]
US 6728128B2 · Nishimura et al. · 2004 [cited by applicant]
US 6734477B2 · Moise et al. · 2004 [cited by applicant]
US 6795331B2 · Noro · 2004 [cited by applicant]
US 6798686B2 · Takashima · 2004 [cited by applicant]
US 6809949B2 · Ho · 2004 [cited by applicant]
US 6819584B2 · Noh · 2004 [cited by applicant]
US 6856534B2 · Rodriguez et al. · 2005 [cited by applicant]
US 6873536B2 · Komatsuzaki · 2005 [cited by applicant]
US 6906944B2 · Takeuchi et al. · 2005 [cited by applicant]
US 6924997B2 · Chen et al. · 2005 [cited by applicant]
US 7029925B2 · Celii et al. · 2006 [cited by applicant]
US 7173844B2 · Lee et al. · 2007 [cited by applicant]
US 7405959B2 · Koide et al. · 2008 [cited by applicant]
US 7426130B2 · Jeon · 2008 [cited by applicant]
US 7514734B2 · Aggarwal et al. · 2009 [cited by applicant]
US 7642099B2 · Fukada et al. · 2010 [cited by applicant]
US 7791922B2 · Doumae et al. · 2010 [cited by applicant]
US 7812385B2 · Noda · 2010 [cited by applicant]
US 8129200B2 · Kang · 2012 [cited by applicant]
US 8177995B2 · Kobayashi et al. · 2012 [cited by applicant]
US 8300446B2 · Qidwai · 2012 [cited by applicant]
US 8441833B2 · Summerfelt et al. · 2013 [cited by applicant]
US 8508974B2 · Clinton et al. · 2013 [cited by applicant]
US 8665628B2 · Kawashima · 2014 [cited by applicant]
US 8717800B2 · Clinton et al. · 2014 [cited by applicant]
US 8865628B2 · Manabe et al. · 2014 [cited by applicant]
US 9472560B2 · Ramaswamy et al. · 2016 [cited by applicant]
US 9786348B1 · Kawamura et al. · 2017 [cited by applicant]
US 9812204B1 · Yan et al. · 2017 [cited by applicant]
US 9818468B2 · Müller · 2017 [cited by applicant]
US 9830969B2 · Slesazeck et al. · 2017 [cited by applicant]
US 10043567B2 · Slesazeck et al. · 2018 [cited by applicant]
US 10354712B2 · Derner et al. · 2019 [cited by applicant]
US 10600808B2 · Schröder · 2020 [cited by applicant]
US 10847201B2 · Manipatruni et al. · 2020 [cited by applicant]
US 10854265B2 · Toops · 2020 [cited by examiner]
US 10872905B2 · Müller · 2020 [cited by applicant]
US 10963776B2 · Mulaosmanovic et al. · 2021 [cited by applicant]
US 10998025B2 · Manipatruni et al. · 2021 [cited by applicant]
US 11482270B1 · Dokania et al. · 2022 [cited by applicant]
US 11532635B1 · Dokania · 2022 [cited by examiner]
US 20020079520A1 · Nishihara et al. · 2002 [cited by applicant]
US 20020125517A1 · Nakamura · 2002 [cited by applicant]
US 20020153550A1 · An et al. · 2002 [cited by applicant]
US 20030012984A1 · Ueda · 2003 [cited by applicant]
US 20030112650A1 · Kang · 2003 [cited by applicant]
US 20030119211A1 · Summerfelt et al. · 2003 [cited by applicant]
US 20030129847A1 · Celii et al. · 2003 [cited by applicant]
US 20030141528A1 · Ito · 2003 [cited by applicant]
US 20040027873A1 · Nishihara · 2004 [cited by applicant]
US 20040089854A1 · Chen et al. · 2004 [cited by applicant]
US 20040104754A1 · Bruchhaus et al. · 2004 [cited by applicant]
US 20040129961A1 · Araujo et al. · 2004 [cited by applicant]
US 20040184307A1 · Saito · 2004 [cited by examiner]
US 20040233696A1 · Kang · 2004 [cited by applicant]
US 20040245547A1 · Stipe · 2004 [cited by applicant]
US 20050012126A1 · Udayakumar et al. · 2005 [cited by applicant]
US 20050214954A1 · Maruyama et al. · 2005 [cited by applicant]
US 20050230725A1 · Aggarwal et al. · 2005 [cited by applicant]
US 20050244988A1 · Wang et al. · 2005 [cited by applicant]
US 20060001070A1 · Park et al. · 2006 [cited by applicant]
US 20060002170A1 · Kumura et al. · 2006 [cited by applicant]
US 20060006447A1 · Kim et al. · 2006 [cited by applicant]
US 20060073613A1 · Aggarwal et al. · 2006 [cited by applicant]
US 20060073614A1 · Hara · 2006 [cited by applicant]
US 20060134808A1 · Summerfelt et al. · 2006 [cited by applicant]
US 20060258113A1 · Sandhu et al. · 2006 [cited by applicant]
US 20070298521A1 · Obeng et al. · 2007 [cited by applicant]
US 20080007987A1 · Takashima · 2008 [cited by examiner]
US 20080073680A1 · Wang · 2008 [cited by applicant]
US 20080081380A1 · Celii et al. · 2008 [cited by applicant]
US 20080101107A1 · Shiga et al. · 2008 [cited by applicant]
US 20080107885A1 · Alpay et al. · 2008 [cited by applicant]
US 20080191252A1 · Nakamura et al. · 2008 [cited by applicant]
US 20090003042A1 · Lee et al. · 2009 [cited by applicant]
US 20090103348A1 · Du · 2009 [cited by examiner]
US 20120127776A1 · Kawashima · 2012 [cited by applicant]
US 20120134196A1 · Evans, Jr. et al. · 2012 [cited by applicant]
US 20120307545A1 · McAdams et al. · 2012 [cited by applicant]
US 20120313218A1 · Fujimori et al. · 2012 [cited by applicant]
US 20130147295A1 · Shimizu · 2013 [cited by applicant]
US 20140208041A1 · Hyde et al. · 2014 [cited by applicant]
US 20150069481A1 · Sun et al. · 2015 [cited by applicant]
US 20150294702A1 · Lee et al. · 2015 [cited by applicant]
US 20170069735A1 · Oh et al. · 2017 [cited by applicant]
US 20170277459A1 · Rodriguez et al. · 2017 [cited by applicant]
US 20170345831A1 · Chavan et al. · 2017 [cited by applicant]
US 20180082981A1 · Gowda · 2018 [cited by applicant]
US 20180226418A1 · Morandi et al. · 2018 [cited by applicant]
US 20180286987A1 · Lee et al. · 2018 [cited by applicant]
US 20180323309A1 · Ando et al. · 2018 [cited by applicant]
US 20180331113A1 · Liao et al. · 2018 [cited by applicant]
US 20190051642A1 · Gupta Hyde et al. · 2019 [cited by applicant]
US 20190051815A1 · Kakinuma et al. · 2019 [cited by applicant]
US 20190115353A1 · O'Brien et al. · 2019 [cited by applicant]
US 20190138893A1 · Sharma et al. · 2019 [cited by applicant]
US 20200004583A1 · Kelly et al. · 2020 [cited by applicant]
US 20200051607A1 · Pan et al. · 2020 [cited by applicant]
US 20200273867A1 · Manipatruni et al. · 2020 [cited by applicant]
US 20200357453A1 · Slesazeck et al. · 2020 [cited by applicant]
US 20210090662A1 · Mennenga et al. · 2021 [cited by applicant]
US 20210111179A1 · Shivaraman et al. · 2021 [cited by applicant]
US 20210142837A1 · Yu et al. · 2021 [cited by applicant]
US 20210193209A1 · Swami et al. · 2021 [cited by applicant]
US 20210398580A1 · Yuh · 2021 [cited by applicant]
US 20220076748A1 · Vimercati · 2022 [cited by applicant]
EP 0798736A2 · 1997 [cited by applicant]
JP H0982907A · 1997 [cited by applicant]
JP H10242426A · 1998 [cited by applicant]
JP H10255484A · 1998 [cited by applicant]
JP H1174488A · 1999 [cited by applicant]
JP 2000174224A · 2000 [cited by applicant]
JP 2001237393A · 2001 [cited by applicant]
JP 2002026256A · 2002 [cited by applicant]
JP 2002158339A · 2002 [cited by applicant]
JP 2003123465A · 2003 [cited by applicant]
JP 2005057103A · 2005 [cited by applicant]
JP 2005142322A · 2005 [cited by applicant]
JP 2005322925A · 2005 [cited by applicant]
JP 2006164321A · 2006 [cited by applicant]
JP 3959341B2 · 2007 [cited by applicant]
JP 2008210955A · 2008 [cited by applicant]
JP 2010021544A · 2010 [cited by applicant]
JP 2011151370A · 2011 [cited by applicant]
JP 2017518632A · 2017 [cited by applicant]
KR 20050105695A · 2005 [cited by applicant]
KR 1020120124056 · 2012 [cited by applicant]
KR 102333566 · 2021 [cited by applicant]
TW 200718237A · 2007 [cited by applicant]
TW 200919705A · 2009 [cited by applicant]
TW 200935151A · 2009 [cited by applicant]
TW 201227879A · 2012 [cited by applicant]
TW 201725736A · 2017 [cited by applicant]
WO 20130147295 · 2013 [cited by applicant]
WO 2013147295A4 · 2014 [cited by applicant]
WO 2015167887A1 · 2015 [cited by applicant]
WO 2021112247A1 · 2021 [cited by applicant]
Oh, S. et al. “Noble FeRAM technologies with MTP cell structure and BLT ferroelectric capacitors”, IEEE International Electron Devices Meeting 2003, Washington, DC, USA, 2003, pp. 34.5.1-34.5.4. [cited by examiner]
Notice of Allowance notified Jan. 30, 2023 for U.S. Appl. No. 17/531,535. [cited by applicant]
Notice of Allowance notified Jul. 27, 2020 for U.S. Appl. No. 16/287,927. [cited by applicant]
Notice of Allowance notified Jun. 9, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Notice of Allowance notified Jun. 10, 2022 for U.S. Appl. No. 16/288,004. [cited by applicant]
Notice of Allowance notified Jun. 13, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Notice of Allowance notified Jun. 15, 2022 for U.S. Appl. No. 17/367,083. [cited by applicant]
Notice of Allowance notified Jun. 23, 2022 for U.S. Appl. No. 17/367,172. [cited by applicant]
Notice of Allowance notified Jun. 23, 2022 for U.S. Appl. No. 17/367,210. [cited by applicant]
Notice of Allowance notified Nov. 17, 2022 for U.S. Appl. No. 17/530,363. [cited by applicant]
Notice of Allowance notified Nov. 22, 2022 for U.S. Appl. No. 17/530,362. [cited by applicant]
Notice of Allowance notified Nov. 25, 2022 for U.S. Appl. No. 17/531,577. [cited by applicant]
Notice of Allowance notified Oct. 20, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Notice of Allowance notified Oct. 31, 2022 for U.S. Appl. No. 17/390,796. [cited by applicant]
Notice of Allowance notified Sep. 13, 2022 for U.S. Appl. No. 17/530,364. [cited by applicant]
Notice of Allowance notified Sep. 14, 2022 for U.S. Appl. No. 17/530,360. [cited by applicant]
Notice of Allowance notified Sep. 21, 2022 for U.S. Appl. No. 17/530,366. [cited by applicant]
Notice of Allowance notified Sep. 23, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Notice of Allowance notified Sep. 26, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
Notice of Allowance notified Sep. 27, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Notice of Grant notified May 18, 2021 for Taiwan Patent Application No. 109106095. [cited by applicant]
Notice of Preliminary Rejection notified Oct. 28, 2022 for Korean Patent Application No. 10-2021-7027303. [cited by applicant]
Notice of Reasons for Rejection notified Dec. 6, 2022 for Japanese Patent Application No. 2021-546823. [cited by applicant]
Notice of Reasons for Rejection notified Nov. 22, 2022 for Japanese Patent Application No. 2021-546864. [cited by applicant]
Ogiwara, R. et al., “A 0.5-/spl mu/m, 3-V 1T1C, 1-Mbit FRAM with a variable reference bit-line voltage scheme using a fatigue-free reference capacitor”, in IEEE Journal of Solid-State Circuits, vol. 35, No. 4, pp. 545-5… [cited by applicant]
Restriction Requirement notified Aug. 5, 2022 for U.S. Appl. No. 17/359,325. [cited by applicant]
Restriction Requirement notified Aug. 26, 2022 for U.S. Appl. No. 17/390,796. [cited by applicant]
Run-Lan et al., “Study on Ferroelectric Behaviors and Ferroelectric Nanodomains of YMno3 Thin Film”, Acta Phys. Sin. vol. 63, No. 18 (2014). Supported by the National Natural Science Foundation of China. DOI: 10.7498/ap… [cited by applicant]
Second Office Action notified Jul. 26, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Tanaka, S. et al., “FRAM cell design with high immunity to fatigue and imprint for 0.5 /spl mu/m 3 V 1T1C 1 Mbit FRAM”, in IEEE Transactions on Electron Devices, vol. 47, No. 4, pp. 781-788, Apr. 2000. [cited by applicant]
Yamaoka, K. et al., “A 0.9-V 1T1C SBT-based embedded nonvolatile FeRAM with a reference voltage scheme and multilayer shielded bit-line structure”, in IEEE Journal of Solid-State Circuits, vol. 40, No. 1, pp. 286-292, J… [cited by applicant]
1st Office Action notified Dec. 11, 2020 for Taiwan Patent Application No. 109106095. [cited by applicant]
1st Taiwan Office Action notified Mar. 3, 2022 for Taiwan Patent Application No. 110129115. [cited by applicant]
Advisory Action notified Jul. 25, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/287,953. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Advisory Action notified Nov. 16, 2021 for U.S. Appl. No. 16/288,006. [cited by applicant]
Chandler, T. “An adaptive reference generation scheme for 1T1C FeRAMs”, 2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.03CH37408), Kyoto, Japan, 2003, pp. 173-174. [cited by applicant]
Final Office Action notified Apr. 25, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Final Office Action notified Aug. 15, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Final Office Action notified Jun. 13, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Final Office Action notified May 11, 2022 for U.S. Appl. No. 16/288,004. [cited by applicant]
Final Office Action notified May 11, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/287,953. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Final Office Action notified Oct. 7, 2021 for U.S. Appl. No. 16/288,006. [cited by applicant]
Final Office Action notified Sep. 12, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
International Preliminary Report on Patentability notified Sep. 10, 2021 for PCT Patent Application No. PCT/US2020/018870. [cited by applicant]
International Preliminary Report on Patentability notified Sep. 10, 2021 for PCT Patent Application No. PCT/US2020/066963. [cited by applicant]
International Search Report & Written Opinion notified Jun. 19, 2020 for U.S. Patent Application No. PCT/US2020/018879. [cited by applicant]
International Search Report & Written Opinion notified Jun. 24, 2020 for PCT Patent Application No. PCT/US2020/018870. [cited by applicant]
International Search Report & Written Opinion notified May 24, 2024 for PCT Patent Application No. PCT/US2024/013401. [cited by applicant]
Jung, D. et al., “Highly manufacturable 1T1C 4 Mb FRAM with novel sensing scheme,” International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), Washington, DC, USA, 1999, pp. 279-282., Internationa… [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/287,953. [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/288,004. [cited by applicant]
Non-Final Office Action notified Aug. 5, 2020 for U.S. Appl. No. 16/288,006. [cited by applicant]
Non-Final Office Action notified Aug. 16, 2022 for U.S. Appl. No. 17/367,217. [cited by applicant]
Non-Final Office Action notified Dec. 20, 2021 for U.S. Appl. No. 16/288,004. [cited by applicant]
Non-Final Office Action notified Jan. 18, 2022 for U.S. Appl. No. 16/287,953. [cited by applicant]
Non-Final Office Action notified Jan. 19, 2022 for U.S. Appl. No. 16/288,006. [cited by applicant]
Non-Final Office Action notified Jun. 13, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Non-Final Office Action notified Jun. 15, 2022 for U.S. Appl. No. 17/367,101. [cited by applicant]
Non-Final Office Action notified Jun. 26, 2020 for U.S. Appl. No. 16/287,876. [cited by applicant]
Non-Final Office Action notified Mar. 7, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Non-Final Office Action notified Mar. 30, 2022 for U.S. Appl. No. 17/346,083. [cited by applicant]
Non-Final Office Action notified Mar. 31, 2022 for U.S. Appl. No. 17/346,087. [cited by applicant]
Non-Final Office Action notified Nov. 4, 2022 for U.S. Appl. No. 17/530,362. [cited by applicant]
Non-Final Office Action notified Nov. 21, 2022 for U.S. Appl. No. 7/532,657. [cited by applicant]
Non-Final Office Action notified Nov. 28, 2022 for U.S. Appl. No. 17/532,552. [cited by applicant]
Non-Final Office Action notified Oct. 12, 2022 for U.S. Appl. No. 17/530,363. [cited by applicant]
Non-Final Office Action notified Oct. 26, 2022 for U.S. Appl. No. 17/531,577. [cited by applicant]
Non-Final Office Action notified Sep. 1, 2022 for U.S. Appl. No. 17/339,850. [cited by applicant]
Non-Final Office Action notified Sep. 7, 2022 for U.S. Appl. No. 17/530,360. [cited by applicant]
Notice of Allowance notified Apr. 20, 2022 for U.S. Appl. No. 17/359,311. [cited by applicant]
Notice of Allowance notified Aug. 8, 2022 for U.S. Appl. No. 17/529,258. [cited by applicant]
Notice of Allowance notified Aug. 17, 2022 for U.S. Appl. No. 17/346,087. [cited by applicant]
Notice of Allowance notified Aug. 22, 2022 for U.S. Appl. No. 7/390,791. [cited by applicant]
Notice of Allowance notified Aug. 25, 2022 for U.S. Appl. No. 17/367,101. [cited by applicant]
Notice of Allowance notified Aug. 31, 2022 for U.S. Appl. No. 17/359,325. [cited by applicant]
Notice of Allowance notified Jan. 12, 2021 for U.S. Appl. No. 16/287,876. [cited by applicant]
Notice of Allowance notified Jan. 20, 2023 for U.S. Appl. No. 17/532,657. [cited by applicant]