Bonding apparatus, bonding method, and method of manufacturing semiconductor device
According to one embodiment, a bonding apparatus includes first and second stages, first and second measuring devices, a stress generator, and a controller. The controller generates a focus map for each deformation amount of the first stage based on a deformation amount of the first stage deformed by the stress generator and the shape of the first substrate held by the deformed first stage. In the alignment processing of the first substrate, when causing the first measuring device to measure an alignment mark arranged on the first substrate held by the first stage, the controller uses a focus setting based on the focus map corresponding to the deformation amount applied to the first stage.
1 . A bonding apparatus comprising:
a first stage configured to hold a first substrate;
a second stage configured to hold a second substrate, the second stage being arranged to face the first stage;
a first camera configured to measure an alignment mark arranged on the first substrate held by the first stage;
a second camera configured to measure an alignment mark arranged on the second substrate held by the second stage;
a stress generator configured to deform the first stage; and
a controller configured to execute bonding processing of bonding the first substrate and the second substrate,
wherein:
the bonding processing includes alignment processing of each of the first substrate and the second substrate,
the controller is configured to:
generate a focus map for imaging, based on a deformation amount of the first stage deformed by the stress generator and a shape of the first substrate held by the deformed first stage, and
control the first camera such that, in the alignment processing of the first substrate, the first camera measures the alignment mark arranged on the first substrate held by the first stage using a focus setting based on the focus map, and
the focus map includes a first best focus associated with a first deformation amount of the first stage, and a second best focus associated with a second deformation amount of the first stage different from the first deformation amount.
2 . The apparatus of claim 1 , wherein:
the alignment processing of the first substrate includes measurement of a first alignment mark, a second alignment mark, and a third alignment mark arranged on the first substrate,
the first alignment mark is arranged in a center portion of the first substrate,
the second alignment mark and the third alignment mark are arranged on one side and the other side of an outer periphery of the first substrate, respectively, and
the controller is configured to, in using the focus setting based on the focus map, measure the first alignment mark using a first position of a focus range, and measure each of the second alignment mark and the third alignment mark using a second position of the focus range lower than the first position of the focus range.
3 . The apparatus of claim 2 , wherein the controller is configured to generate the focus map by measuring the first to third alignment marks using a width of a focus range wider than the focus setting based on the focus map.
4 . The apparatus of claim 1 , wherein the controller is configured to generate the focus map based on a measurement result of the first best focus and the second best focus with respect to the first substrate held by the deformed first stage.
5 . The apparatus of claim 1 , wherein the controller is configured to (i) control the first camera such that, in the alignment processing of the first substrate, the first camera measures the alignment mark arranged on the first substrate held by the first stage, and (ii) correct an optical axis of the first camera based on an optical axis correction amount corresponding to the deformation amount applied to the first stage.
6 . The apparatus of claim 5 , wherein the controller is configured to (i) control the first camera such that, in the alignment processing of the first substrate, the first camera measures the alignment mark arranged on the first substrate, and (ii) correct a positional relationship between the first stage and the first camera based on the optical axis correction amount.
7 . The apparatus of claim 1 , wherein:
the first stage is a stage disposed on a lower side, and
the second stage is a stage disposed on an upper side.
8 . The apparatus of claim 1 , further comprising:
a pushpin provided in the second stage,
wherein the controller is configured to lower the pushpin to deform the second substrate and bring the second substrate into contact with the first substrate.
9 . The apparatus of claim 1 , wherein the first substrate is deformed by deformation of the first stage.
10 . A bonding method of bonding a first substrate held by a first stage and a second substrate held by a second stage, including alignment processing of each of the first substrate and the second substrate, the method comprising:
generating a focus map for imaging, based on a deformation amount of the first stage deformed by a stress generator and a shape of the first substrate held by the deformed first stage; and
measuring, in the alignment processing of the first substrate, an alignment mark arranged on the first substrate held by the first stage using a focus setting based on the focus map,
wherein the focus map includes a first best focus associated with a first deformation amount of the first stage, and a second best focus associated with a second deformation amount of the first stage different from the first deformation amount.
11 . The bonding method of claim 10 , wherein:
the first stage is a stage disposed on a lower side, and
the second stage is a stage disposed on an upper side.
12 . The bonding method of claim 10 , further comprising:
lowering a pushpin to deform the second substrate and bring the second substrate into contact with the first substrate.
13 . The bonding method of claim 10 , wherein the first substrate is deformed by deformation of the first stage.
14 . A method of manufacturing a semiconductor device configured by bonding a first substrate held by a first stage and a second substrate held by a second stage, including alignment processing of each of the first substrate and the second substrate, the method comprising:
generating a focus map for imaging, based on a deformation amount of the first stage deformed by a stress generator and a shape of the first substrate held by the deformed first stage; and
measuring, in the alignment processing of the first substrate, an alignment mark arranged on the first substrate held by the first stage using a focus setting based on the focus map,
wherein the focus map includes a first best focus associated with a first deformation amount of the first stage, and a second best focus associated with a second deformation amount of the first stage different from the first deformation amount.
15 . The method of claim 14 , wherein:
the first stage is a stage disposed on a lower side, and
the second stage is a stage disposed on an upper side.
16 . The method of claim 14 , further comprising:
lowering a pushpin to deform the second substrate and bring the second substrate into contact with the first substrate.
17 . The method of claim 14 , wherein the first substrate is deformed by deformation of the first stage.