Semiconductor package and method of fabricating the same
A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.
1 . A method comprising:
providing a first structure;
forming a connection pad on the first structure;
forming a preliminary connection member on the connection pad;
forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member;
removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member;
providing a second structure;
forming a chip pad and a dummy pad on the second structure; and
covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure,
wherein a thickness of the dummy pad is greater than a thickness of the chip pad.
2 . The method of claim 1 , wherein the covering includes:
contacting the adhesion layer to the dummy pad; and
contacting the exposure surface of the preliminary connection member with the chip pad to form a connection member.
3 . The method of claim 2 , wherein contacting the adhesion layer to the dummy pad includes thermally compressing the adhesion layer against the dummy pad.
4 . The method of claim 2 , wherein contacting the adhesion layer to the dummy pad includes contacting the adhesion layer to the dummy pad while the preliminary connection member is maintained separated from the chip pad.
5 . The method of claim 1 , wherein:
the dummy pad comprises a plurality of dummy pads, and
each of the plurality of dummy pads has a same thickness.
6 . The method of claim 1 , wherein the first structure includes a through structure that penetrates the first structure,
wherein the through structure, the connection pad, and the preliminary connection member are electrically connected to each other.
7 . The method of claim 1 , wherein the thickness of the dummy pad is equal to or less than twice the thickness of the chip pad.
8 . The method of claim 1 , wherein:
the dummy pad includes a first dummy pad and a second dummy pad,
the connection pad includes a first connection pad and a second connection pad, and
the first connection pad is between the first dummy pad and the second dummy pad.
9 . The method of claim 1 , wherein covering the chip pad and the dummy pad with the adhesion layer includes thermally compressing and bonding the adhesion layer and the dummy pad,
wherein the adhesion layer and the dummy pad are thermally compressed at a temperature greater than a melting point of the adhesion layer and less than a melting point of the preliminary connection member.
10 . The method of claim 9 , wherein the temperature at which the adhesion layer and the dummy pad are thermally compressed is about 80° C. to about 150° C.
11 . A method comprising:
providing a first structure on which is disposed a connection pad and a preliminary connection member is disposed on the connection pad;
forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member;
removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member;
providing a second structure;
forming a chip pad and a dummy pad on the second structure;
thermally compressing the adhesion layer and the dummy pad against each other; and
thermally compressing the exposure surface of the preliminary connection member and the chip pad against each other,
wherein the exposure surface and the chip pad are separated from each other while the adhesion layer and the dummy pad are thermally compressed against each other, and
wherein a thickness of the dummy pad is greater than a thickness of the chip pad.