IP Library Granted Patent US 12,667,909
Granted Patent B2
US 12,667,909 · App. 18/177,557 · Granted Jun 30, 2026

Laser processing device and evaluation method

Inventors: Ryuta Matsuo (Nagakute, JP); Takashi Motoyoshi (Toyota, JP)
Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
B23K26/032B23K26/70
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Quick Facts
Patent No.
US 12,667,909
App. No.
18/177,557
Filed
Mar 2, 2023
Granted
Jun 30, 2026
Kind
B2
Examiner
CHOU, JIMMY
Art Unit
3761
USPC
219/121.85
Abstract

A laser processing device includes: an oscillator that oscillates laser light; a mirror in which second laser light that is another part of laser light is reflected while first laser light that is a part of laser light is transmitted through the mirror to irradiate a processing target portion with second laser light, and first reflected light that is a part of reflected light in which second laser light is reflected by the processing target portion is transmitted through the mirror; an absorption unit that receives and absorbs the first laser light until an amount of the first laser light becomes equal to or less than a predetermined light amount; a sensor unit that measures intensity of the first reflected light; and a quality evaluation unit that outputs an evaluation result representing the quality of the laser processing at the processing target portion based on a measurement result.

Claims (19)

1 . A laser processing device including a function of evaluating quality of laser processing, the laser processing device comprising:

an oscillator that oscillates laser light;

a mirror disposed in an optical path of the laser light, in which

second laser light that is another part of the laser light is reflected by the mirror while first laser light that is a part of the laser light emitted from the oscillator is transmitted through the mirror to irradiate a processing target portion with the second laser light, and

first reflected light that is a part of reflected light in which the second laser light with which the processing target portion is irradiated is reflected by the processing target portion is transmitted through the mirror;

a damping structure that receives the first laser light and absorbs the first laser light until an amount of the first laser light becomes equal to or less than a predetermined light amount, wherein the damping structure includes a tubular member on which the first laser light is incident and that includes an inner surface to which black anodized treatment is applied, the tubular member including one end that is closed;

a sensor that measures intensity of the first reflected light transmitted through the mirror; and

a processor that outputs an evaluation result representing the quality of the laser processing at the processing target portion based on a measurement result of the intensity of the first reflected light measured by the sensor.

2 . An evaluation method for evaluating quality of laser processing of a laser processing device, the laser processing device comprising:

an oscillator that oscillates laser light;

a mirror disposed in an optical path of the laser light, in which

second laser light that is another part of the laser light is reflected by the mirror while first laser light that is a part of the laser light emitted from the oscillator is transmitted through the mirror to irradiate a processing target portion with the second laser light, and

first reflected light that is a part of reflected light in which the second laser light with which the processing target portion is irradiated is reflected by the processing target portion is transmitted through the mirror;

a damping structure that receives the first laser light and absorbs the first laser light until an amount of the first laser light becomes equal to or less than a predetermined light amount, wherein the damping structure includes a tubular member on which the first laser light is incident and that includes an inner surface to which black anodized treatment is applied, the tubular member including one end that is closed;

a sensor that measures intensity of the first reflected light transmitted through the mirror, and

a processor that outputs an evaluation result representing the quality of the laser processing at the processing target portion based on a measurement result of the intensity of the first reflected light measured by the sensor, wherein the evaluation method causes the processor to execute

a step of receiving the measurement result of the intensity of the first reflected light measured by the sensor,

a step of evaluating the quality of the laser processing at the processing target portion based on the measurement result, and

a step of outputting the evaluation result representing the quality.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2023
From: MATSUO, RYUTA; MOTOYOSHI, TAKASHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 062861/0755 →
Priority Claims (1)
JP 2022-080083 · May 16, 2022 · national
Continuity (1)
Related Publication 20230364704A1 · Nov 16, 2023
References Cited (119)
US 3778585A · Mallozzi · 1973 [cited by examiner]
US 4498917A · Weinstein · 1985 [cited by examiner]
US 5337148A · Torii · 1994 [cited by examiner]
US 5473136A · Engelhardt · 1995 [cited by examiner]
US 5668628A · Terawaki · 1997 [cited by examiner]
US 5869805A · Beyer · 1999 [cited by examiner]
US 6023044A · Kosaka · 2000 [cited by examiner]
US 6660964B1 · Benderly · 2003 [cited by examiner]
US 6670574B1 · Bates · 2003 [cited by examiner]
US 6700658B2 · Leonard · 2004 [cited by examiner]
US 6791057B1 · Kratzsch · 2004 [cited by examiner]
US 7577285B2 · Schwarz · 2009 [cited by examiner]
US 7989730B2 · Regaard · 2011 [cited by examiner]
US 8822875B2 · Webster · 2014 [cited by examiner]
US 8853590B2 · Kim · 2014 [cited by examiner]
US 9517533B2 · Uchida · 2016 [cited by examiner]
US 10222337B1 · Yoo · 2019 [cited by examiner]
US 10695863B1 · Dietz · 2020 [cited by examiner]
US 11511370B2 · Sakurai · 2022 [cited by examiner]
US 11964339B2 · Sakai · 2024 [cited by examiner]
US 12053840B2 · Regaard · 2024 [cited by examiner]
US 12403548B2 · Yokoyama · 2025 [cited by examiner]
US 20020144984A1 · Mori · 2002 [cited by examiner]
US 20020158053A1 · Kessler · 2002 [cited by examiner]
US 20050091859A1 · Pu · 2005 [cited by examiner]
US 20060011592A1 · Wang · 2006 [cited by examiner]
US 20070084837A1 · Kosmowski · 2007 [cited by examiner]
US 20090001063A1 · Weick · 2009 [cited by examiner]
US 20100133243A1 · Nomaru · 2010 [cited by examiner]
US 20110284508A1 · Miura · 2011 [cited by examiner]
US 20120103954A1 · Yilbas · 2012 [cited by examiner]
US 20120138586A1 · Webster · 2012 [cited by examiner]
US 20120285936A1 · Urashima · 2012 [cited by examiner]
US 20120318775A1 · Schwarz · 2012 [cited by examiner]
US 20130001208A1 · Jurca · 2013 [cited by examiner]
US 20130043225A1 · Schurmann · 2013 [cited by examiner]
US 20130062324A1 · Dorsch · 2013 [cited by examiner]
US 20130068738A1 · Schurmann · 2013 [cited by examiner]
US 20130120740A1 · Schonleber · 2013 [cited by examiner]
US 20130175243A1 · Wang · 2013 [cited by examiner]
US 20130319980A1 · Hesse · 2013 [cited by examiner]
US 20140116997A1 · Inoue · 2014 [cited by examiner]
US 20140138363A1 · Hammann · 2014 [cited by examiner]
US 20140144895A1 · Stork Genannt Wersborg · 2014 [cited by examiner]
US 20140293388A1 · Matsumoto · 2014 [cited by examiner]
US 20140307299A1 · Matsumoto · 2014 [cited by examiner]
US 20150014286A1 · Staupendahl · 2015 [cited by examiner]
US 20150014889A1 · Goya · 2015 [cited by examiner]
US 20150224600A1 · Spiess · 2015 [cited by examiner]
US 20150246413A1 · Kawakita · 2015 [cited by examiner]
US 20150266132A1 · Kawakita · 2015 [cited by examiner]
US 20160039045A1 · Webster · 2016 [cited by examiner]
US 20160052091A1 · Uchida · 2016 [cited by examiner]
US 20160059347A1 · Kogel-Hollacher · 2016 [cited by examiner]
US 20160059350A1 · Schoenleber · 2016 [cited by examiner]
US 20160067832A1 · Kobayashi · 2016 [cited by examiner]
US 20160114434A1 · Regaard · 2016 [cited by examiner]
US 20160138127A1 · Nomura · 2016 [cited by examiner]
US 20160193692A1 · Regaard · 2016 [cited by examiner]
US 20160202045A1 · Schönleber · 2016 [cited by examiner]
US 20160354867A1 · Matsuoka · 2016 [cited by examiner]
US 20160356595A1 · Lessmueller · 2016 [cited by examiner]
US 20170043431A1 · Kuba · 2017 [cited by examiner]
US 20170095885A1 · Zhang · 2017 [cited by examiner]
US 20170109874A1 · Hallasch · 2017 [cited by examiner]
US 20170120337A1 · Kanko · 2017 [cited by examiner]
US 20170259373A1 · Albert · 2017 [cited by examiner]
US 20170282293A1 · Miyata · 2017 [cited by examiner]
US 20170326669A1 · Moser · 2017 [cited by examiner]
US 20170334019A1 · Izumi · 2017 [cited by examiner]
US 20180076060A1 · Oh · 2018 [cited by examiner]
US 20180221989A1 · Matsuoka · 2018 [cited by examiner]
US 20180221990A1 · Aoki · 2018 [cited by examiner]
US 20180264600A1 · Sugino · 2018 [cited by examiner]
US 20180372483A1 · Moser · 2018 [cited by examiner]
US 20190015931A1 · Kogel-Hollacher · 2019 [cited by examiner]
US 20190041196A1 · Strebel · 2019 [cited by examiner]
US 20190061062A1 · Kubo · 2019 [cited by examiner]
US 20190091798A1 · Schönleber · 2019 [cited by examiner]
US 20190143458A1 · Strebel · 2019 [cited by examiner]
US 20190240785A1 · Magg · 2019 [cited by examiner]
US 20190299331A1 · Moser · 2019 [cited by examiner]
US 20190375051A1 · Regaard · 2019 [cited by examiner]
US 20200041249A1 · Strebel · 2020 [cited by examiner]
US 20200055141A1 · Schürmann · 2020 [cited by examiner]
US 20200055142A1 · Schürmann · 2020 [cited by examiner]
US 20200198049A1 · Yokoyama · 2020 [cited by examiner]
US 20200198051A1 · Sauer · 2020 [cited by examiner]
US 20200209523A1 · Nehashi · 2020 [cited by examiner]
US 20200262004A1 · Moser · 2020 [cited by examiner]
US 20200361038A1 · Takechi · 2020 [cited by examiner]
US 20200376591A1 · Sakai · 2020 [cited by examiner]
US 20200376592A1 · Sakai · 2020 [cited by examiner]
US 20200406392A1 · Fukushima · 2020 [cited by examiner]
US 20210010803A1 · Okuma · 2021 [cited by examiner]
US 20210023656A1 · Sakai · 2021 [cited by examiner]
US 20210031298A1 · Sakai · 2021 [cited by examiner]
US 20210053149A1 · Takechi · 2021 [cited by examiner]
US 20210060695A1 · Yokoyama · 2021 [cited by examiner]
US 20210107096A1 · Funami · 2021 [cited by examiner]
US 20210323088A1 · Yokoyama · 2021 [cited by examiner]
US 20210370438A1 · Fujiwara · 2021 [cited by examiner]
US 20210402521A1 · Lin · 2021 [cited by examiner]
US 20220143745A1 · Funami · 2022 [cited by examiner]
US 20220161356A1 · Fujiwara · 2022 [cited by examiner]
US 20220290973A1 · Stambke · 2022 [cited by examiner]
US 20220324054A1 · Walde · 2022 [cited by examiner]
US 20220388098A1 · Funami · 2022 [cited by examiner]
US 20230120761A1 · Krause · 2023 [cited by examiner]
CN 112643191A · 2021 [cited by examiner]
JP S58021101U · 1983 [cited by applicant]
JP H05050757U · 1993 [cited by applicant]
JP 2694929B2 · 1997 [cited by examiner]
JP H11129082A · 1999 [cited by applicant]
JP 2003245789A · 2003 [cited by applicant]
JP 2006247681A · 2006 [cited by examiner]
JP 2012035307A · 2012 [cited by applicant]
JP 2021058927A · 2021 [cited by applicant]
Translation of Aug. 8, 2024 Office Action issued in Japanese Patent Application No. 2022-080083. [cited by applicant]