IP Library › Granted Patent US 12,718,878
Granted Patent B2
US 12,718,878 · App. 18/355,111 · Granted Aug 25, 2026

NAND die with wire-bond inductive compensation for altered bond wire bandwidth in memory devices

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Quick Facts
Patent No.
US 12,718,878
App. No.
18/355,111
Filed
Jul 19, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2817
USPC
257/748
Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065657/0158 →
PATENT COLLATERAL AGREEMENT- A&R Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065656/0649 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2023
From: CONTRERAS, JOHN; VODRAHALLI, NAGESH; MOBIN, MD. SAYED
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 064332/0162 →
Continuity (2)
Provisional Application 63419414 · Oct 26, 2022
Related Publication 20240145424A1 · May 2, 2024
References Cited (8)
US 11362063B2 · Xing et al. · 2022 [cited by applicant]
US 20150333805A1 · Brauchler et al. · 2015 [cited by applicant]
US 20180096777A1 · Akcasu · 2018 [cited by applicant]
US 20180190621A1 · Yan et al. · 2018 [cited by applicant]
US 20190206450A1 · Contreras et al. · 2019 [cited by applicant]
US 20200381399A1 · Choi · 2020 [cited by examiner]
US 20240079318A1 · Mobin et al. · 2024 [cited by applicant]
KR 20150059068A · 2015 [cited by applicant]