Backside conducting lines in integrated circuits
A method includes fabricating active-region structures extending in a first direction on a substrate, and fabricating a plurality of gate-conductors extending in a second direction above the substrate. The method also includes fabricating a backside horizontal conducting line in a backside first conducting layer below the substrate and having the backside horizontal conducting line extending in the first direction across a vertical boundary of a circuit cell. The method further includes fabricating a pin-connector that is connected to the backside horizontal conducting line, and fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer. The pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line.
1 . A method comprising:
fabricating a first-type active-region structure and a second-type active-region structure extending in a first direction on a substrate;
fabricating a plurality of gate-conductors extending in a second direction perpendicular to the first direction, wherein each gate-conductor intersects the first-type active-region structure and/or the second-type active-region structure above the substrate, and wherein two adjacent gate-conductors are separated by a pitch distance equal to a contacted poly pitch (CPP);
fabricating a backside horizontal conducting line extending in the first direction in a backside first conducting layer below the substrate;
fabricating a pin-connector that is connected to the backside horizontal conducting line;
fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer, wherein the backside vertical conducting line is aligned with a first vertical boundary of a circuit cell, and wherein the pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line at an overlap region between the backside horizontal conducting line and the backside vertical conducting line; and
wherein fabricating the backside horizontal conducting line comprises fabricating the backside horizontal conducting line as an extended conducting line that extends across the first vertical boundary of the circuit cell by a distance that is less than one CPP.
2 . The method of claim 1 , further comprising:
fabricating the backside vertical conducting line to form a first portion covering the overlap region and to form a second portion outside the overlap region, and wherein a first width of the first portion along the first direction is larger than a second width of the second portion along the first direction.
3 . The method of claim 1 , further comprising:
fabricating a front-side first-layer conducting line in a first connection layer above the substrate and above the plurality of gate-conductors.
4 . The method of claim 1 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the first vertical boundary of the circuit cell by a distance that is less than one CPP but more than one eighth of the CPP.
5 . The method of claim 1 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the first vertical boundary of the circuit cell by a distance that is less than one CPP but more than one fourth of the CPP.
6 . The method of claim 1 , wherein fabricating the backside vertical conducting line comprises:
fabricating the backside vertical conducting line as a conducting line having a uniform width that is larger than one half of the CPP.
7 . A method comprising:
fabricating a first-type active-region structure and a second-type active-region structure extending in a first direction on a substrate;
fabricating a first boundary isolation region in the first-type active-region structure and a second boundary isolation region in the second-type active-region structure, wherein a vertical boundary extending in a second direction passes through the first boundary isolation region and the second boundary isolation region, and wherein the second direction is perpendicular to the first direction;
fabricating a backside horizontal conducting line extending in the first direction in a backside first conducting layer below the substrate, wherein the backside horizontal conducting line extends across the vertical boundary;
fabricating a pin-connector that is connected to the backside horizontal conducting line; and
fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer, wherein the backside vertical conducting line is adjacent to the vertical boundary, and wherein the pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line at an overlap region between the backside horizontal conducting line and the backside vertical conducting line.
8 . The method of claim 7 , further comprising:
fabricating the backside vertical conducting line to form a first portion covering the overlap region and to form a second portion outside the overlap region, and wherein a first width of the first portion along the first direction is larger than a second width of the second portion along the first direction.
9 . The method of claim 7 , comprising:
fabricating a plurality of gate-conductors extending in the second direction above the substrate, and wherein two adjacent gate-conductors are separated by a pitch distance equal to a contacted poly pitch (CPP).
10 . The method of claim 9 , further comprising:
fabricating a front-side first-layer conducting line in a first connection layer above the substrate and above the plurality of gate-conductors.
11 . The method of claim 9 , wherein the backside horizontal conducting line extends across the vertical boundary by a distance that is less than one CPP.
12 . The method of claim 9 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the vertical boundary by a distance that is less than one CPP but more than one eighth of the CPP.
13 . The method of claim 9 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the vertical boundary by a distance that is less than one CPP but more than one fourth of the CPP.
14 . The method of claim 9 , wherein fabricating the backside vertical conducting line comprises:
fabricating the backside vertical conducting line as a conducting line having a uniform width that is larger than one half of the CPP.
15 . A method comprising:
fabricating a first-type active-region structure and a second-type active-region structure extending in a first direction on a substrate;
fabricating a first boundary isolation region in the first-type active-region structure and a second boundary isolation region in the second-type active-region structure, wherein a vertical boundary extending in a second direction passes through the first boundary isolation region and the second boundary isolation region, and wherein the second direction is perpendicular to the first direction;
fabricating a backside horizontal conducting line extending in the first direction in a backside first conducting layer below the substrate;
fabricating a pin-connector that is connected to the backside horizontal conducting line; and
fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer, wherein the backside vertical conducting line is adjacent to the vertical boundary and includes a first portion and a second portion, and wherein a first width of the first portion along the first direction is larger than a second width of the second portion along the first direction, and wherein the pin-connector is directly connected between the backside horizontal conducting line and the first portion of the backside vertical conducting line.
16 . The method of claim 15 , comprising:
fabricating a plurality of gate-conductors extending in the second direction above the substrate, and wherein two adjacent gate-conductors are separated by a pitch distance equal to a contacted poly pitch (CPP).
17 . The method of claim 16 , further comprising:
fabricating a front-side first-layer conducting line in a first connection layer above the substrate and above the plurality of gate-conductors.
18 . The method of claim 16 , wherein the backside horizontal conducting line extends across the vertical boundary by a distance that is less than one CPP.
19 . The method of claim 16 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the vertical boundary by a distance that is less than one CPP but more than one eighth of the CPP.
20 . The method of claim 16 , wherein fabricating the backside horizontal conducting line comprises:
fabricating the backside horizontal conducting line as an extended conducting line that extends across the vertical boundary by a distance that is less than one CPP but more than one fourth of the CPP.