Method of manufacturing thermoelectric devices with insulators
The disclosure is related to structures and methods of making thermoelectric devices. The methods may include preparing an electrically and thermally nonconductive substrate covered with gold-nickel-gold layers. In another step, cylindrical or frustum-shaped tunnels may be formed through the substrate and the gold-nickel-gold layers. Another step may include depositing a barrier layer on the walls of the tunnels that resists diffusion. N-type and p-type thermoelectric materials may be individually associated with and deposited on the barrier layers of the tunnels, and a metal layer may be deposited on the thermoelectric materials. The thermoelectric layers may be formed by combining alternating layers of thermoelectric materials and interlayers of phonon blocking materials. The method may include forming notches in the gold-nickel-gold layers to break electrical continuity. The method may also include a step of partially or fully capping the tunnels with sintered nano-silver or solder.
1 . A method for manufacturing a thermoelement, the method comprising the steps of:
preparing a first surface and a second surface of a thermally and electrically nonconductive substrate;
adding a first gold layer proximate to the second surface of the thermally and electrically nonconductive substrate;
adding a nickel layer to the first gold layer opposite the second surface of the thermally and electrically nonconductive substrate;
adding a second gold layer to the nickel layer opposite the first gold layer;
forming a tunnel by removing a portion of the thermally and electrically nonconductive substrate from the second surface down to the first gold layer;
depositing a barrier layer in the tunnel adjacent to the first gold layer;
depositing a thermoelectric layer proximate to the barrier layer and conforming to a shape of the tunnel and the barrier layer;
depositing a metal layer adjacent to the thermoelectric layer and conforming to a shape of the thermoelectric layer; and
depositing a cap layer on the metal layer.
2 . The method of claim 1 , further comprising the step of:
removing gold spatter from walls of the tunnel.
3 . The method of claim 1 , further comprising the step of:
adding an adhesion layer between the thermally and electrically nonconductive substrate and the first gold layer.
4 . The method of claim 1 , further comprising the step of:
adding an energy filter layer between the barrier layer and the thermoelectric layer.
5 . The method of claim 1 , wherein the thermoelectric layer comprises:
composite thermoelectric layers comprising one of:
n-type thermoelectric material; and
p-type thermoelectric material; and
interlayers comprising a phonon blocking material; and
the step of depositing the thermoelectric layer comprises:
alternating depositing the interlayers and the composite thermoelectric layers proximate to the barrier layer.
6 . The method of claim 1 , wherein the metal layer is made up of a plurality of sublayers; and the step of depositing the metal layer comprises depositing each of the plurality of sublayers.
7 . A method for manufacturing a thermoelement, the method comprising the steps of:
preparing a first surface and a second surface of a thermally and electrically nonconductive substrate;
forming a thermoelectric device base by:
adding a first surface first gold layer proximate to the second surface of the thermally and electrically nonconductive substrate;
adding a first surface nickel layer to the first surface first gold layer opposite the second surface of the thermally and electrically nonconductive substrate;
adding a first surface second gold layer to the first surface nickel layer opposite the first surface first gold layer;
adding a second surface first gold layer proximate to the first surface of the thermally and electrically nonconductive substrate;
adding a second surface nickel layer to the second surface first gold layer opposite the first surface of the thermally and electrically nonconductive substrate; and
adding a second surface second gold layer to the second surface nickel layer opposite the second surface first gold layer;
forming a first tunnel in the thermoelectric device base by removing a portion of the second surface second gold layer, a portion of the second surface nickel layer, a portion of the second surface first gold layer, and a portion of the thermally and electrically nonconductive substrate from the second surface to the first surface first gold layer;
depositing a first barrier layer in the first tunnel proximate to the first surface first gold layer;
depositing a first thermoelectric layer on the thermally and electrically nonconductive substrate within the first tunnel, adjacent to the first barrier layer, and on the first surface second gold layer;
forming a second tunnel in the thermoelectric device base by removing a portion of the first surface second gold layer, a portion of the first surface nickel layer, a portion of the first surface first gold layer, and a portion of the thermally and electrically nonconductive substrate from the first surface to the second surface first gold layer, where the second tunnel does not overlap with the first tunnel;
depositing a second barrier layer in the second tunnel proximate to the second surface first gold layer; and
depositing a second thermoelectric layer on the thermally and electrically nonconductive substrate within the second tunnel, adjacent to the second barrier layer, and on the second surface second gold layer.
8 . The method of claim 7 , further comprising the steps of:
forming a first notch breaking electrical continuity in the second surface first gold layer, the second surface nickel layer, and the second surface second gold layer; and
forming a second notch breaking electrical continuity in the first surface first gold layer, the first surface nickel layer, and the first surface second gold layer, wherein the first notch and the second notch are longitudinally separated by the first tunnel.
9 . The method of claim 7 , further comprising the steps of:
depositing a first metal layer on the first thermoelectric layer; and
depositing a second metal layer on the second thermoelectric layer.
10 . The method of claim 9 , further comprising the steps of:
depositing a first cap layer on the first metal layer; and
depositing a second cap layer on the second metal layer.
11 . The method of claim 9 , wherein at least one of the first metal layer and the second metal layer is made up of a plurality of sublayers; and at least one of the steps of depositing the first metal layer and depositing the second metal layer comprises depositing each of the plurality of sublayers.
12 . The method of claim 7 , further comprising the steps of:
depositing a first cap layer in the first tunnel on the first thermoelectric layer; and
depositing a second cap layer in the second tunnel on the second thermoelectric layer.
13 . The method of claim 7 , further comprising the step of:
removing gold spatter on the thermally and electrically nonconductive substrate in at least one of the first tunnel and the second tunnel.
14 . The method of claim 7 , further comprising the step of:
adding an adhesion layer between at least one of:
the thermally and electrically nonconductive substrate and the first surface first gold layer; and
the thermally and electrically nonconductive substrate and the second surface first gold layer.
15 . The method of claim 7 , further comprising the step of:
adding an energy filter layer between at least one of:
the first barrier layer and the first thermoelectric layer; and
the second barrier layer and the second thermoelectric layer.
16 . The method of claim 7 , wherein at least one of the first thermoelectric layer and the second thermoelectric layer comprises:
composite thermoelectric layers; and
interlayers comprising a phonon blocking material; and
the step of depositing the first thermoelectric layer comprises:
alternating depositing the interlayers and the composite thermoelectric layers proximate to the first barrier layer.
17 . A method for manufacturing a thermoelement, the method comprising the steps of:
preparing a first surface and a second surface of a thermally and electrically nonconductive substrate;
forming a thermoelectric device base by:
adding a first surface first gold layer proximate to the second surface of the thermally and electrically nonconductive substrate;
adding a first surface nickel layer to the first surface first gold layer opposite the second surface of the thermally and electrically nonconductive substrate;
adding a first surface second gold layer to the first surface nickel layer opposite the first surface first gold layer;
adding a second surface first gold layer proximate to the first surface of the thermally and electrically nonconductive substrate;
adding a second surface nickel layer to the second surface first gold layer opposite the first surface of the thermally and electrically nonconductive substrate; and
adding a second surface second gold layer to the second surface nickel layer opposite the second surface first gold layer;
forming a first tunnel in the thermoelectric device base by removing a portion of the second surface second gold layer, a portion of the second surface nickel layer, a portion of the second surface first gold layer, and a portion of the thermally and electrically nonconductive substrate from the second surface to the first surface first gold layer;
depositing a first thermoelectric layer on the thermally and electrically nonconductive substrate within the first tunnel, adjacent to the first surface first gold layer, and on the second surface second gold layer;
depositing a first metal layer on the first thermoelectric layer;
depositing a first cap layer on the first metal layer;
forming a second tunnel in the thermoelectric device base by removing a portion of the first surface second gold layer, a portion of the first surface nickel layer, a portion of the first surface first gold layer, and a portion of the thermally and electrically nonconductive substrate from the first surface to the second surface first gold layer, where the second tunnel does not overlap with the first tunnel;
depositing a second thermoelectric layer on the thermally and electrically nonconductive substrate within the second tunnel, adjacent to the second surface first gold layer, and on the first surface second gold layer;
depositing a second metal layer on the second thermoelectric layer; and
depositing a second cap layer on the second metal layer.
18 . The method of claim 17 , further comprising the steps of:
forming a first notch breaking electrical continuity in the second surface first gold layer, the second surface nickel layer, and the second surface second gold layer; and
forming a second notch breaking electrical continuity in the first surface first gold layer, the first surface nickel layer, and the first surface second gold layer, wherein the first notch and the second notch are longitudinally separated by the first tunnel.
19 . The method of claim 17 , further comprising the step of:
removing gold spatter on the thermally and electrically nonconductive substrate in at least one of the first tunnel and the second tunnel.
20 . The method of claim 17 , further comprising the step of:
adding an adhesion layer between at least one of:
the thermally and electrically nonconductive substrate and the first surface first gold layer; and
the thermally and electrically nonconductive substrate and the second surface first gold layer.
21 . The method of claim 17 , wherein at least one of the first thermoelectric layer and the second thermoelectric layer comprises:
composite thermoelectric layers; and
interlayers comprising a phonon blocking material; and
the step of depositing the first thermoelectric layer comprises:
alternating depositing the interlayers and the composite thermoelectric layers proximate to the first surface first gold layer.