Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
A semiconductor device is made by forming a heat spreader over a carrier. A semiconductor die is mounted over the heat spreader with a first surface oriented toward the heat spreader. A first insulating layer is formed over the semiconductor die and heat spreader. A via is formed in the first insulating layer. A first conductive layer is formed over the first insulating layer and connected to the heat spreader through the via and to contact pads on the semiconductor die. The heat spreader extends from the first surface of the semiconductor die to the via. A second insulating layer is formed over the first conductive layer. A second conductive layer is electrically connected to the first conductive layer. The carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first conductive layer.
1. A method of making a semiconductor device, comprising:
providing a heat spreader;
disposing a thermal interface material (TIM) over the heat spreader;
disposing a semiconductor die over the TIM;
forming a first insulating layer over the semiconductor die and heat spreader;
planarizing the first insulating layer to expose a contact pad on the semiconductor die;
forming a via in the first insulating layer after planarizing the first insulating layer; and
forming a first conductive layer over the first insulating layer and extending into the via to directly contact the heat spreader and contact pad on the semiconductor die.
2. The method of claim 1 , further including:
forming a second insulating layer over the first conductive layer; and
forming a second conductive layer over the second insulating layer.
3. The method of claim 2 , further including forming a solder masking layer over the second insulating layer.
4. The method of claim 1 , further including forming an interconnect structure over the first conductive layer.
5. The method of claim 1 , wherein the heat spreader provides shielding with respect to inter-device interference.
6. The method of claim 1 , wherein the first insulating layer includes a polymer material.
7. A method of making a semiconductor device, comprising:
providing a heat spreader;
disposing an adhesive layer over the heat spreader;
disposing a first surface of a semiconductor die over the adhesive layer;
forming a first insulating layer over the heat spreader and a second surface of the semiconductor die opposite the first surface;
forming a via through a surface of the first insulating layer; and
forming a first conductive layer over the surface of the first insulating layer and extending from a contact pad of the semiconductor die through the via to the heat spreader.
8. The method of claim 7 , further including:
forming a second insulating layer over the first conductive layer; and
forming a second conductive layer over the second insulating layer.
9. The method of claim 7 , further including:
forming a solder masking layer over the first conductive layer; and
forming bumps over the first conductive layer.
10. The method of claim 7 , further including:
providing a carrier; and
disposing the heat spreader over the carrier prior to disposing the semiconductor die over the heat spreader.
11. The method of claim 7 , further including removing a portion of the first insulating layer from over the second surface of the semiconductor die prior to forming the first conductive layer.
12. The method of claim 7 , wherein the heat spreader provides shielding with respect to inter-device interference.
13. A semiconductor device, comprising:
a plurality of heat spreaders;
a plurality of semiconductor die disposed over the heat spreaders;
an insulating layer formed over the heat spreaders and semiconductor die and including a surface coplanar with a contact pad of the semiconductor die; and
a conductive layer formed on the surface of the insulating layer and extending from the heat spreaders to the contact pad of the semiconductor die.
14. The semiconductor device of claim 13 , wherein the heat spreaders provide shielding with respect to inter-device interference.
15. The semiconductor device of claim 13 , wherein the insulating layer includes a polymer material.
16. The semiconductor device of claim 13 , further including a carrier disposed over the heat spreaders opposite the semiconductor die.
17. A semiconductor device, comprising:
a heat spreader extending completely across the semiconductor device;
a semiconductor die disposed over the heat spreader;
a first insulating layer formed over the heat spreader and semiconductor die; and
a first conductive layer formed over the first insulating layer and extending continuously from a contact pad of the semiconductor die to the heat spreader.
18. The semiconductor device of claim 17 , further including:
a second insulating layer formed over the first conductive layer; and
a second conductive layer formed over the second insulating layer.
19. The semiconductor device of claim 17 , further including a solder masking layer formed over the first conductive layer.
20. The semiconductor device of claim 17 , further including an interconnect structure formed over the first conductive layer.
21. The semiconductor device of claim 17 , further including a carrier disposed over the heat spreader opposite the semiconductor die.
22. The semiconductor device of claim 17 , wherein the heat spreader provides shielding with respect to inter-device interference.
23. The semiconductor device of claim 17 , wherein the first insulating layer includes a polymer material.
24. A method of making a semiconductor device, comprising:
providing a heat spreader;
disposing a semiconductor die over the heat spreader;
forming an insulating layer over the heat spreader;
forming a via through a surface of the insulating layer; and
forming a conductive layer over the surface of the insulating layer and extending from a contact pad of the semiconductor die through the via to the heat spreader.
25. The method of claim 24 , further including removing a portion of the insulating layer from over the contact pad of the semiconductor die.
26. The method of claim 24 , wherein the surface of the insulating layer is co-planar with the contact pad of the semiconductor die.
27. The method of claim 24 , wherein the insulating layer is formed using printing, spin coating, or spray coating.
28. The method of claim 24 , wherein the heat spreader extends continuously across the semiconductor device.