IP Library › Granted Patent US 12,720,746
Granted Patent B2
US 12,720,746 · App. 18/343,162 · Granted Aug 25, 2026

Three-dimensional memory device including backside semiconductor source structure and methods for forming the same

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Quick Facts
Patent No.
US 12,720,746
App. No.
18/343,162
Granted
Aug 25, 2026
Kind
B2
Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2023
From: RAJASHEKHAR, ADARSH; MAKALA, RAGHUVEER S.; SONDHI, KARTIK
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 064420/0268 →
Continuity (1)
Related Publication 20250008729A1 · Jan 2, 2025
References Cited (52)
US 9805805B1 · Zhang · 2017 [cited by examiner]
US 9824966B1 · Kanakamedala · 2017 [cited by examiner]
US 10629616B1 · Kai et al. · 2020 [cited by applicant]
US 10720445B1 · Shimizu et al. · 2020 [cited by applicant]
US 11195781B2 · Okina et al. · 2021 [cited by applicant]
US 11195857B2 · Kai et al. · 2021 [cited by applicant]
US 11201107B2 · Okina et al. · 2021 [cited by applicant]
US 11355486B2 · Mizutani et al. · 2022 [cited by applicant]
US 11393836B2 · Tsutsumi et al. · 2022 [cited by applicant]
US 11482539B2 · Sharangpani et al. · 2022 [cited by applicant]
US 11508711B2 · Ninomiya et al. · 2022 [cited by applicant]
US 11631690B2 · Okina et al. · 2023 [cited by applicant]
US 11676954B2 · Rabkin et al. · 2023 [cited by applicant]
US 20200258817A1 · Okina et al. · 2020 [cited by applicant]
US 20210035965A1 · Mizutani et al. · 2021 [cited by applicant]
US 20210035999A1 · Nishikawa · 2021 [cited by examiner]
US 20210091063A1 · Ninomiya et al. · 2021 [cited by applicant]
US 20220130853A1 · Sharangpani et al. · 2022 [cited by applicant]
US 20220157841A1 · Tsutsumi et al. · 2022 [cited by applicant]
US 20220157842A1 · Tsutsumi et al. · 2022 [cited by applicant]
US 20220189984A1 · Okina · 2022 [cited by applicant]
US 20220208748A1 · Rabkin et al. · 2022 [cited by applicant]
US 20220302149A1 · Zhang et al. · 2022 [cited by applicant]
US 20220302150A1 · Zhang et al. · 2022 [cited by applicant]
US 20230422523A1 · Kim · 2023 [cited by examiner]
IPRP-WO—Notification Concerning Transmittal of International Preliminary Report on Patentability and Written Opinion of the International Searching Authority for International Patent Application No. PCT/US2024/011861, m… [cited by applicant]
Arkles, B. et al., “Synthesis and Exploratory Deposition Studies of Isotetrasilane and Reactive Intermediates for Epitaxial Silicon,” [cited by applicant]
Loh, T.H. et al., “Ultrathin low temperature SiGe buffer for the growth of high quality Ge epilayer on Si(100) by ultrahigh vacuum chemical vapor deposition,” [cited by applicant]
U.S. Appl. No. 17/232,209, filed Apr. 16, 2021, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/577,533, filed Jan. 18, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/655,272, filed Mar. 17, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/659,057, filed Apr. 13, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/661,783, filed May 3, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/662,926, filed May 11, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/684,975, filed Mar. 2, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/806,406, filed Jun. 10, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/806,415, filed Jun. 10, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 17/931,362, filed Sep. 12, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 18/158,783, filed Jan. 24, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/379,805, filed Oct. 17, 2022, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/480,132, filed Jan. 17, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/483,339, filed Feb. 6, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/487,097, filed Feb. 27, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/492,573, filed Mar. 28, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/492,576, filed Mar. 28, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/496,653, filed Apr. 17, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/496,660, filed Apr. 17, 2023, SanDisk Technologies LLC. [cited by applicant]
U.S. Appl. No. 63/504,915, filed May 30, 2023, Western Digital Technologies, Inc. [cited by applicant]
U.S. Appl. No. 63/508,386, filed Jun. 15, 2023, Western Digital Technologies, Inc. [cited by applicant]
ISR—Notification of Transmittal of The International Search Report and Written Opinion of the International Searching Authority for International Patent Application No. PCT/US2022/011861, mailed May 16, 2024, 11 pages. [cited by applicant]
Sondhi, K. et al., “Three-Dimensional Memory Device Including Backside Semiconductor Source Structure And Methods For Forming The Same,” U.S. Appl. No. 18/343,118, filed Jun. 28, 2023. [cited by applicant]
Sharangpani, R. et al., “Memory Device Including Aluminum Nitride Diffusion Barrier Layer And Methods For Forming The Same,” U.S. Appl. No. 18/344,227, filed Jun. 29, 2023. [cited by applicant]