IP Library › Assignment 010579/0674
Patent Assignment
Reel/Frame 010579/0674

Assignment of Assignor's Interest

Recorded: 2000-02-09 Pages: 8
Assignor
RODEL, INC.
Executed: 1999-12-06
Assignee
RODEL HOLDINGS, INC.
SUITE 1300, 1105 NORTH MARKET STREET, WILMINGTON, DELAWARE, 19899
Covered Properties (36)
Silica Sol Compositions for Polishing Silicon Wafers
Patent: 4,462,188 →
Application: 06/390,726 →
Substrate Containing Fibers or Predetermined Orientation and Process of Making the Same
Patent: 4,728,552 →
Application: 06/628,354 →
Aqueous Silica Compositions for Polishing Silicon Wafers
Patent: 4,588,421 →
Application: 06/736,056 →
Pad Material for Grinding, Lapping and Polishing
Patent: 4,927,432 →
Application: 06/843,881 →
Concentrated Lapping Slurries
Patent: 4,752,628 →
Application: 07/050,840 →
Lapping Slurry Compositions with Improved Lap Rate
Patent: 4,867,757 →
Application: 07/242,231 →
Inverted Cell Pad Material for Grinding, Lapping, Shaping and Polishing
Patent: 4,841,680 →
Application: 07/248,335 →
Cleaning of Silicon Wafers with an Aqueous Solution of Koh and a Nitrogen-Containing Compound
Patent: 4,964,919 →
Application: 07/291,129 →
Apparatus for Interlayer Planarization of Semiconductor Material
Patent: 5,257,478 →
Application: 07/829,736 →
Compositions and Methods for Polishing and Planarizing Surfaces
Patent: 5,264,010 →
Application: 07/874,654 →
Low Sodium, Low Metals Silica Polishing Slurries
Patent: 5,230,833 →
Application: 07/932,284 →
Polishing Apparatus and Method Using a Rotary Work Holder Travelling Down a Rail for Polshing a Workpiece with Linear Pads
Patent: 5,487,697 →
Application: 08/015,609 →
0XIDE Particles and Method for Producing Them
Patent: 5,389,352 →
Application: 08/095,749 →
Activated Polishing Compositions
Patent: 5,382,272 →
Application: 08/116,322 →
Polishing Pads and Methods for Their Use
Patent: 5,489,233 →
Application: 08/224,768 →
A Composition for Reducing or Eliminating Static Charg in Adhesive Film
Patent: 5,534,053 →
Application: 08/264,289 →
Polymeric Polishing Pad Containing Hollow Polymeric Microelements
Patent: 5,578,362 →
Application: 08/274,134 →
Activated Polishing Compositions
Patent: 5,480,476 →
Application: 08/301,558 →
Polishing Pads and Methods for Their Use
Patent: 5,605,760 →
Application: 08/517,578 →
Polishing Slurries Comprising Two Abrasive Components and Method for Their Use
Patent: 5,693,239 →
Application: 08/541,898 →
Compositions and Methods for Polishing Silica, Silicates, and Silicon Nitride
Patent: 5,769,689 →
Application: 08/608,287 →
Polishing Silicon Wafers with Improved Polishing Slurries
Patent: 5,860,848 →
Application: 08/758,064 →
Methods for Using Polishing Pads
Patent: 6,017,265 →
Application: 08/782,717 →
Composition and Method for Polishing a Composite of Silica and Silicon Nitride
Patent: 5,738,800 →
Application: 08/802,829 →
Method of Making Polishing Pads
Patent: 6,106,754 →
Application: 08/814,514 →
Composition and Method for Polishing a Composite Comprising Titanium
Patent: 5,756,398 →
Application: 08/819,236 →
Method for Polishing a Composite Comprising an Insulator, a Metal, and Titanium
Patent: 6,001,269 →
Application: 08/859,132 →
Composition and Method for Polishing a Composite Comprising Titanium
Patent: 5,770,103 →
Application: 08/889,338 →
Apparatus and Methods for Recirculating Chemical-Mechanical Polishing of Semiconductor Wafers
Patent: 5,932,486 →
Application: 08/912,144 →
Method for Photoelectrochemical Polishing of Silicon Wafers
Patent: 6,074,546 →
Application: 08/915,775 →
Method for Planarizing a Semiconductor Device Surface with Polymeric Pad Containing Hollow Polymeric Microelements
Patent: 5,900,164 →
Application: 08/954,979 →
Polymeric Polishing Pad Having Photolithographically Induced Surface Patterns(S) and Methods Relating Thereto
Patent: 6,036,579 →
Application: 09/005,708 →
Polishing Pad and Methods Relating Thereto
Patent: 6,022,264 →
Application: 09/021,437 →
Composition for Polishing a Composite of Silica and Silicon Nitride
Patent: 6,042,741 →
Application: 09/037,668 →
Polishing System Having a Multi-Phase Polishing Substrate and Methods Relating Thereto
Patent: 6,099,394 →
Application: 09/049,864 →
Composition and Method for Polishing a Composite of Silica and Silicon Nitride
Patent: 6,132,637 →
Application: 09/071,566 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. May 18, 1984
From: PAYNE, CHARLES C.
To: NALCO CHEMICAL COMPANY OAK BROOK ILLINOIS A CORP OF DE
Reel/Frame 004256/0088 →
Assignment of Assignors Interest. May 20, 1985
From: PAYNE, CHARLES C.
To: NALCO CHEMICAL COMPANY
Reel/Frame 004406/0854 →
Assignment of Assignors Interest. Jun 2, 1986
From: BUDINGER, WILLIAM D.; JENSEN, ELMER W.
To: RODEL, INC., A CORP. OF DE.
Reel/Frame 004581/0324 →
Assignment of Assignors Interest. Sep 9, 1988
From: PAYNE, CHARLES C.
To: NALCO CHEMICAL COMPANY, NAPERVILLE, ILLINOIS, A DELAWARE CORP
Reel/Frame 004934/0612 →
Assignment of Assignors Interest. Dec 27, 1988
From: PAYNE, CHARLES C.
To: NALCO CHEMICAL COMPANY, A DE. CORP.
Reel/Frame 005011/0473 →
Assignment of Assignors Interest. Apr 27, 1992
From: BRANCALEONI, GREGORY; JENSEN, ELMER W.; ROBERTS, JOHN V.H.
To: RODEL, INC. A CORPORATION OF DE
Reel/Frame 006117/0188 →
Assignment of Assignors Interest. Feb 9, 1993
From: JENSEN, ELMER W.
To: RODEL, INC.
Reel/Frame 006436/0149 →
Assignment of Assignors Interest. Apr 14, 1993
From: ROBERTS, JOHN V. H.
To: RODEL, INC.
Reel/Frame 006485/0627 →
Assignment of Assignors Interest. Apr 14, 1993
From: HYDE, THOMAS C.
To: WESTECH SYSTEMS, INC.
Reel/Frame 006485/0631 →
Assignor Assigns to Said Assignee an Undivided 50% of Its Entire Interest. Apr 15, 1993
From: RODEL, INC.
To: 50% TO: WESTECH SYSTEMS, INC.
Reel/Frame 006485/0485 →
Assignment of Assignor's Interest Jul 21, 1993
From: WANG, JIUN-FANG
To: RODEL, INC.
Reel/Frame 006640/0257 →
Assignment of Assignor's Interest Sep 3, 1993
From: COOK, LEE MELBOURNE; LONCKI, SCOTT B.; BRANCALEONI, GREGORY
To: RODEL, INC.
Reel/Frame 006686/0735 →
Assignment of Assignor's Interest Apr 8, 1994
From: COOK, LEE MELBOURNE; ROBERTS, JOHN V. H.; JENKINS, CHARLES WILLIAM; PILLAI, RAJ RAGHAV
To: RODEL, INC.
Reel/Frame 006972/0201 →
Assignment of Assignor's Interest Jun 23, 1994
From: GRATTAN, DAVID A.; PAYNE, CHARLES C.
To: NALCO CHEMICAL COMPANY
Reel/Frame 007055/0457 →
Assignment of Assignor's Interest Sep 30, 1994
From: NALCO CHEMICAL COMPANY
To: RODEL, INC.
Reel/Frame 007153/0152 →
Assignment of Assignor's Interest Jan 12, 1995
From: NALCO CHEMICAL COMPANY A DELAWARE CORPORATION
To: RODEL, INC., A DELAWARE CORPORATION
Reel/Frame 007304/0027 →
Assignment of Assignor's Interest Aug 21, 1995
From: ROBERTS, JOHN V.H.
To: RODEL, INC.
Reel/Frame 007658/0024 →
Assignment of Assignor's Interest Oct 10, 1995
From: WANG, JIUN-FANG; SETHURAMAN, ANANTHA; WANG, HUEY-MING; COOK, LEE MELBOURNE
To: RODEL, INC.
Reel/Frame 007716/0055 →
Assignment of Assignor's Interest Feb 28, 1996
From: COSSABOON, DAVID; WANG, JIUN-FANG; COOK, LEE MELBOURNE
To: RODEL, INC.
Reel/Frame 007901/0849 →
Security Agreement Jun 21, 1996
From: IPEC PLANAR PHOENIX, INC.
To: FIRST INTERSTATE BANK OF ARIZONA, N.A., AS AGENT UNDER LOAN AGREEMENT DATED 4/24/96
Reel/Frame 008000/0343 →
Assignment of Assignor's Interest Feb 19, 1997
From: HOSALI, SHARATH D.; SETHURAMAN, ANANTHA R.; WANG, JIUN-FANG; COOK. LEE MELBOURNE
To: RODEL, INC.
Reel/Frame 008448/0032 →
Release of Security Agreement Feb 4, 1999
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT, FORMERLY FIRST INTERSTATE BANK OF ARIZONA, N.A.
To: IPEC PLANAR, INC.
Reel/Frame 009737/0563 →
Assignment of Assignor's Interest Jun 14, 2002
From: SPEEDFAM-IPEC, INC.
To: RODEL, INC.
Reel/Frame 013011/0913 →
Assignment of Assignor's Interest Dec 18, 2003
From: RODEL, INC.
To: RODEL HOLDINGS, INC.
Reel/Frame 014201/0762 →
Change of Name Jan 9, 2004
From: WESTECH SYSTEMS, INC.
To: IPEC PLANAR PHOENIX, INC.
Reel/Frame 014242/0494 →