Patent Assignment
Reel/Frame 011170/0223
Assignment of Assignor's Interest
Recorded: 2000-10-16
Pages: 3
Assignor
AGILENT TECHNOLOGIES, INC.
Executed: 2000-09-06
Assignee
LUMILEDS LIGHTING, U.S., LLC
370 W. TRIMBLE ROAD, M/S 91UK, SAN JOSE, CALIFORNIA, 95131
Covered Properties
(53)
Electro-Optical Device with Inverted Transparent Substrate and Method for Making Same
Patent:
4,912,532 →
Application:
07/237,797 →
High Band-Gap Opto-Electronic Device
Patent:
5,060,028 →
Application:
07/300,003 →
Low Stress Light-Emitting Diode Mounting Package
Patent:
4,920,404 →
Application:
07/351,194 →
High Efficiency Lamp or Light Accepter
Patent:
5,055,892 →
Application:
07/399,832 →
Nonimaging Light Source
Patent:
4,964,025 →
Application:
07/429,973 →
Light-Emitting Diode with an Electrically Conductive Window
Patent:
5,008,718 →
Application:
07/452,800 →
Electro-Optical Device with Inverted Transparent Substrate and Method for Making Same
Patent:
5,115,286 →
Application:
07/663,056 →
Light-Emitting Diode with Diagonal Faces
Patent:
5,087,949 →
Application:
07/666,467 →
Diffusion Control of P-N Junction Location in Multilayer Heterostructure Light Emitting Devices
Patent:
5,164,798 →
Application:
07/726,319 →
Method of Making a High Band-Gap Opto-Electronic Device
Patent:
5,204,284 →
Application:
07/744,569 →
Light-Emitting Diode with a Thick Transparent Layer
Patent:
5,233,204 →
Application:
07/819,542 →
Diffusion Control of P-N Junction Location in Multilayer Heterostructure Light Emitting Devices
Patent:
5,344,791 →
Application:
07/928,841 →
Wafer Bonding of Light Emitting Diode Layers
Patent:
5,376,580 →
Application:
08/036,532 →
Multiple Light Emitting Diode Module
Patent:
5,404,282 →
Application:
08/293,110 →
Moldable Nesting Frame for Light Emitting Diode Array
Patent:
5,519,596 →
Application:
08/442,724 →
Wafer Bonding of Light Emitting Diode Layers
Patent:
5,502,316 →
Application:
08/542,210 →
Peripheral Optical Element for Redirecting Light from an Led
Patent:
5,592,578 →
Application:
08/548,309 →
Highly Reflective Contacts for Light Emitting Semiconductor Devices
Patent:
5,917,202 →
Application:
08/576,251 →
Ordered Interface Texturing for a Light Emitting Device
Patent:
5,779,924 →
Application:
08/620,518 →
Maximizing Electrical Doping While Reducing Material Cracking in Iii-V Nitride Semiconductor Devices
Patent:
5,729,029 →
Application:
08/709,355 →
Method for Bonding Compound Semiconductor Wafers to Create an Ohmic Interface
Patent:
5,661,316 →
Application:
08/718,223 →
Minority Carrier Semiconductor Devices with Improved Stability
Patent:
5,909,051 →
Application:
08/802,183 →
Method for Bonding Compounds Semiconductor Wafers to Create an Ohmic Interface
Patent:
5,783,477 →
Application:
08/835,948 →
Low Voltage-Drop Electrical Contact for Gallium (Aluminum, Indium) Nitride
Patent:
6,100,586 →
Application:
08/862,461 →
Light Extraction from a Semiconductor Light-Emitting Device via Chip Shaping
Patent:
6,229,160 →
Application:
08/868,009 →
Transparent Substrate Light Emitting Diodes with Directed Light Output
Patent:
5,793,062 →
Application:
08/962,944 →
Bi-Level Injection Molded Leadframe
Patent:
5,909,037 →
Application:
09/005,908 →
Gan Leds with Improved Output Coupling Efficiency
Patent:
6,091,085 →
Application:
09/026,465 →
Transparent Substrate Light Emitting Diodes with Directed Light Output
Patent:
6,015,719 →
Application:
09/066,089 →
Using Mg-Doped Gan Transition Layers in Ohmic Contacts
Application:
09/092,065 →
Strain Engineered and Impurity Controlled 111-V Nitride Semiconductor Films and Optoelectronic Devices
Patent:
6,194,742 →
Application:
09/092,478 →
Aigainp Light Emitting Devices with Thin Active Layers
Application:
09/122,568 →
Publication:
US 2001/0020703
Light Emitting Diode Assembly Having Integrated Electrostatic Discharge Protection
Patent:
5,914,501 →
Application:
09/141,389 →
Multiple Encapsulation of Phosphor-Led Devices
Patent:
5,959,316 →
Application:
09/144,744 →
Light Emitting Device Having a Finely-Patterned Reflective Contact
Patent:
6,291,839 →
Application:
09/151,554 →
Minority Carrier Semiconductor Devices with Improved Reliabilty
High Stability Optical Encapsulation and Packaging for Light-Emitting Diodes in the Green, Blue, and Near Uv Range
Patent:
6,204,523 →
Application:
09/187,357 →
Surface Mountable Led Package
Patent:
6,274,924 →
Application:
09/187,547 →
Advanced Semiconductor Devices Fabricated with Passivated High Aluminum Content Iii-V Materials
Patent:
6,201,264 →
Application:
09/231,411 →
Light Emitting Devices Having Wafer Bonded Aluminum Gallium Indium Nitride Structures and Mirror Stacks
Patent:
6,320,206 →
Application:
09/245,435 →
Thickness Tailoring of Wafer Bonded Alxgayinzn Structures by Laser Melting
Patent:
6,280,523 →
Application:
09/245,448 →
Inxalygazn Optical Emitters Fabricated via Substrate Removal
Application:
09/245,503 →
Publication:
US 2001/0042866
Red-Deficiency-Compensating Phosphor Led
Patent:
6,351,069 →
Application:
09/252,207 →
Advanced Semiconductor Devices Fabricated with Passivated High Aluminum Content Iii-V Materials
Patent:
6,048,748 →
Application:
09/293,277 →
Diffusion Barrier for Increased Mirror Reflectivity in Reflective Solderable Contacts on High Power Led Chip
Patent:
6,222,207 →
Application:
09/317,647 →
Method of Forming Transparent Contacts to a P-Type Gan Layer
Patent:
6,287,947 →
Application:
09/327,948 →
Aigainn-Based Led Having Thick Epitaxial Layer for Improved Light Extraction
Patent:
6,133,589 →
Application:
09/328,870 →
Non-Incandescent Lightbulb Package Using Light Emitting Diodes
Patent:
6,504,301 →
Application:
09/390,006 →
Thin Film Phosphor-Converted Light Emitting Diode Device
Tri-Color, White Light Led Lamps
Patent:
6,686,691 →
Application:
09/405,947 →
Light Emitting Diode (Led) Device That Produces White Light by Performing Phosphor Conversion on All of the Primary Radiation Emitted by the Light Emitting Structure of the Led Device
Application:
09/407,228 →
Semiconductor Devices with Selectively Doped Iii-V Nitride Layers
Light Emitting Device Having a Finely-Patterned Reflective Contact
Patent:
6,258,618 →
Application:
09/483,293 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Aug 26, 1988
From: COOK, LOUIS W.; CAMRAS, MICHAEL D.
To: HEWLETT-PACKARD COMPANY, A CORP. OF CA
Reel/Frame 004961/0743 →
Assignment of Assignors Interest.
Jan 19, 1989
From: KUO, CHIH-PING; FLETCHER, ROBERT M.; OSENTOWSKI, TIMOTHY D.
To: HEWLETT-PACKARD COMPANY, PALO ALTO, CA., A CA CORP.
Reel/Frame 005037/0245 →
Assignment of Assignors Interest.
May 12, 1989
From: SHRIMALI, DINESH C.; STERANKA, FRANK M.; MC LEOD, CHERYL L.
To: HEWLETT-PACKARD COMPANY, A CORP. OF CA
Reel/Frame 005076/0384 →
Assignment of Assignors Interest.
Aug 29, 1989
From: GARDNER, ROBERT C.; SMITH, GEORGE E.; MCLEOD, CHERYL L.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 005116/0972 →
Assignment of Assignors Interest.
Jan 16, 1990
From: GARDNER, ROBERT C.; SMITH, GEORGE E.; MCLEOD, CHERYL L.; SMESTAD, GREG P.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 005214/0242 →
Assignment of Assignors Interest.
Jul 13, 1990
From: SMITH, GEORGE E.
To: HEWLETT-PACKARD COMPANY, A CA CORP.
Reel/Frame 005360/0515 →
Assignment of Assignors Interest.
Oct 22, 1990
From: FLETCHER, ROBERT M.; KUO, CHIHPING; OSENTOWSKI, TIMOTHY D.; ROBBINS, VIRGINIA M.
To: HEWLETT-PACKARD COMPANY, A CORP OF CA
Reel/Frame 005481/0455 →
Assignment of Assignors Interest.
Sep 27, 1991
From: HUAN, KUO-HSIN
To: HEWLETT-PACKARD COMPANY, A CORP. OF CA
Reel/Frame 005852/0784 →
Assignment of Assignors Interest.
Jan 11, 1993
From: FLETCHER, ROBERT M.; HUANG, KUO-HSIN; KUO, CHIHPING; YU, JIANN
To: HEWLETT-PACKARD COMPANY
Reel/Frame 006393/0622 →
Assignment of Assignor's Interest
Jun 18, 1993
From: KISH, FRED A.; STERANKA, FRANK M.; DEFEVERE, DENNIS C.; ROBBINS, VIRGINIA M.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 006579/0550 →
Assignment of Assignor's Interest
Oct 23, 1995
From: WOOLVERTON, DOUGLAS PETER
To: HEWLETT-PACKARD COMPANY
Reel/Frame 007707/0484 →
Assignment of Assignor's Interest
Dec 27, 1995
From: RUH, RICHARD A.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 007756/0849 →
Assignment of Assignor's Interest
Mar 18, 1996
From: HAITZ, ROLAND H.; KISH, FRED A., JR.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 007997/0184 →
Assignment of Assignor's Interest
Jul 29, 1996
From: KRAMES, MICHAEL R.; KISH, FRED A. JR.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 008063/0913 →
Assignment of Assignor's Interest
Nov 22, 1996
From: RUDAZ, SERGE L.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 008236/0359 →
Assignment of Assignor's Interest
Aug 19, 1997
From: KRAMES, MICHAEL R.; KISH, FRED A., JR.; TAN, TUN S.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 008656/0077 →
Assignment of Assignor's Interest
Oct 9, 1997
From: CHEN, YONG; YANG, LONG; WANG, SHIH-YUAN; SCHNEIDER, RICHARD P.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 008741/0935 →
Change of Name
Mar 20, 2000
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD COMPANY, A CORP. OF DELAWARE
Reel/Frame 010668/0728 →
Merger
Apr 24, 2000
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD COMPANY
Reel/Frame 010759/0049 →
Merger
Apr 28, 2000
From: HEWLETT-PACKARD COMPANY, A CALIFORNIA CORPORATION
To: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
Reel/Frame 010841/0649 →
Assignment of Assignor's Interest
May 30, 2000
From: HEWLETT-PACKARD COMPANY
To: AGILENT TECHNOLOGIES INC
Reel/Frame 010977/0540 →
Assignment of Assignor's Interest
Jun 15, 2000
From: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
To: AGILENT TECHNOLOGIES INC.
Reel/Frame 010901/0336 →
Assignment of Assignor's Interest
Dec 31, 2001
From: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 012381/0616 →
Assignment of Assignor's Interest
Jan 24, 2011
From: LUMILEDS LIGHTING COMPANY LLC
To: KONINKLIJKE PHILIPS ELECTRONICS N V; LUMILEDS LIGHTING COMPANY
Reel/Frame 025681/0852 →
Change of Name
Feb 15, 2011
From: LUMILEDS LIGHTING U.S., LLC; LUMILEDS LIGHTING, U.S., LLC; LUMILEDS LIGHTING, U.S. LLC; LUMILEDS LIGHTING U.S. LLC
To: PHILIPS LUMILEDS LIGHTING COMPANY LLC
Reel/Frame 025850/0770 →