Patent Assignment
Reel/Frame 020036/0851
Intellectual Property Rights Security Agreement (Second Lien)
Recorded: 2007-10-30
Received: 2007-10-30
Pages: 10
Assignor
H.C. STARCK INC.
Executed: 2007-10-26
Assignee
DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT
ATTENTION: ERICA SKOELD, 6A, ROUTE DE TREVES, SENNINGERBERG, LUX, L-2633, LUXEMBOURG
Covered Properties
(34)
Refractory Metal Substrate with Improved Thermal Conductivity
Application:
11/742,607 →
Molybdenum Tubular Sputtering Targets with Uniform Grain Size and Texture
Application:
11/574,469 →
Magnesium Removal From Magnesium Reduced Metal Powders
Application:
11/576,320 →
Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film,and Thin Film Based Devices and Products Made Therefrom
Application:
60/915,967 →
Refractory Metal Pots
Application:
10/593,620 →
Method of joining tantalum clad steel structures
Application:
11/638,625 →
Production of valve metal powders with improved physical and electrical properties
Application:
11/629,540 →
Process for producing a rotary anode and the anode produced by such process
Application:
11/542,268 →
Capacitor-grade lead wires with increased tensile strength and hardness
Application:
11/388,107 →
Method of Preparing Primary Refractory Metal
PCT:
PCTUS2006009174 ↗
Molybdenum alloy x-ray targets having uniform grain structure
Application:
10/553,841 →
Refractory metal annealing bands
Application:
10/543,579 →
Pre-Plating Surface Treatments for Enhanced Galvanic-Corrosion Resistance
Application:
10/542,945 →
Methods of Making Molybdenum Titanium Sputtering Plates and Targets
Application:
11/255,018 →
Sputtering target, low resistivity, transparent conductive film, method for producing such film and composition for use therein
Application:
11/238,366 →
Fine grain niobium sheet via ingot metallurgy
Application:
11/216,498 →
Methods of Forming Alpha and Beta Tantalum Films with Controlled and New Microstructures
PCT:
PCTUS2005009763 ↗
Method of Preparing Primary Refractory Metal
Application:
11/085,876 →
Rejuvenation of Refractory Metal Products
Application:
11/038,890 →
Refractory Metal and Alloy Refining by Laser Forming and Melting
Application:
10/501,837 →
Refractory Metal Substrate with Improved Thermal Conductivity
Application:
10/978,940 →
Fine Grain Niobium Sheet via Ingot Metallurgy
Application:
10/974,519 →
Capacitor-Grade Lead Wires with Increased Tensile Strength and Hardness
Application:
10/498,174 →
Magnesium Removal from Magnesium Reduced Metal Powders
Application:
10/953,163 →
Molybdenum sputtering targets
Application:
10/931,203 →
Metalothermic Reduction of Refractory Metal Oxides
Application:
10/872,998 →
Thin Film Capacitor Using Conductive Polymers
Application:
10/801,324 →
Group Iii Nitride Semiconductor Laser Device
Application:
10/334,140 →
Capacitor Substrates Made of Refractory Metal Nitrides
Application:
10/321,861 →
Thin Film Capacitor Using Conductive Polymers
Application:
10/285,748 →
Refractory metal plates with uniform texture and methods of making the same
Application:
10/079,286 →
Low Oxygen Refractory Metal Powder for Powder Metallurgy
Application:
09/906,208 →
Metalothermic Reduction of Refractory Metal Oxides
Application:
09/849,717 →
Metal Powders Produced by the Reduction of the Oxides with Gaseous Magnesium
Application:
09/445,331 →