Patent Assignment
Reel/Frame 021411/0158
Assignment of Assignor's Interest
Recorded: 2008-08-20
Pages: 10
Assignor
ELM TECHNOLOGY CORPORATION
Executed: 2008-04-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, R.O.C., TAIWAN
Covered Properties
(32)
Membrane Dielectric Isolation Ic Fabrication
Patent:
5,354,695 →
Application:
07/865,412 →
Method of Making Dielectrically Isolated Integrated Circuit
Patent:
5,869,354 →
Application:
08/315,905 →
Membrane Dielectric Isolation Ic Fabrication
Patent:
5,946,559 →
Application:
08/472,426 →
Method of Forming a Circuit Membrane with a Polysilicon Film
Patent:
5,633,209 →
Application:
08/474,448 →
Method of Making a Stacked 3D Integrated Circuit Structure
Patent:
5,654,220 →
Application:
08/475,770 →
Membrane Dielectric Isolation Ic Fabrication
Patent:
5,592,018 →
Application:
08/475,796 →
Three Dimensional Semiconductor Circuit Structure with Optical Interconnection
Patent:
5,637,907 →
Application:
08/477,785 →
A Contact Stepper Printed Lithography Method
Patent:
5,580,687 →
Application:
08/478,476 →
Lithography Device for Semiconductor Curcuit Pattern Generation
Patent:
6,714,625 →
Application:
08/483,731 →
Membrane Dielectric Isolation Transistor Fabrication
Patent:
5,592,007 →
Application:
08/484,029 →
Method of Forming a Multi-Chip Module from a Membrane Circuit
Patent:
5,834,334 →
Application:
08/484,144 →
Electro-Magnetic Lithographic Alignment Method
Patent:
6,294,909 →
Application:
08/488,380 →
Membrane Dielectric Isolation Ic Fabrication
Patent:
6,020,257 →
Application:
08/779,679 →
Membrane Dielectric Isolation Ic Fabrication
Patent:
5,840,593 →
Application:
08/813,439 →
High Density Three-Dimensional Ic Interconnection
Patent:
5,985,693 →
Application:
08/850,749 →
Membrane Dielectric Isolation Ic Fabrication
Patent:
6,008,126 →
Application:
09/028,081 →
Stress Controlled Dielectric Integrated Circuit Fabrication
Membrane 3D Ic Fabrication
Stress Controlled Dielectric Integrated Circuit Fabrication
Lithography Device for Semiconductor Circuit Pattern Generator
Stress-Controlled Dielectric Integrated Circuit
Stress-Controlled Dielectric Integrated Circuit
Methodof Making an Integrated Circuit
Membrane Ic Fabrication
Membrane 3D Ic Fabrication
Membrane 3D Ic Fabrication
Membrane 3D Ic Fabrication
Methods for Maskless Lithography
Apparatus and Methods for Maskless Pattern Generation
Flexible and Elastic Dielectric Integrated Circuit
Lithography Device for Semiconductor Circuit Pattern Generation
Flexible and Elastic Dielectric Integrated Circuit
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 1995
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION ( A CALIFORNIA CORP.)
Reel/Frame 007470/0232 →
Assignment of Assignor's Interest
Dec 18, 1996
From: LEEDY, GLENN
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008282/0522 →
Assignment of Assignor's Interest
Dec 18, 1996
From: LEEDY, GLENN
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008282/0551 →
Assignment of Assignor's Interest
Dec 18, 1996
From: LEEDY, GLENN
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008282/0533 →
Assignment of Assignor's Interest
Jan 10, 1997
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008461/0131 →
Assignment of Assignor's Interest
Jan 27, 1997
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATIONB
Reel/Frame 008328/0321 →
Assignment of Assignor's Interest
Jan 27, 1997
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008328/0327 →
Assignment of Assignor's Interest
Feb 6, 1998
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 008964/0585 →
Assignment of Assignor's Interest
Apr 15, 1998
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 009145/0247 →
Assignment of Assignor's Interest
Sep 15, 1998
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 009459/0780 →
Assignment of Assignor's Interest
Apr 28, 1999
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 009920/0900 →
Assignment of Assignor's Interest
Apr 28, 1999
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 009920/0897 →
Assignment of Assignor's Interest
May 24, 1999
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 009970/0647 →
Assignment of Assignor's Interest
Aug 27, 1999
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 010194/0824 →
Assignment of Assignor's Interest
Jul 16, 2001
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 011989/0662 →
Assignment of Assignor's Interest
May 26, 2003
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 014106/0280 →
Assignment of Assignor's Interest
Jun 2, 2003
From: LEEDY, GLENN J.
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 014126/0960 →
Assignment of Assignor's Interest
Sep 24, 2004
From: LEEDY, GLENN
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 015815/0978 →
Assignment of Assignor's Interest
Sep 27, 2004
From: LEEDY, GLENN
To: ELM TECHNOLOGY CORPORATION
Reel/Frame 015818/0552 →