Patent Assignment
Reel/Frame 024383/0545
Assignment of Assignor's Interest
Recorded: 2010-05-13
Pages: 5
Assignors
PAGAILA, REZA A.
Executed: 2010-05-13
LIN, YAOJIAN
Executed: 2010-05-13
KOO, JUN MO
Executed: 2010-05-13
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 8, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038388/0036 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 38388 Frame: 0036
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064789/0885 →
Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 064789 Frame: 0885. Assignor(S) Hereby Confirms the Corrective Assignment.
Sep 7, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064836/0363 →
Corrective Assignment to Correct a Typographical Error on the Cover Sheet Previously Recorded at Reel: 038388 Frame: 0036. Assignor(S) Hereby Confirms the Change of Name.
Sep 7, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064834/0911 →