IP Library › Assignment 024592/0020
Patent Assignment
Reel/Frame 024592/0020

Change of Name

Recorded: 2010-06-24 Pages: 4
Assignor
INTEGRATED SYSTEM SOLUTION CORP
Executed: 2010-06-10
Assignee
ISSC TECHNOLOGIES CORP.
4F, NO. 8, DUSING RD., HSINCHU SCIENCE PARK, HSINCHU CITY, TAIWAN, CHINA
Covered Properties (7)
Galois Field Computation
Patent: 7,668,895 →
Application: 11/000,013 →
Publication: US 2006/0117079
Device and Method for Providing Dc-Offset Estimation
Patent: 7,496,341 →
Application: 11/089,075 →
Publication: US 2006/0217069
Methods and Apparatus for Circulation Transmissions for Ofdm-Based Mimo Systems
Patent: 7,593,472 →
Application: 11/244,607 →
Publication: US 2006/0088114
System and Method for Providing 3-Dimensional Joint Interleaver and Circulation Transmissions
Patent: 7,773,680 →
Application: 11/254,359 →
Publication: US 2006/0088115
Adaptive Quantization Method and Apparatus for an Ofdm Receiver
Patent: 7,756,222 →
Application: 11/381,625 →
Publication: US 2007/0258531
Adaptive Receivers
Patent: 8,140,038 →
Application: 12/579,306 →
Publication: US 2011/0086606
Receivers and Symbol Decoders Thereof
Patent: 8,259,862 →
Application: 12/637,388 →
Publication: US 2011/0142173
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2004
From: LIN, HUASHIH; WELCH, LLOYD; LU, HSIAO-FENG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016041/0967 →
Assignment of Assignor's Interest May 6, 2005
From: CHEN, WEI-HONG; LIN, HUASHIH; PENG, WEI-CHUNG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 015978/0362 →
Assignment of Assignor's Interest Nov 2, 2005
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016721/0729 →
Assignment of Assignor's Interest May 30, 2006
From: WINBOND ELECTRONICS CORP.
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 017711/0367 →
Assignment of Assignor's Interest Jul 24, 2006
From: CHEN, JENG-HONG; LEE, YUMIN; LIN, YUH-CHUN
To: INTEGRATED SILICON SOLUTION CORPORATION
Reel/Frame 017981/0490 →
Assignment of Assignor's Interest Sep 26, 2006
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 018305/0882 →
Assignment of Assignor's Interest Dec 25, 2007
From: CHEN, JENG-HONG; LEE, YUMIN; LIN, YUH-CHUN
To: INTEGRATED SYSTEM SOLUTION CORPORATION
Reel/Frame 020286/0694 →
Assignment of Assignor's Interest Oct 14, 2009
From: CHEN, PENG-SEN; HO, HSIANG-TE
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 023372/0651 →
Assignment of Assignor's Interest Dec 14, 2009
From: PENG, WEI-CHUNG; CHEN, JENG-HONG; KIM, PANSOP
To: INTEGRATED SYSTEM SOLUTION CORP
Reel/Frame 023650/0399 →
Merger Sep 4, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036554/0152 →
Merger Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036562/0001 →
Merger Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036561/0944 →
Merger Sep 8, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036563/0192 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0555 →
Security Interest Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
Security Interest Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Security Interest Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
Release of Security Interest Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059333/0222 →
Release of Security Interest Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →