IP Library › Assignment 017711/0367
Patent Assignment
Reel/Frame 017711/0367

Assignment of Assignor's Interest

Recorded: 2006-05-30 Pages: 3
Assignor
WINBOND ELECTRONICS CORP.
Executed: 2006-05-26
Assignee
INTEGRATED SYSTEM SOLUTION CORP.
3F., NO. 2-1, INDUSTRY E. RD., 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Properties (12)
Packet-Based Multiplication-Free Cck Demodulator with a Fast Multipath Interference Cipher
Patent: 7,200,164 →
Application: 10/289,749 →
Publication: US 2004/0091023
Low-Complexity Joint Symbol Cck Decoder
Patent: 7,113,553 →
Application: 10/382,756 →
Publication: US 2004/0091019
[Apparatus and Method for Detecting and Compensating Current Offset]
Application: 10/708,428 →
Publication: US 2005/0141634
Digitally Controlled Tuner Circuit
Patent: 6,919,759 →
Application: 10/740,331 →
Publication: US 2005/0024151
Current-Matching Variable Gain Amplifier
Patent: 7,321,266 →
Application: 10/908,553 →
Publication: US 2006/0261893
Galois Field Computation
Patent: 7,668,895 →
Application: 11/000,013 →
Publication: US 2006/0117079
Apparatus and method to calibrate amplitude and phase imbalance for communication receivers
Application: 11/013,360 →
Publication: US 2006/0133548
Device and Method for Providing Dc-Offset Estimation
Patent: 7,496,341 →
Application: 11/089,075 →
Publication: US 2006/0217069
Differential Amplifier and Low Drop-Out Regulator with Thereof
Patent: 7,173,401 →
Application: 11/195,263 →
Publication: US 2007/0024350
Methods and Apparatus for Circulation Transmissions for Ofdm-Based Mimo Systems
Patent: 7,593,472 →
Application: 11/244,607 →
Publication: US 2006/0088114
System and Method for Providing 3-Dimensional Joint Interleaver and Circulation Transmissions
Patent: 7,773,680 →
Application: 11/254,359 →
Publication: US 2006/0088115
Hybrid Dc-Offset Reduction Method and System for Direct Conversion Receiver
Patent: 7,933,361 →
Application: 11/399,127 →
Publication: US 2007/0237264
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2003
From: CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 014821/0754 →
Assignment of Assignor's Interest Mar 2, 2004
From: LIN, ANG-SHENG
To: WINBOND ELECTRONICS CORP.
Reel/Frame 014383/0442 →
Assignment of Assignor's Interest Dec 1, 2004
From: LIN, HUASHIH; WELCH, LLOYD; LU, HSIAO-FENG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016041/0967 →
Assignment of Assignor's Interest May 6, 2005
From: CHEN, WEI-HONG; LIN, HUASHIH; PENG, WEI-CHUNG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 015978/0362 →
Assignment of Assignor's Interest May 17, 2005
From: CHIANG, MING-CHOU
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016020/0461 →
Assignment of Assignor's Interest May 25, 2005
From: OH, JOUNGHEON; LIN, YUH-CHUN; WU, CHIA-EN
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016058/0601 →
Assignment of Assignor's Interest Aug 1, 2005
From: HUANG, CHUN-SHENG
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016861/0727 →
Assignment of Assignor's Interest Nov 2, 2005
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016721/0729 →
Assignment of Assignor's Interest Apr 5, 2006
From: HUANG, KUANG-HU; PENG, WEI-CHUNG; CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORP.
Reel/Frame 017739/0352 →
Assignment of Assignor's Interest Sep 26, 2006
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 018305/0882 →
Change of Name Jun 24, 2010
From: INTEGRATED SYSTEM SOLUTION CORP
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024592/0020 →
Change of Name Jul 13, 2010
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024675/0495 →
Change of Name Oct 7, 2011
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 027029/0240 →
Assignment of Assignor's Interest Sep 4, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036554/0001 →
Merger Sep 4, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036554/0052 →
Merger Sep 4, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036554/0152 →
Merger Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036561/0944 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
Security Interest Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
Security Interest Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →